• Title/Summary/Keyword: Chip control

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Automated Protein-Expression Profiling System using Crude Protein Direct Blotting Method

  • Kobayashi, Hironori;Torikoshi, Yasuhiro;Kawasaki, Yuko;Ishihara, Hideki;Mizumoto, Hiroshi
    • 제어로봇시스템학회:학술대회논문집
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    • 2003.10a
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    • pp.2356-2361
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    • 2003
  • Proteome research in the medical field is expected to accelerate the understanding of disease mechanism, and to create new diagnostic concept. For protein profiling, this paper proposes a new methodology named CPDIB (Crude Protein Direct Blotting). In the CPDIB procedure, crude protein sample is directly immobilized on a membrane and the expression of protein molecules in the sample are analyzed quantitatively by using a special device called ImmobiChip, where the membrane is used as a field of the immune reaction. The over-all structure of the ImmobiChip is based on the conventional Slot blot device. Mechanical improvement in the air-tightness of the case holding the membrane realizes the direct blotting and results in high performance of stability in the immune reaction. In the measurement of multiple proteins, a dispensing robot is used for increasing the efficiency of handling of liquid. Cooperation of the dispensing robot with the ImmobiChip for immobilizing proteins realizes automated and stable performance of the CPDIB procedure. This paper shows the evaluation of the air-tightness of the ImmobiChip, the ability of analyzing proteins using the CPDIB procedure and the performance of the automated equipment.

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Reliability Testing and Materials Evaluation of Si Sub-Mount based LED Package (실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험)

  • Kim, Young-Pil;Ko, Seok-Cheol
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.29 no.4
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    • pp.1-10
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    • 2015
  • The light emitting diodes(LED) package of new structure is proposed to promote the reliability and lifespan by maximize heat dissipation occurred on the chip. We designed and fabricated the LED packages mixing the advantages of chip on board(COB) based on conventional metal printed circuit board(PCB) and the merits of Si sub-mount using base as a substrate. The proposed LED package samples were selected for the superior efficiency of the material through the sealant properties, chip characteristics, and phosphor properties evaluations. Reliability test was conducted the thermal shock test and flux rate according to the usage time at room temperature, high-temperature operation, high-temperature operation, high-temperature storage, low-temperature storage, high-temperature and high-humidity storage. Reliability test result, the average flux rate was maintained at 97.04% for each items. Thus, the Si sub-mount based LED package is expected to be applicable to high power down-light type LED light sources.

A Study on the Micro Pattern Fabrication of Lab-on-a-chip Mold Master using Micro EDM (Micro EDM을 이용한 Lab-on-a-chip금형의 미세 패턴 제작에 관한 연구)

  • Shin, B.C.;Kim, K.B.;Cho, M.W.;Kim, B.H.;Jung, W.C.;Heo, Y.M.
    • Transactions of Materials Processing
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    • v.20 no.1
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    • pp.17-22
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    • 2011
  • Recently, analyzing system is studying for applying to biomedical engineering field, actively. Micro fluidics control system has been manufactured using LIGA (Lithographie Galvanoformung und Abformung), Etching, Lithography and Laser etc. However, it is difficult that above-mentioned methods are applied to fabrication of precision mold master efficiently because of long processing time and rising cost of equipments. Therefore, in this study, micro EDM and micro WEDG system were developed to analyze machining characteristics with tool wear, surface roughness and process time. Then, optimal machining conditions could be obtained from the results of analysis. As the results, mold master of staggered herringbone mixer which has a high mixing efficiency, one of passive mixer of Lab-on-a-chip, could be fabricated from micro pattern(< 50um) using micro EDM successfully.

Micro-bump Joining Technology for 3 Dimensional Chip Stacking (반도체 3차원 칩 적층을 위한 미세 범프 조이닝 기술)

  • Ko, Young-Ki;Ko, Yong-Ho;Lee, Chang-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.10
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    • pp.865-871
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    • 2014
  • Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

Architecture of Multiple-Queue Manager for Input-Queued Switch Tolerating Arbitration Latency (중재 지연 내성을 가지는 입력 큐 스위치의 다중 큐 관리기 구조)

  • 정갑중;이범철
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.26 no.12C
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    • pp.261-267
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    • 2001
  • This paper presents the architecture of multiple-queue manager for input-queued switch, which has arbitration latency, and the design of the chip. The proposed architecture of multiple-queue manager provides wire-speed routing with a pipelined buffer management, and the tolerance of requests and grants data transmission latency between the input queue manager and central arbiter using a new request control method, which is based on a high-speed shifter. The multiple-input-queue manager has been implemented in a field programmable gate array chip, which provides OC-48c port speed. It enhances the maximum throughput of the input queuing switch up to 98.6% with 128-cell shared input buffer in 16$\times$16 switch size.

