• Journal of the Korean Academy of Child and Adolescent Psychiatry
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• v.23 no.3
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• pp.103-108
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• 2012

Objectives : The aim of this study is to investigate the effectiveness of treatment with osmotic-release oral system methylphenidate (OROS-MPH) on quality of life (QOL) in children with attention-deficit hyperactivity disorder (ADHD). Another aim is to assess the relationship between change in QOL and other factors including children's symptoms and academic performance or parents' depression and parenting stress. Methods : A total of 111 medication-naive children with ADHD in a multicenter, open-label, 12-week trial of OROS-MPH completed an evaluation using diverse rating scales at two time points; at baseline and after 12 weeks of treatment. Scales for investigation of children included the Parent Report Form-Children's Health and Illness Profile-Children's Edition (PRF-CHIP-CE) on QOL, the ADHD Rating Scale-IV on symptoms, and the Academic Performance Rating Scale (APRS). The Beck Depression Inventory and Parenting Stress Index were used for assessment of their parents. Results : Total scores for mean PRF-CHIP-CE increased from $207.9{\pm}26.7$ at baseline to $226.3{\pm}25.9$ after 12 weeks of treatment (p<.001). The change of APRS showed the strongest correlation with the increment of PRF-CHIP-CE scores (Pearson coefficient=0.561, p<.001), even after controlling for other factors (partial correlation coefficient=0.420, p<.001). Conclusion : Treatment with MPH-OROS results in improvement of QOL in children with ADHD in Korea. The advance in academic performance plays a key role in this change of QOL.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.91-96
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• 2014

Through silicon via (TSV) technology is to form a via hole in a silicon chip, and to stack the chips vertically for three-dimensional (3D) electronics packaging technology. This can reduce current path, power consumption and response time. In this study, Cu-filling substrate size was changed from Si-chip to a 4" wafer to investigate the behavior of Cu filling in wafer level. The electrolyte for Cu filling consisted of $CuSO_4$ $5H_2O$, $H_2SO_4$ and small amount of additives. The anode was Pt, and cathode was changed from $0.5{\times}0.5cm^2$ to 4" wafer. As experimental results, in the case of $5{\times}5cm^2$ Si chip, suitable distance of electrodes was 4cm having 100% filling ratio. The distance of 0~0.5 cm from current supplying location showed 100% filling ratio, and distance of 4.5~5 cm showed 95%. It was confirmed good TSV filling was achieved by plating for 2.5 hrs.

• Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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• v.32 no.4_1
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• pp.319-326
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• 2014

The accurate geo-referencing processes that apply ground control points is prerequisite for effective end use of HRSI (High-resolution satellite imagery). Since the conventional control point acquisition by human operator takes long time, demands for the automated matching to existing reference data has been increasing its popularity. Among many options of reference data, the airborne LiDAR (Light Detection And Ranging) data shows high potential due to its high spatial resolution and vertical accuracy. Additionally, it is in the form of 3-dimensional point cloud free from the relief displacement. Recently, a new matching method between LiDAR data and HRSI was proposed that is based on the image projection of whole LiDAR data into HRSI domain, however, importing and processing the large amount of LiDAR data considered as time-consuming. Therefore, we wmotivated to ere propose a local LiDAR chip generation for the HRSI geo-referencing. In the procedure, a LiDAR point cloud was rasterized into an ortho image with the digital elevation model. After then, we selected local areas, which of containing meaningful amount of edge information to create LiDAR chips of small data size. We tested the LiDAR chips for fully-automated geo-referencing with Kompsat-2 and Kompsat-3 data. Finally, the experimental results showed one-pixel level of mean accuracy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.8
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• pp.639-645
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• 2012

Embossed $TiO_2$ thin films with high surface areas are achieved using soft-templates composed of monolayer polystyrene beads. The form of links between the beads in the templates is controlled by varying the $O_2$ plasma etching time on the templates, resulting in various templates with close-linked, nano-linked, and isolated beads. Room-temperature deposition of $TiO_2$ on the plasma-treated templates and calcination at $550^{\circ}C$ result in embossed films with tailored links between anatase $TiO_2$ hollow hemispheres. Although all the embossed films have similar surface areas, the sensitivity of films with nano-linked $TiO_2$ hollow hemispheres to 500 ppm CO and ethanol gases are much higher than that of films with close-linked and isolated hollow hemispheres, and the detection limits of them are as low as 0.6 ppm for CO and 0.1 ppm for ethanol. The strong correlation of sensitivity with the form of links between hollow hemispheres reveals the critical role of potential barriers formed at the links. The facile, large-scale, and on-chip fabrication of embossed $TiO_2$ films with nano-linked hollow hemispheres on Si substrate and the high sensitivity without the aid of additives give us a sustainable competitive advantage over various methods for the fabrication of highly sensitive $TiO_2$-based sensors.

