• 제목/요약/키워드: Chip Flow

검색결과 315건 처리시간 0.025초

EMI Prediction of Slew-Rate Controlled I/O Buffers by Full-Wave and Circuit Co-Simulation

  • Kim, Namkyoung;Hwang, Jisoo;Kim, SoYoung
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제14권4호
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    • pp.471-477
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    • 2014
  • In this paper, a modeling and co-simulation methodology is proposed to predict the radiated electromagnetic interference (EMI) from on-chip switching I/O buffers. The output waveforms of I/O buffers are simulated including the on-chip I/O buffer circuit and the RC extracted on-chip interconnect netlist, package, and printed circuit board (PCB). In order to accurately estimate the EMI, a full-wave 3D simulation is performed including the measurement environment. The simulation results are compared with near-field electromagnetic scan results and far-field measurements from an anechoic chamber, and the sources of emission peaks were analyzed. For accurate far-field EMI simulation, PCB power trace models considering IC switching current paths and external power cable models must be considered for accurate EMI prediction. With the proposed EMI simulation model and flow, the electromagnetic compatibility can be tested even before the IC is fabricated.

소프트웨어 재사용을 위한 소프트웨어 칩 표현식에 관한 연구 (A Study on the Software-chip Expression for Software Reuse)

  • 김홍진
    • 한국컴퓨터정보학회논문지
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    • 제6권4호
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    • pp.12-20
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    • 2001
  • 소프트웨어 수요와 공급의 불균형으로 소프트웨어 병목현상이 나타나고 있으며, 이는 기존의 소프트웨어를 작성하는 프로그래머의 능력을 향상시키지 못함에 기인한다. 그러므로 소프트웨어 생산성 향상을 위해서는 새로운 소프트웨어 작성방법이 필요하다. 본 논문은 소프트웨어 재사용을 위해 표준화시켜서 작성한 프로그램 모듈들을 소프트웨어 칩으로 사용하기 위한 표현식을 제안한다. 이 표현식은 각 소프트웨어 칩의 이름과 입력, 출력, 반복의 4개 요소로 구성되어 직렬 및 병렬, 반복과 복합, 혼합 다중 형태의 결합과 분리되는 관계를 간단히 표현할 수 있고, 데이터의 흐름을 명확히 파악할 수 있으며 소프트웨어 재사용을 쉽게 할 수 있다.

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미세구조 내에서의 사출성형 흐름에 관한 연구 (Study on flow behavior of polymer solutions in microchannels)

  • 김동학
    • 한국산학기술학회논문지
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    • 제7권3호
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    • pp.471-475
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    • 2006
  • 랩온어칩(Lab-on-a-chip) 등 미세구조를 갖는 다양한 장치들의 대량 생산이 가능한 사출성형공정 내에서의 미세 흐름 거동의 이해는 매우 중요하다. 본 논문에서는 마이크로 채널 구조 내에서의 사출성형 흐름에 관하여 연구하였다. 흐름 현상을 관찰하기 위하여 투명한 PMMA를 사용하여 가시화 금형(visual mold)을 제작하였다. 실험 대상 물질로는 고분자 용액인 PEO (poly (ethylene oxide)) 와 PA (polyacrylamide) 용액을 선정하였는데, 이는 고분자 용융체의 특징인 높은 점성과 탄성을 갖도록 설계한 것이다. 시간에 따른 흐름현상과 주 채널과 마이크로 채널과의 경쟁적인 흐름 현상을 관찰하였다. 이로부터 마이크로 사출성형 흐름에서 나타나는 마이크로 채널 내의 충전길이에 대한 해석이 가능하였다.