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Manufacturing of PAR Illumination Using COB Line Type LEDs (COB Line형 LED를 사용한 PAR 조명의 제작)

  • Youn, Gap-Suck;Yoo, Kyung-Sun;Lee, Chang-Soo;Hyun, Dong-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.24 no.4
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    • pp.448-454
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    • 2015
  • In this paper, the band structural design that is typically in a line was arranged in a ring shape, so as to configure the high power LED lighting in such a way as to form a concentrated light distribution angle of less than 15 degrees. The parabolic aluminized reflector PAR38 that facilitates design using area and the area of the optical system to the same extent, applied a multiple light-source condenser lens optical system for the control of integration. The LED used here implemented a single linear light source using ans LED module with ans LED, flip-chip chip-scale package. The optical system was designed based on the energy star standard.

New Materials Based Lab-on-a-Chip Microreactors: New Device for Chemical Process

  • Kim, Dong-Pyo
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2012.05a
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    • pp.51-51
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    • 2012
  • There is a growing interest in innovative chemical synthesis in microreactors owing to high efficiency, selectivity, and yield. In microfluidic systems, the low-volume spatial and temporal control of reactants and products offers a novel method for chemical manipulation and product generation. Glass, silicon, poly(dimethylsiloxane) (PDMS), and plastics have been used for the fabrication of miniaturized devices. However, these materials are not the best due to either of low chemical durability or expensive fabrication costs. In our group, we have recently addressed the demand for economical resistant materials that can be used for easy fabrication of microfluidic systems with reliable durability. We have suggested the use of various specialty polymers such as silicon-based inorganic polymers and fluoropolymer, flexible polyimide (PI) films that have not been used for microfluidic devices, although they have been used for other areas. And inexpensive lithography techniques were used to fabricate Lab-on-a-Chip type of microreactors with differently devised microchannel design. These microreactors were demonstrated for various synthetic reactions: liquid, liquid-gas organic chemical reactions in heterogeneous catalytic processes, syntheses of polymer and non-trivial inorganic materials. The microreactors were inert, and withstand even harsh conditions, including hydrothermal reaction. In addition, various built-in microstructures inside the microchannels, for example Pd decorated peptide nanowires, definitely enhance the uniqueness and performance of microreactors. These user-friendly Lab-on-a-Chip devices are useful alternatives for chemist and chemical engineer to conventional chemical tools such as glass.

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Development of Numerical Controller Using PC and KM 3701 Function Generator LSI (수치제어장치에 관한 연구)

  • Lee, Seung-Yeong;Park, Chan-Il
    • 한국기계연구소 소보
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    • s.15
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    • pp.105-115
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    • 1985
  • For the application of factory automation, a 3-axis numerical control system with personal computer and KM3701 function generator LSI chip, which has liner, circular, parabolic, logarithmic, and exponential interpolations, is developed. The developed system also has 2 control function to stabilize tooling speed and 1/1000mm step sizes.

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Development of Automatic Measurement and Control Method based on Single Chip Microcomputer for Tackjoo Fermentation (Single Chip Microcomputer를 이용한 탁주발효(濁酒醱酵)의 자동계측(自動計測)과 제어방법(制御方法)의 개발(開發))

  • Kim, Kyung-Man;Chun, Jae-Kun
    • Korean Journal of Food Science and Technology
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    • v.25 no.4
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    • pp.391-394
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    • 1993
  • For the automation of Tackjoo fermentation, a sensor measurable gas production during brewing and a controller were built. The performance tests were carried out at 10 litter Tackjoo fermentor, The sensor was consisted of a transparent acryl cell for bubble formation and photo-interrupter for the detection of bubbles of 0.018ml size. The fermentation controller was fabricated with a single chip microcomputer (MC68705R3) and provided with both the monitoring module of temperature measurement and the valve controling device for the cooling water circulation in coil type heat exchanger. The operation programs were developed and systemized in ROM. With this computer system, the gas production amount and rate were acquired during the Tackjoo fermentation. The fermentation curve based on the gas production rate showed a good agreement with that of alcohol concentration. The maximum rate of gas production was found after 24 hr at $30^{\circ}C$. The correlation equation between the gas production and alcohol concentration was established and used as the control algorithm of the fermentation.

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High Efficiency Resonant Flyback Converter using a Single-Chip Microcontroller (싱글칩 마이크로컨트롤러를 이용한 고효율 공진형 플라이백 전력변환기)

  • Jeong, Gang-Youl
    • Journal of IKEEE
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    • v.24 no.3
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    • pp.803-813
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    • 2020
  • This paper presents a high efficiency resonant flyback converter using a single-chip microcontroller. The proposed converter primary performs the resonant switching by applying the asymmetrical pulse-width modulation (APWM) to the half-bridge power topology. And the converter secondary uses the diode flyback rectifier as its power topology and operates with the zero current switching (ZCS). Thus the proposed converter achieves high efficiency. The total structure of proposed converter is very simple because it uses a single-chip microcontroller and bootstrap circuit for its control and drive, respectively. First, this paper describes the converter operation according to each operation mode and shows its steady-state analysis. And the software control algorithm and drive circuits operating the proposed converter are explained. Then, the operation characteristics of proposed converter are shown through the experimental results of an implemented prototype based on each explanation.