• 제목/요약/키워드: Chip Flow

검색결과 315건 처리시간 0.035초

광-전기역학 기술을 이용한 미생물의 미세유체역학적 제어 (Opto-electrokinetic Technique for Microfluidic Manipulation of Microorganism)

  • 권재성
    • 한국가시화정보학회지
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    • 제17권1호
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    • pp.69-77
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    • 2019
  • This paper introduces microfluidic manipulation of microorganism by opto-electrokinetic technique, named rapid electrokinetic patterning (REP). REP is a hybrid method that utilizes the simultaneous application of a uniform electric field and a focused laser to manipulate various kinds and types of colloidal particles. Using the technique in preliminary experiments, we have successfully aggregated, translated, and trapped not only spherical polystyrene, latex, and magnetic particles but also ellipsoidal glass particles. Extending the manipulation target to cells, we attempted to manipulate saccharomyces cerevisiae (S. cerevisiae), the most commonly used microorganism for food fermentation and biomass production. As a result, S. cerevisiae were assembled and dynamically trapped by REP at arbitrary location on an electrode surface. It firmly establishes the usefulness of REP technique for development of a high-performance on-chip bioassay system.

전단유동응력에 의한 정면밀링의 절삭력 해석 (Force Analysis of the Face Milling Process by Shear Flow Stress Model)

  • 이우영;신효철
    • 대한기계학회논문집
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    • 제13권6호
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    • pp.1170-1182
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    • 1989
  • 본 연구에서는 해석 기하학적인 접근 방법으로서 전단응력으로 표현되는 3차원 절삭이론을 유도하고 이것을 정면밀링의 해석에 적용하여 기본적인 파라메트 들은 실험이 비교적 용이한 선삭에서 결정하고 그들을 이용하여 밀링절삭력을 유효 하게 예측할 수 있도록 하는 방법을 제시하였다.

Lateral Flow Membrane를 이용한 인유두종 바이러스 DNA Array의 개발 (Development of Human Papillomavirus DNA Array by Using Lateral Flow Membrane Assay)

  • 김기황;이형구;조홍범
    • 미생물학회지
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    • 제44권4호
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    • pp.346-351
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    • 2008
  • 본 연구에서는 임신진단등의 간편 현장진단(point of care test, POCT)에 주로 사용되고 있는 멤브레인 측면흐름 분석기법을 사용하여 인유두종 바이러스(Human papillomavirus, HPV)의 특정 서열을 검출할 수 있는 DNA array를 개발하였다. HPV type 6, 11, 16, 18, 31, 45에 특이적인 DNA 탐침들을 측면흐름 분석용 멤브레인 표면에 고정하고, biotin이 label된 MY09/11 primer를 사용하여 얻어진 HPV PCR 반응 결과물과 탐침 사이에 hybridization 반응을 유도하였다. 이후 streptavidin이 label된 colloidal gold가 교잡물의 biotin과 반응함으로써 DNA hybridization 결과를 육안으로 확인할 수 있었다. 본 연구를 통해 개발된 HPV DNA lateral flow membrane array는 기존의 HPV DNA chip 기법과 비교하여 경제적이고 편리하게 주요 HPV type을 확인할 수 있음을 보여주었다.

S-K 구성방정식을 이용한 프린터용 3D Ti-6Al-4V 재료의 유동응력 결정 및 절삭력 예측 (Determination of Flow Stress and Cutting Force Prediction of Ti-6Al-4V Material for 3D Printer using S-K Constitutive Equation)

  • 박대균;김태호;전언찬
    • 한국기계가공학회지
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    • 제17권6호
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    • pp.68-74
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    • 2018
  • Study on the Ti-6Al-4V have been carried out using cutting simulation, and researches for cutting force and chip shape prediction have been actively conducted under various conditions. However, a 3D printer application method using Ti-6Al-4V metal powder material as a high-power method has been studied for the purpose of prototyping, mold modification and product modification while lowering material removal rate. However, in the case of products / parts made of 3D printers using powder materials, problems may occur in the contact surface during tolerance management and assembly due to the degradation of the surface quality. As a result, even if a 3D printer is applied, post-processing through cutting is essential for surface quality improvement and tolerance management. In the cutting simulation, the cutting force and the chip shape were predicted based on the Johnson-Cook composition equation, but the shape of the shear type chip was not predictable. To solve this problem, we added a damaging term or strain softening term to the Johnson-Cook constitutive equation to predict chip shape. In this thesis, we applied the constant value of the S-K equations to the cutting simulation to predict the cutting force and compare with the experimental data to verify the validity of the cutting simulation and analyzed the machining characterization by considering conditions.