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알루미나를 충전재로 첨가한 붕규산염 유리의 소결 및 결정화 방지기구에 대한 연구 (A Study on the Sintering and Mechanism of Crystallization Prevention of Alumina Filled Borosilicate Glass)

  • 박정현;이상진;성재석
    • 한국세라믹학회지
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    • 제29권12호
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    • pp.956-962
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    • 1992
  • The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

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열처리 및 비 열처리 AISI4140강의 유동응력 물성치를 기초로 하는 해석적 가공 모델 연구 (An analytical Machining models based on Flow Stress Properties for Non-Heat Treated and Heat Treated AISI 4140 Steel)

  • 이태홍
    • 한국생산제조학회지
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    • 제20권4호
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    • pp.419-426
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    • 2011
  • In this study, an experimental and theoretical program were carried out to determine the cutting forces and chip formation at different cutting speeds using a 0.4mm nose radius ceramic insert and -7 rake angle for non heat-treated AISI 4140 (27HRc) and heat-treated AISI 4140 (45 HRc) steel. The results obtained were compared to show the hardness differences between the materials. The secondary deformation zone thicknesses when comparing the two materials show different physical structure but similar size. These results were also discussed in light of the heat treatment and the effects it had on the machining characteristics of the material. In addition, the Oxley Machining Theory was used to predict the cutting forces for these materials and a comparison made. The predicted cutting performances were verified experimentally and showed good agreement with experimental data.

BOES CCD 카메라 1. 카메라 구성 (THE BOES CCD CAMERA 1. CAMERA ASSEMBLY)

  • 박병곤;장정균;성현철;장비호;김강민;한인우
    • 천문학논총
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    • 제18권1호
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    • pp.69-74
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    • 2003
  • A CCD camera for the BOES (Bohyunsan Observatory Echelle Spectrograph) has been developed. The camera consists of a 2048 ${\times}$ 4096 format CCD, a SDSU Gen-I CCD controller, and a continuous flow cryostat (CFC) designed by the ESO. In order to control the CCD under SDSU Gen-I controller, the voltage level of all the biases and clocks were lowered by -6V. The CFC showed cooling time of about 10 hour, after which the chip temperature settled down with variation less than ${\pm}1^{\circ}C$. The final chip temperature is around -105$^{\circ}C$ with the setting value for the CFC as -170$^{\circ}C$.

광학부품용 비세홈의 금형가공에 있어서 버와 형상변형에 관한 연구 (Burr and shape distorion in micro-grooving of optical componets)

  • 임한석;안중환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1996년도 춘계학술대회 논문집
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    • pp.53-57
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    • 1996
  • The side burrs and shape distortion resulting from the micromachining of an array of V-shape microgrooves in optical components were experimentally invesigated and a simplified model for their formation is proposed. Burr/shpae distortion should be kept to a minimum level since they degrade the characteristics and performance of these parts. The focus of this study is on the influence of depth of cut and workpiece material. The workpiece materials use were brass, bronze and copper. From the obsevation of the chip shape and burr/shape distortion, the proposed model, that the compressive force at the cutting edge causess the ductile uncut chip material to flow plastically outward toward the free surface to result in a burr, was verified.

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칩 마운터용 리니어 모터 스테이지의 열저항 모델링 (Thermal Resistance Modeling of Linear Motor Driven Stages for Chip Mounter Applications)

  • 장창수;김종영;김영준
    • 대한기계학회논문집B
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    • 제26권5호
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    • pp.716-723
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    • 2002
  • Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

칩 마운터용 리니어 모터 스테이지의 열저항 모델링 (Thermal Resistance Modeling of Linear Motor Driven Stages for Chip Mounter Applications)

  • 장창수;김종영;김영준
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 추계학술대회논문집B
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    • pp.96-101
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    • 2001
  • Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

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Clay가공에 있어서 Burr 생성기구에 관한 연구 (A Study on the Bburr Formation Mechanism in Clay Machining)

  • 양균의;고성림
    • 한국정밀공학회지
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    • 제7권4호
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    • pp.73-84
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    • 1990
  • A burr has been defined as an undesirable projection of material formed as the result of plastic flow from a cutting or shearing operation. It is Unavoidable in all kinds of machining operation. This paper describe the burr formation mechanism which is based on the behavior of workpiece material during orthogonal machining of the clay on the milling machine. Specially in this report the rollover burr is dealt as a specific case of the chip formation in the final stage of cutting. The negative shear angle is introduced as an important features of burr formation. It is found that the burr formation process is divided into three stage-initiation, development of negative shearing, and formation of the burr with appropriate assumptions. Using above the burr formation mechanism, the size of burr can be estimated by cutting conditions.

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