• Biotechnology and Bioprocess Engineering:BBE
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• v.9 no.2
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• pp.118-126
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• 2004

Recombinant E.coli ACV 1003 (recA::lacZ) releasing ${\beta}$-galactosidase by a SOS regulon system, when exposed to DNA-damaging compounds, have been used to effectively monitor endocrine disruptors. Low enzyme activity of less than 10 units/mL, corresponding to a $\mu\textrm{g}$/L(ppb) range of an endocrine disruptor (tributyl tin, bisphenol A. etc.), can be rapidly determined, not by a conventional time-consuming and tedious enzyme assay, but by an alternative interferometric biosensor. Heavily boron-doped porous silicon for application as an interferometer, was fabricated by etching to form a Fabry-Perot fringe pattern, which caused a change in the refractive index of the medium including ${\beta}$-galactosidase. In order to enhance the immobilization of the porous silicon surface, a calyx crown derivative (ProLinker A) was applied, instead of a conventional biomolecular affinity method using biotin. This resulted in a denser linked formation. The change in the effective optical thickness versus ${\beta}$-galactosidase activity, showed a linear increase up to a concentration of 150 unit ${\beta}$-galactosidase/mL, unlike the sigmoidal increase pattern observed with the biotin.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.196-203
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• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• Journal of Physiology & Pathology in Korean Medicine
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• v.18 no.5
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• pp.1291-1300
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• 2004

Baicalin, a biologically active flavonoid form the roots of Scutallaria baicalensis (Skullcap), have been reported to not only function as anti-oxidants but also cause anticancer effect. We investigated the mechanism of baicalin-induced cytotoxicity and the macro scale gene expression analysis in leukemia cell line, HL-60 cells. Baicalin (10 μM) were used to treat the cells for 6h, 12h, 24h, 48h and 72h. In a human cDNAchip study of 65,000 genes evaluated 6, 12, 24, 48. 72 hours after treated with Baicalin in HL-60 cells. Hierarchical cluster against the genes which showed expression changes by more than two fold. One hundred one genes were grouped into 6 clusters according to their profile of expression by a hierarchical clustering algorithm. For genes differentially expressed in response to baicalin treatment, we tested functional classes based on Gene Ontology (GO) terms. This study provides the most comprehensive available survey of gene expression changes in response to baicalin treatment in HL-60 cell line.

• Journal of KSNVE
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• v.11 no.1
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• pp.147-155
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• 2001

This paper is concerned with the real-time automatic tuning of the multi-input multi-output positive position feedback controllers for smart structures by the genetic algorithms. The genetic algorithms have proven its effectiveness in searching optimal design parameters without falling into local minimums thus rendering globally optimal solutions. The previous real-time algorithm that tunes a single control parameter is extended to tune more parameters of the MIMO PPF controller. We employ the MIMO PPF controller since it can enhance the damping value of a target mode without affecting other modes if tuned properly. Hence, the traditional positive position feedback controller can be used in adaptive fashion in real time. The final form of the MIMO PPF controller results in the centralized control, thus it involves many parameters. The bounds of the control Parameters are estimated from the theoretical model to guarantee the stability. As in the previous research, the digital MIMO PPF control law is downloaded to the DSP chip and a main program, which runs genetic algorithms in real time, updates the parameters of the controller in real time. The experimental frequency response results show that the MIMO PPF controller tuned by GA gives better performance than the theoretically designed PPF. The time response also shows that the GA tuned MIMO PPF controller can suppress vibrations very well.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.5
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• pp.91-97
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• 2004

A digital over-sampling noise-shaping coder to achieve the processing accuracy for the audio signal bandwidth is designed. In order to implement an optimized design of the noise-shaping coder as a form of U (intellectual property), circuit design techniques that optimize the multiplication and the ROM architectures are proposed with emphasis on the low-voltage operation under 2.0 V and the minimization of the hardware resources. In the design and verification methodology, the overall architectures and the internal bit width have been determined through behavioral simulations. The overall performances including timing margin have been estimated through transistor-level simulations. Furthermore, the test results of the implemented chip using a 0.35-${\mu}{\textrm}{m}$ standard CMOS process proposed the validity of the proposed circuits and the design methodology.