언더필 공정에서 레이싱 효과와 계면 병합에 대한 가시화 (Visualization for racing effect and meniscus merging in underfill process)

  • 김영배;김선구;성재용;이명호
    • Journal of Advanced Marine Engineering and Technology
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    • 제37권4호
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    • pp.351-357
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    • 2013
  • 플립칩 패키징에서 언더필 공정은 칩과 기판 사이를 에폭시로 채워서 본딩하는 공정으로 제품의 신뢰성 향상을 위해 수행되어 진다. 이 언더필 공정은 모세관 현상에 의해서 이루어지는데 유체의 계면과 범프의 배열이 계면 운동에 미치는 영향으로 인하여 공정 중 예기치 않은 공기층을 형성하게 된다. 본 연구에서는 모세관 언더필 유동에서 나타나는 비정상 계면 유동을 가시화하여 범프 배열에 따른 레이싱 효과와 계면의 병합 현상에 대하여 고찰하였다. 그 결과, 플립칩 내부의 범프가 고밀도일수록 유체의 흐름방향과 수직방향의 유동이 더욱 활발하게 진행되어 더 많은 공기층이 형성되었으며, 엇갈린 배열일 경우 직각 배열에 비해 이러한 현상이 더 지배적으로 나타난다.

마이크로 채널 내부 유동의 Micro-PIV측정과 제반 문제점 (Micro- PIV Measurements of Microchannel Flows and Related Problems)

  • 이상준;김국배
    • 한국가시화정보학회:학술대회논문집
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    • 한국가시화정보학회 2002년도 마이크로/바이오 가시화기술부문 학술강연회
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    • pp.79-84
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    • 2002
  • Most microfluidic devices such as heat sinks for cooling micro-chips, DNA chip, Lab-On-Chip, and micro pumps etc. have microchannels of various size. Therefore, the design of practical microfluidics demands detail information on flow structure inside the microchannels. However, detail velocity field measurements are rare and difficult to carry out. In addition, as the microfluidics expands, accurate understanding of microscale transport phenomena becomes very important. In this research, micro-PIV system was employed to measure the velocity fields of flow inside a micro-channel. We carried out PIV measurements for several microchannels with varying channels width, inlet and outlet shape, filters, CCD camera and ICCD camera, etc. For effective composition of micro-PIV system, first of all, it is essential to understand optics related with micro-imaging of particles and the particle dynamics encountered in micro-scale channel flows. In addition, it is necessary to find the optimal condition for given experimental environment and? micro-scale flow to be investigated. The problems encountered in measuring velocity field of micro-channel flows are discussed in this paper.

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차량용 임베디드 프로세서에서 저전력 반응적 제어를 위한 이기종 멀티코어 협력적 스트리밍 온-칩 소프트웨어 구조 (Collaborative Streamlined On-Chip Software Architecture on Heterogenous Multi-Cores for Low-Power Reactive Control in Automotive Embedded Processors)

  • 권지수;박대진
    • 대한임베디드공학회논문지
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    • 제17권6호
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    • pp.375-382
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    • 2022
  • This paper proposes a multi-core cooperative computing structure considering the heterogeneous features of automotive embedded on-chip software. The automotive embedded software has the heterogeneous execution flow properties for various hardware drives. Software developed with a homogeneous execution flow without considering these properties will incur inefficient overhead due to core latency and load. The proposed method was evaluated on an target board on which a automotive MCU (micro-controller unit) with built-in multi-cores was mounted. We demonstrate an overhead reduction when software including common embedded system tasks, such as ADC sampling, DSP operations, and communication interfaces, are implemented in a heterogeneous execution flow. When we used the proposed method, embedded software was able to take advantage of idle states that occur between heterogeneous tasks to make efficient use of the resources on the board. As a result of the experiments, the power consumption of the board decreased by 42.11% compared to the baseline. Furthermore, the time required to process the same amount of sampling data was reduced by 27.09%. Experimental results validate the efficiency of the proposed multi-core cooperative heterogeneous embedded software execution technique.

HP LED의 열거동형상 분석을 위한 thermal simulation

  • 이승민;양종경;이현희;박대희
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 추계학술대회 논문집
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    • pp.191-191
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    • 2009
  • In this paper, we have confirmed the temperature of LED chip and McPCB with thermal simulation program which is CFDedign V10 for analysis the thermal flow of HP LED package. we have known that the heat from LED chip is transferred through heat slug to copper layer of McPCB. the temperature of LED chip shows 85.11 [$^{\circ}C$], which shows the temperature gap of 7.52 [$^{\circ}C$] against McPCB. the gap of temperature affect reliability of the wire bonding and die attachment. therefore, copper layer of heat slug on the McPCB should designed with the largest dimension.

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Analysis of 3-D Cutting Process with Single Point Tool

  • Lee, Young-Moon;Park, Won-Sik;Song, Tae-Seong
    • International Journal of Precision Engineering and Manufacturing
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    • 제1권1호
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    • pp.15-21
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    • 2000
  • This study presents a procedure for analyzing chip-tool friction and shear processes in 3-D cutting with a single point tool. The edge of a single point tool including a circular nose is modified to an equivalent straight edge, thereby reducing the 3-D cutting with a single point tool to the equivalent of oblique cutting. Then, by transforming the conventional coordinate systems and using the measurements of three cutting force components, the force components on the rake face and shear plane of the equivalent oblique cutting system can be obtained. As a result, the chip-tool friction and shear characteristics of 3-D cutting with a single point tool can be assessed.

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