• Journal of Institute of Control, Robotics and Systems
• /
• v.8 no.6
• /
• pp.514-523
• /
• 2002

Feeder arrangement is an important element of process planning for printed circuit board assembly systems. This paper newly proposes a feeder arrangement method for multihead-gantry chip mounters. The multihead-gantry chip mounters are very popular in printed circuit board assembly system, but the research has been mainly focused on single-head-gantry chip mounters. We present an integer programming formulation for optimization problem of multihead-gantry chip mounters, and propose a heuristic method to solve the large NP-complete problem in reasonable time. Dynamic programming method is then applied to feeder arrangement optimization to reduce the overall assembly time. Comparative simulation results are finally presented to verify the usefulness of the proposed method.

• Proceedings of the KSME Conference
• /
• 2003.11a
• /
• pp.1027-1032
• /
• 2003

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $Moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for a single-sided package assembly and a double-sided package assembly are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one. The largest of effective strain occurred in the solder ball located at the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.11a
• /
• pp.472-475
• /
• 2004

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2006.06a
• /
• pp.404-405
• /
• 2006

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.

• Journal of Institute of Control, Robotics and Systems
• /
• v.11 no.2
• /
• pp.144-151
• /
• 2005

We propose an optimization method to reduce the assembly time of chip mounters. Feeder arrangement and assembly sequence are determined considering the multiple feeder assignment. The problem is divided into two sub-problems: feeder arrangement problem and assembly sequence problem. We present mathematical model for each sub-problem. The clustering algorithm and assignment algorithm are applied to solve the feeder arrangement problem. The assignment algorithm and connection algorithm are applied to solve the assembly sequence problem. Simulation results are then presented to verity the usefulness of the proposed method.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.59 no.9
• /
• pp.1615-1620
• /
• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.

• Journal of Institute of Control, Robotics and Systems
• /
• v.7 no.6
• /
• pp.540-549
• /
• 2001

An implementation method for chip-mounter simulator is proposed to improve the productivity and utility of electronic assembly lines. The simulator emulates the assembly sequence graphically to verify the chip mounter program in offline. It also presents functions of time estimation and productivity analysis considering the error probability. To increase the flexibility of simulator, stochastic petri nets are applied to modeling of the assembly sequence. The sequence model is then implemented as extendable classes by an object oriented language. The simulator is applied to a commercial chip mounter to verify the usefulness of the method proposed.

• Journal of Institute of Control, Robotics and Systems
• /
• v.6 no.9
• /
• pp.836-843
• /
• 2000

A sequence planning method is proposed to reduce the assembly time of gantey-type chip mounters with single head. The overall path of the chip mounter is divided into forward and backward path, and formulate the optimization problem is formulated as an transpoetation problem and an Euler's tour problem. The transportation alforithm is applied to find optimal backward path, and Euler's tour algorithm used to generate an assembly sequence. Simulation results are presented to verify the usefulness of the proposed method.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.51 no.7
• /
• pp.328-334
• /
• 2002

The DNA chips are devices associating the specific recognition properties of two DNA single strands through hybridization process with the performances of the microtechnology. In the literature, the "Gene chip" or "DNA chip" terminology is employed in a wide way and includes macroarrays and microarrays. Standard definitions are not yet clearly exposed. Generally, the difference between macro and microarray concerns the number of active areas and their size, Macroarrays correspond to devices containing some tens spots of 500$\mu$m or larger in diameter. microarrays concern devices containing thousnads spots of size less than 500$\mu$m. The key technical parameters for evaluating microarray-manufacturing technologies include microarray density and design, biochemical composition and versatility, repreducibility, throughput, quality, cost and ease of prototyping. Here we report, a new method in which minute particles are arranged in a random fashion on a chip pattern using random fluidic self-assembly (RFSA) method by hydrophobic interaction. We intend to improve the stability of the particles at the time of arrangement by establishing a wall on the chip pattern, besides distinction of an individual particle is enabled by giving a tag structure. This study demonstrates the fabrication of a chip pattern, immobilization of DNA to the particles and arrangement of the minute particle groups on the chip pattern by hydrophobic interaction.ophobic interaction.

• KIEE International Transactions on Electrophysics and Applications
• /
• v.11C no.2
• /
• pp.23-27
• /
• 2001

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarrays were made by immobilizing many kinds if DNAs on transducers (particles). DNA chip microarrays were prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of micro meter-scale sites. The particles occupied different sites from array to array. Each particle cam be distinguished by a tag that is established on the particle. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using hydrophobic interaction.