• Journal of the Korean Society for Precision Engineering
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• v.7 no.2
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• pp.47-57
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• 1990

In-process recognition of the cutting states is one of the very important technologies to increase the reliability of mordern machining process. In this study, practical methods which use the dynamic component of the cutting force are proposed to recognize cutting states (i.e. chip formation, tool wear, surface roughness) in turning process. The signal processing method developed in this study is efficient to measure the maximum amplitude of the dynamic component of cutting force which is closely related to the chip breaking (cut-off frequency : 80-500 Hz) and the approximately natural frequency of cutting tool (5, 000-8, 000 Hz). It can be clarified that the monitoring of the maximum apmlitude in the dynamic component of the cutting force enables the state of chip formation which chips can be easily hancled and the inferiority state of the machined surface to be recognized. The microcomputer in-process tool wear monitor- ing system introduced in this paper can detect the determination of the time to change cutting tool.

• Journal of the Korean Society of Industry Convergence
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• v.12 no.4
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Biotechnology and Bioprocess Engineering:BBE
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• v.9 no.2
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• pp.76-85
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• 2004

Biodevices composed of biomolecular layer have been developed in various fields such as medical diagnosis, pharmaceutical screening, electronic device, photonic device, environmental pollution detection device, and etc. The biomolecules such as protein, DNA and pigment, and cells have been used to construct the biodevices such as biomolecular diode, biostorage device, bioelectroluminescence device, protein chip, DNA chip, and cell chip. Substantial interest has focused upon thin film fabrication or the formation of biomaterials mono- or multi-layers on the solid surfaces to construct the biodevices. Based on the development of nanotechnology, nanoscale fabrication technology for biofilm has been emerged and applied to biodevices due to the various advantages such as high density immobilization and orientation control of immoblized biomolecules. This review described the nanoscale fabrication of biomolecular film and its application to bioelectronic devices and biochips.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.12
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• pp.163-168
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• 2000

Once the chip has developed a mixed mode of side-curl and up-curl, it would generally curl to strike the tool flank. The development of the bending stresses and sheat in the chip would ultimately lead to chip failure. This paper approach this problem from a mechanics-based approach, by treating the chip as a 3-D elastic curved beam, and applying appropriate constraints and forces. The expressions for bending, shear and direct stresses are developed through an energy-based criterion. The location of the maximum stresses is also identified and explained for simulated test conditions.

• Proceedings of the KIEE Conference
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• 1987.07a
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• pp.481-485
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• 1987

The fabrication of a micro mass flow sensor on a silicon chip by means of micro-machining technology is described on this paper. The operation of micro mass flow sensor is based on the heat transfer from a heated chip to a fluid. The temperature differences on the chip is a measure for the flow velocity in a plane parallel with the chip surface. An anisotropic etching technigue was used for the formation of the V-type groove in this fabrication. The micro mass flow sensor is made up of two main parts ; A thin glass plate embodying the connecting parts and mass flow sensor parts in silicon chip. This sensor have a very small size and a neglible dead space. Micro mass flow sensor can fabricate on silicon chip by micro machining technology too.

• Korean Journal of Metals and Materials
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• v.50 no.10
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• pp.785-792
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• 2012

A new flip chip structure consisting of interlocking joints locally surrounded by non-conductive adhesive was investigated in order to improve the contact resistance characteristics and prevent the parasitic capacitance increase. The average contact resistance of the interlocking joints was substantially reduced from $135m{\Omega}$ to $79m{\Omega}$ by increasing the flip chip bonding pressure from 85 MPa to 185 MPa. Improvement of the contact resistance characteristics at higher bonding pressure was attributed not only to the increased contact area between Cu chip bumps and Sn pads, but also to the severe plastic deformation of Sn pads caused during formation of the interlocking-joint structure. The parasitic capacitance increase due to the non-conductive adhesive locally surrounding the flip chip joints was estimated to be as small as 12.5%.

• 제어로봇시스템학회:학술대회논문집
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• 1990.10a
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• pp.811-815
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• 1990

This paper describes the method on image acquisition and image processing in the turning process. The formation of discontinuous chips during high-speed oblique cutting without lubricant was observed by means of video camera recorder and stroboscope. The image processing technique for chip flow is described and the results are presented for variable feeds. It is concluded that experimental values of chip flow angle are similar to theoretical values of Stabler's rule.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• Journal of the Korean Society for Precision Engineering
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• v.2 no.2
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• pp.69-75
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• 1985

The object of this study is to discuss the effect of cutting fluid on the mechanism of chip formation in orthogonal cutting. Rehbinder effect has been known as a phenomenon, the reduction of mechanical strength, when the metal is exposed in a polar organic environment or the surface of metal is coated with some polar organic substances. About the cause of Rehbinder effect there have been many different ideas by Rehbinder, Merchant, Shaw, Sakakida and etc. In this report, the effects of surface active medium (magic ink) upon the mechanism of chip formation on the orthogonal cutting of copper and the mechanical properties of the work material are experimentally discussed with constant rake angle. Under the condition of polar organic environment the experimental results are as follows; 1) The chip thickness becomes thinner and slip line pitch on the free surface of chip becomes smaller than that of dried cutting area. 2) The order of alternation of cutting ratio was changed. 3) The friction angle on the tool face is not affected by the depth of cut. 4) The cutting force and shear strain on the shear plane decrease remarkably, therefore the work material must be embrittled under polar organic environment.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.5
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• pp.34-39
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• 2003

The paper will present chip formation mechanism and surface integrity generation mechanism based on the systematical experimental tests. Some basic factors such as the end milling cutter tooth number, cutting forces, cutting temperature, cutting vibration the chip status, the surface roughness, the hardness distribution and the metallographic texture of the machined surface layer are involved. The chip formation mechanism is typical thermal plastic shear localization at high cutting speed with less number of shear ribbons and bigger shear angle than that at low speed, which means lack of chip deformation. The high cutting speed with much more cutting teeth will be beneficial to the reduction of cutting forces, enlarge machining stability mot depression of temperature increment anti-fatigability as well as surface roughness. The burrs always exist both at low cutting speed and at high cutting speed. So the deburring process should be arranged for milling titanium alloy in my case.