• International Journal of Precision Engineering and Manufacturing
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• v.7 no.3
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• pp.8-13
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• 2006

Plunge milling process is used for machining hole and is widely used in aerospace, automobile, and die/mold industries. The cutter is fed in the direction of spindle axis which has the highest structural rigidity. The kinematics of plunge milling differs from the traditional turning and milling in aspect of tool engagement and chip generation. This paper proposes the mechanistic cutting force model for plunge milling. Uncut chip thickness is calculated using the present cutter edge position and the previous cutter edge position. Instantaneous cutting force coefficients, which depend only on instantaneous uncut chip thickness, are derived based on the mechanistic approach. The developed cutting force model is verified through comparison of the predicted and the measured cutting forces.

• Transactions of the Korean Society of Mechanical Engineers
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• v.11 no.6
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• pp.1005-1013
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• 1987

For the factory automation and unmanned machine operation, it is very important to manufacture highly reliable and efficient chip breakers for optimal chip control. In this research, using the CALMA CAD/CAM SYSTEM, the manufacturing process of 3-dimensional chip breakers is established. Using the results of the cutting test of the selected chip breakers with double-step grooves, the chip breaking mechanism is schematically analysed. An expression for the chip breaking relation is derived which considers chip material behavior following LUDWIK's stress-strain curve, chip breaking criterion and the shape of chip breakers. This contains the thickness of chip, the radius of chip curl, and the mechanical properties of chip materials. It is found that the expression agrees very closely with the experimental results.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.4
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• pp.40-46
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• 1998

Leakage phenomena of flip-chip structures on common GaAs and alumina main substrates are characterized using the spectral domain approach to reduce the possible chip-to-chip crosstald and transmission resonance. We have found taht the longitudinal section magnetic mode is dominant for the coplanar waveguide leakage andthe leakage can be suppreassed by properly managing the gap height and the main substrate thickness in addition to the dielectric constant. These calculation results will be helpful for designing and flip-chip packagaing of high-frequency integrated circuits.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.41-45
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• 2018

As the size of semiconductor chip shrinks, the electronic industry has been paying close attention to fan-out wafer level packaging (FO-WLP) as an emerging solution to accommodate high input and output density. FO-WLP also has several advantages, such as thin thickness and good thermal resistance, compared to conventional packaging technologies. However, one major challenge in current FO-WLP manufacturing process is to control wafer warpage, caused by the difference of coefficient of thermal expansion and Young's modulus among the materials. Wafer warpage induces misalignment of chips and interconnects, which eventually reduces product quality and reliability in high volume manufacturing. In order to control wafer warpage, it is necessary to understand the effect of material properties and design parameters, such as chip size, chip to mold ratio, and carrier thickness, during packaging processes. This paper focuses on the effects of thickness of chip and molding compound on 12" wafer warpage after PMC of EMC using finite element analysis. As a result, the largest warpage was observed at specific thickness ratio of chip and EMC.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.1-2
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• 2000

In chip plating, several parameters must be taken into consideration. Current density, solution concentration, pH, solution temperature, components volume, chip and media ratio, barrel geometrical shape were most likely found to have an effect to the process yields. The 3 types of barrels utilized in chip plating industry are the onventional rotating barrel, vibrational barrel(vibarrel), and the centrifugal type. Conventional rotating barrel is a close type and is commonly used. The components inside the barrel are circulated by the barrel's rotation at a horizontal axis. Process yield has known to have higher thickness deviation. The vibrational barrel is an open type which offers a wide exposure to electrolyte resulting to a stable thickness deviation. It rotates in a vertical axis coupled with multi-vibration action to facilitate mixed up and easy transportation of components. The centrifugal barrel has its plated work centrifugally compacted against the cathode ring for superior electrical contact with simultaneous rotary motion. This experiment has determined the effect of barrel vibration intensity to the plating thickness distribution. The procedures carried out in the experiment involved the overall plating process., cleaning, rinse, Nickel plating, Tin-Lead plating. Plating time was adjusted to meet the required specification. All other parameters were maintained constant. Two trials were performed to confirm the consistency of the result. The thickness data of the experiment conducted showed thatbthe average mean value obtained from higher vibrational intensity is nearer to the standard mean. The distribution curve shown has a narrower specification limits and it has a reduced variation around the target value. Generally, intensity control in vi-barrel facilitates mixed up and easy transportation of components. However, it is desirable to maintain an optimum vibration intensity to prevent solution intrusion into the chips' internal electrode. A cathodic reaction can occur in the interface of the external and internal electrode. 2H20 + e $\rightarrow$M/TEX> 20H + H2.. Hydrogen can penetrate into the body and create pressure which can cause cracks. At high intensity, the chip's motion becomes stronger, its contact between each other is delayed and so plating action is being controlled. However, the strong impact created by its collision can damage the external electrode's structure there by resulting to bad plating condition.

