• Journal of Korea Multimedia Society
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• v.16 no.1
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• pp.75-86
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• 2013

This paper presents a technique to implement embedded systems using interrupts of the one-chip microcontroller with many peripherals based on a multiple finite state machines model. The multiple finite state machine model utilizes the structure of FSMD used for hardware design and the features of flow control by interrupts. The main finite state machine corresponds to the main program and the sub-state machines corresponds to the interrupt subroutines. Therefore, interrupts from the peripherals can be processed immediately in the sub-state machines. The request and reply variables are used to interface between the finite state machines. Additional operating system is not necessary for the context switching between the main state machine and the sub-state machine, because the flow-control caused by interrupt can be replaced with the switching. An embedded system modeled on multiple finite state machine with ASM charts can be easily implemented by the conversion of ASM charts into C-language programs. This implementation technique can be easily adopted to the hardware oriented embedded systems because of the detail description of the model and the fast response to the interrupt events in the sub-state machine.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.30 no.2
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• pp.147-151
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• 2004

This study aims at measuring electrical and rheological properties of cosmetic emulsions on the skin under shear flow. The effects of volume ratio and surfactants on structural changes of emulsions were examined by determining the changes of electrical resistance, viscosity, and morphology. As the ratio of the internal phase increased, the phase inversion occurred more quickly. The viscosity change was found to increase with increasing of the variation of electrical resistance of the emulsions. This phenomenon may be caused by decreased resistant force against the shear flow because of the breakdown of the internal phase. Surfactants a]so played a key ro]e on phase transition of emulsions. It is likely that polymeric surfactants anchoring on the emulsion surface reinforced the interfacial mechanical strength. As the concentration of surfactants increased, the phase transition occurred more slowly. It has been demonstrated that the phase changes of emulsions under shear flow can be monitored on the real-time basis by using a JELLI$\^$TM/ chip system, a combination of conductiometry and rheometry. Our approach is expected to a useful experimental tool for predicting the phase transition of the cosmetic products during skin application.

• Smart Structures and Systems
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• v.12 no.1
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• pp.1-22
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• 2013

Magnetic nanoparticle based bioseparation in microfluidics is a multiphysics phenomenon that involves interplay of various parameters. The ability to understand the dynamics of these parameters is a prerequisite for designing and developing more efficient magnetic cell/bio-particle separation systems. Therefore, in this work proof-of-concept experiments are combined with advanced numerical simulation to design and optimize the capturing process of magnetic nanoparticles responsible for efficient microfluidic bioseparation. A low cost generic microfluidic platform was developed using a novel micromolding method that can be done without a clean room techniques and at much lower cost and time. Parametric analysis using both experiments and theoretical predictions were performed. It was found that flow rate and magnetic field strength greatly influence the transport of magnetic nanoparticles in the microchannel and control the capturing efficiency. The results from mathematical model agree very well with experiments. The model further demonstrated that a 12% increase in capturing efficiency can be achieved by introducing of iron-grooved bar in the microfluidic setup that resulted in increase in magnetic field gradient. The numerical simulations were helpful in testing and optimizing key design parameters. Overall, this work demonstrated that a simple low cost experimental proof-of-concept setup can be synchronized with advanced numerical simulation not only to enhance the functional performance of magneto-fluidic capturing systems but also to efficiently design and develop microfluidic bioseparation systems for biomedical applications.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.3
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• pp.196-203
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• 2004

A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.12 no.2
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• pp.44-52
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• 2003

This research suggests a cutting force model for the ball end milling processes. This model includes the effect of tool run out and tool deflection. In the proposed model, the flutes of ball end mills are considered as series of infinitesimal elements and each cutting edge is assumed to be straight for the analysis of the oblique cutting process, in which the small cutting edge element has been analyzed as an orthogonal cutting process n the plane including the cutting velocity and the chip-flow vector. Therefor, the cutting forces can be calculated through the model using the orthogonal cutting data obtained from the orthogonal cutting test. In order to enhance the performance of the model, the flutes of ball end mill are defined to keep geometric consistency at the peak of the ball part and the junction with the end mill part. The divided infinitesimal cutting edges are regulated to be even lengths. Some experiments show the validity of the developed model in the various cutting coalitions.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.11a
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• pp.497-502
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• 2008

In this paper, we studied on an attenuation effect of automobile exhaust noise according to the direction of secondary sound source in duct ANC system. Automobile exhaust noise was recorded at 800rpm. 3500rpm and 5000rpm of a diesel engine. Directions of loudspeaker(second sound source) can be exchanged to $30^{\circ}$, $90^{\circ}$ and $150^{\circ}$ against the primary noise flow by acrylic ducts to be made for experimentation. DSP board with TMS320C6416 chip of Texas Instrument Co used to control adaptive ANC system. This ANC system is based on the single-channel FxLMS algorithm. In experiment result, when the loud speaker direction was $150^{\circ}$, the attenuation effect showed largely. In case of $90^{\circ}$ duct, the noise was a little increased. In case of $30^{\circ}$ duct, the noise was a little increased or decreased according to the frequency range and the sound pressure(dB) of exhaust noise to comply with engine rpm.

• Journal of the Korean Society for Precision Engineering
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• v.7 no.3
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• pp.75-82
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• 1990

Automatic monitoring of the cutting conditions is one of the most improtant technologies in machining. In this study, the feasibility in applying acoustic emission(AE) signals for the in-process detection of endmill wear and fracture has been investigated by performing experimental test on the NC vertical milling machine with SM45C for specimen. As the results of detecting and analyzing AE signals on various cutting conditions, the followings have confirmed. (1) The RMS value of acoustic emission is related sensitively to the cutting velocity, but is not affected largely by feed rate. (2) The burst type AE signals of high level have been observed when removing chips distorderly and discontinuously. (3) When the RMS value grows up rapidly due to the increase of wear the endmill are generally broken or fractured, but when the endmills fracture at the conditions of smooth chip-flow or built-up-edge(BUE) occurred frequently, the rapid change of the RMS arenot found. And it is expected that this technigue will be quite useful for in-process sensing of tool wear and fracture.

• International Journal of Precision Engineering and Manufacturing
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• v.2 no.3
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• pp.41-46
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• 2001

This paper discusses the feasibility of improving micro-machining accuracy by using two-dimensional(2-D) vibration cutting. Vibration cutting is generated by two piezo actuators arranged orthogonally : one is actuated by a sine curve voltage input, and the other is actuated by a phase-shifted sine curve voltage. A tool attached to the vibrator oscillates in a 2-D elliptical motion, depending on the frequencies, amplitudes, and the phase shifts of two input signals and the workpiece feedrate. Along the elliptical tool locus, cutting is done in the lower part, and non-cutting is done in the upper part. By this way a unique feature of 2-D vibration cutting, that is, air lubrication between a tool and chips, is caused. Another unique feature of 2-D vibration cutting was experimentally verified, that is, some negative thrust force occurs as the direction of chip movement on a tool rake face is reversed. Those features not only help chips flow smoothly and continuously but also reduce cutting force, which results in a higher quality machined surface. Through tool path simulations and experiments under several micro-machining conditions, the 2-D vibration cutting, compared to conventional cutting, was found to result in a great decrease in the cutting force, a much smoother surface, and much less burr.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.19 no.6
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• pp.92-99
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• 2005

We are interaction refrigeration warehouse cold water pump system and photovoltaic generation system. At this time, a target pressure is able to control in spite of change of the pressure according to pump head and rate of flow of pump. Also, we carry out the vector control of BLDC motor with the maximum torque operation and a high reliability from territory of each operation speed. Therefore, in this paper, we conclude energy saving technique of refrigeration warehouse cold water pump system.