• ETRI Journal
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• v.33 no.3
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• pp.335-343
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• 2011

The pad pitch of modern radio frequency integrated circuits is in the order of few tens of micrometers. Connecting a large number of high-speed I/Os to the outside world with good signal fidelity at low cost is an extremely challenging task. To cope with this requirement, we need reflection-free transmission lines from an on-chip pad to on-board SMA connectors. Such a transmission line is very hard to design due to the difference in on-chip and on-board feature size and the requirement for extremely large bandwidth. In this paper, we propose the use of narrow tracks close to chip and wide tracks away from the chip. This narrow-to-wide transition in width results in impedance discontinuity. A step change in substrate thickness is utilized to cancel the effect of the width discontinuity, thus achieving a reflection-free microstrip. To verify the concept, several microstrips were designed on multilayer FR4 PCB without any additional manufacturing steps. The TDR measurements reveal that the impedance variation is less than 3 ${\Omega}$ for a 50 ${\Omega}$ microstrip and S11 better than -9 dB for the frequency range 1 GHz to 6 GHz when the width changes from 165 ${\mu}m$ to 940 ${\mu}m$, and substrate thickness changes from 100 ${\mu}m$ to 500 ${\mu}m$.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.2
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• pp.3-9
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• 2005

In this study, the chip breaking characteristics of S, PbS and BiS free machining steels have been assessed. PbS free machining steel shows the lowest value of chip thickness ($t_c$) under the same cutting conditions. SM10C steel has the largest value of the chip cross-section area ratio ($R_{CA}$). As the feed rate becomes larger the chip breaking cycle time ($T_B$) decreases and the chip breaking index ($C_B$) increases. The properly controlled-C type chip has been obtained with the value of $C_B$ between 0.05 and 0.2. Free machining steel, PbS produces the properly controlled-C type chip in a wider feed rate range than other steels.

• Journal of the Korean Wood Science and Technology
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• v.15 no.3
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• pp.44-55
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• 1987

In order to study the effect of sawdustboard combined with plastic chips, 0.5mm($T_1$), 1mm($T_2$), 1.4mm($T_3$) thick nylon fiber. polypropylene rope fiber(RP), and 0.23mm thick moth-proof polypropylene net fiber(NP) were cut into 0.5, 1, 2cm long plastic chips. Thereafter, sawdustboard combined with plastic chips prepared as the above and plastic non-combined sawdustboard(control) were manufactured into 3 types of one-, two-, and three layer with 5 or 10% combination level. By the discussions and results at this study, the significant conclusions of mechanical and physical properties were summarized as follows: 1. The MORs were shown in the order of 3 layer> 2 layer> 1 layer among plastic non-combined boards, and $T_3$ < $T_2$ < $T_1$ < RP (NP(5%) < NP(l0%) among plastic combined boards. In 2cm long plastic chip in 1 layer board, the highest strength through all the composition was recognized. 1 layer board showing the lower strength with 0.5cm plastic chip rendered to the bending strength improvement by 2 or 3 layer board composition. On the other hand, 2 or 3 layer combined with 1, 2cm long polypropylene net fiber chips incurred MOR's conspicuous decrease requiring optimum plastic chip combined level and consideration to combined type. 2. MOE in plastic non-combined 3 layer board exhibited sandwich construction effect by higher resin content application to surface layer in the order of 3layer>1layer>2layer with the highest stiffness of the board combined with polypropylene chip, while nylon chip-combined board had little difference from plastic non-combined board. In relevant to length and layer effect, 3 layer board combined with the 0.5cm long polypropylene net fiber chip in 5% and 10% combined level presented 34-43% and 44-76% stiffness increase against plastic non-combined board(control), respectively. Moreover, in 1 layer board, 30% stiffness increase with 10% against 5% combined level in the 1 and 2cm long polypropylene net fiber chip was obtained. 3. Stress at proportional limit(Spl) showing the fiber relationship (r: 0.81-0.97) between MOR presented in the order of 1 layer<2 layer<3 layer in plastic non-combined board. Correspondingly, combined effect by layer and plastic chip length was similar to MOR's. 4. Differently from previous properties(MOR, MOE, Spl). work to maximum load(Wml) of 2 layer board approached to that of 3 layer board. Conforming the above phenomenon. 2 layer combined with 0.5cm long polypropylene net fiber chip kept the greater work than 1 layer. The polypropylene combined board superior to nylon -and plastic non - combined board seemed to have greater anti - failing capacity. 5. Internal bond strength(IB), in contrast to MOR's tendency. showed in the order of T1

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1522-1525
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• 2007

Circular milling operations are used to enlarge die and cylinder bores, and machine airframe pockets. In this case, cutting force varies as cutting tool position relative to workpiece. This paper presents a mechanistic model of geometric uncut chip thickness by predicting time varying cutter-part intersection as the cutter travels along the circular path. Compared with experimental results, the suggested cutting force model shows a good agreement.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.3
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• pp.48-54
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• 2000

In this study the characteristics of chip formation of the cold drawn Bi-S free machining steels were assessed. And for comparison those of the cold drawn Pb-S free machining steel the hot rolled low carbon steel which has MnS as free machining inclusions and the conventional steels were also investigated. During chip formation the cold drawn free machining steels show relatively little change in thickness and width of chip compare to those of the conventional carbon steels. And a single parameter which indicates the degree of deformation during chip formation chip cross-section area ratio is introduced. The chip cross-section area ratio is defined as chip cross-section area is divided by undeformed chip cross-section area. The variational patters of the chip cross-section area ratio of the materials cut are similar to those of the shear strain values. The shear stress however seems to be dependent on the carbon content of the materials. The cold drawn Bi-S and Pb-S steels show nearly the same chip forming behaviors and the energy consumed during chip formation is almost same. A low carbon steel without free machining aids shows poor chip breakability due to its high ductility. By introducing a small amount of free machining inclusions such as MnS Bi, Pb or merely increasing carbon content the chip breakability improves significantly.