• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.4
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• pp.471-477
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• 2014

In this paper, a modeling and co-simulation methodology is proposed to predict the radiated electromagnetic interference (EMI) from on-chip switching I/O buffers. The output waveforms of I/O buffers are simulated including the on-chip I/O buffer circuit and the RC extracted on-chip interconnect netlist, package, and printed circuit board (PCB). In order to accurately estimate the EMI, a full-wave 3D simulation is performed including the measurement environment. The simulation results are compared with near-field electromagnetic scan results and far-field measurements from an anechoic chamber, and the sources of emission peaks were analyzed. For accurate far-field EMI simulation, PCB power trace models considering IC switching current paths and external power cable models must be considered for accurate EMI prediction. With the proposed EMI simulation model and flow, the electromagnetic compatibility can be tested even before the IC is fabricated.

• Journal of the Korea Society of Computer and Information
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• v.6 no.4
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• pp.12-20
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• 2001

The problem of software bottle-neck may be arised from unbalance of demands and supply of software. This is caused from the fact that the capability of programmer could not be improved in software development. Therefor, the new method of software development should aim at improving the productivity of software. This paper presents the expressions to be the standardized software Program modules by means of the software chip. The expressions are consist of name, input, output, and iteration of each software chip. And they simple express a combination and separation in sequence, parallel, iteration, composition, mixing, and variety form. Therefore they can easily software reuse as a result of analyzing the flow of data clearly.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.3
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• pp.471-475
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• 2006

Filling the microchannels is very important in designing micro-injection molding, microdevices, etc. In this paper, flow dynamics was studied in injection molding with microchannels. A transparent PMMA mold was designed and the flow dynamics was observed. The experiment was performed using poly (ethylene oxide) (PEO) and polyacrylamide (PA) aqueous solutions. The transignt dynamic flow and flow competition between the base plate and the microchannels were observed. The flow observation was used to explain previous filling length results in microchannels during micro-injection molding.

• Journal of the Korean Ceramic Society
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• v.29 no.12
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• pp.956-962
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• 1992

The predominant sintering mechanisms of low firing temperature ceramic substrate which consists of borosilicate glass containing alumina as a filler are the rearrangement of alumina particles and the viscous flow of glass powders. In this system, sintering condition depends on the volume ratio of alumina to glass and on the particle size. When the substrate contains about 35 vol% alumina filler and the average alumina particle size is 4 $\mu\textrm{m}$, the best firing condition is obtained at the temperature range of 900∼1000$^{\circ}C$. The extensive rearrangement behavior occurs at these conditions, and the optimum sintering condition is attained by smaller size of glass particles, too. The formation of cristobalite during sintering causes the difference of thermal expansion coefficient between the substrate and Si chip. This phenomenon degradates the capacity of Si chip. Therefore, the crystallization should be prevented. In the alumina filled borosilicate glass system, the crystallization does not occur. This effect may have some relation with aluminum ions in alumina. For aluminum ions diffuse into glass matrix during sintering, functiong as network former.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.419-426
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• 2011

In this study, an experimental and theoretical program were carried out to determine the cutting forces and chip formation at different cutting speeds using a 0.4mm nose radius ceramic insert and -7 rake angle for non heat-treated AISI 4140 (27HRc) and heat-treated AISI 4140 (45 HRc) steel. The results obtained were compared to show the hardness differences between the materials. The secondary deformation zone thicknesses when comparing the two materials show different physical structure but similar size. These results were also discussed in light of the heat treatment and the effects it had on the machining characteristics of the material. In addition, the Oxley Machining Theory was used to predict the cutting forces for these materials and a comparison made. The predicted cutting performances were verified experimentally and showed good agreement with experimental data.

• Publications of The Korean Astronomical Society
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• v.18 no.1
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• pp.69-74
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• 2003

A CCD camera for the BOES (Bohyunsan Observatory Echelle Spectrograph) has been developed. The camera consists of a 2048 ${\times}$ 4096 format CCD, a SDSU Gen-I CCD controller, and a continuous flow cryostat (CFC) designed by the ESO. In order to control the CCD under SDSU Gen-I controller, the voltage level of all the biases and clocks were lowered by -6V. The CFC showed cooling time of about 10 hour, after which the chip temperature settled down with variation less than ${\pm}1^{\circ}C$. The final chip temperature is around -105$^{\circ}C$ with the setting value for the CFC as -170$^{\circ}C$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.53-57
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• 1996

The side burrs and shape distortion resulting from the micromachining of an array of V-shape microgrooves in optical components were experimentally invesigated and a simplified model for their formation is proposed. Burr/shpae distortion should be kept to a minimum level since they degrade the characteristics and performance of these parts. The focus of this study is on the influence of depth of cut and workpiece material. The workpiece materials use were brass, bronze and copper. From the obsevation of the chip shape and burr/shape distortion, the proposed model, that the compressive force at the cutting edge causess the ductile uncut chip material to flow plastically outward toward the free surface to result in a burr, was verified.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.5
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• pp.716-723
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• 2002

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model (TRM) was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than 7$^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air and -water flow rate.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.96-101
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• 2001

Heat transfer in linear motor driven stages for surface mounting device applications was investigated. A simple one-dimensional thermal resistance model was introduced. In order to reduce three-dimensional nature to one-dimensional, a few assumptions and simplifications were employed suitably. A good agreement with a finite element heat transfer analysis in temperature profile was obtained. For validation, the analysis was compared with the measurement with respect to motor driving power. Overall discrepancy was less than $7^{\circ}C$. The influence of two high thermal resistance parts, insulation sheet and thermal contact between the coil assembly and the mounting plate, was examined through the analysis. Additionally, the thermal resistance analysis was applied to another stage including an internal cooling-air passage, and was found available for this system as well. After validation, the cooling effect was surveyed in terms of motor power, and cooling-air flow rate.

• Journal of the Korean Society for Precision Engineering
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• v.7 no.4
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• pp.73-84
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• 1990

A burr has been defined as an undesirable projection of material formed as the result of plastic flow from a cutting or shearing operation. It is Unavoidable in all kinds of machining operation. This paper describe the burr formation mechanism which is based on the behavior of workpiece material during orthogonal machining of the clay on the milling machine. Specially in this report the rollover burr is dealt as a specific case of the chip formation in the final stage of cutting. The negative shear angle is introduced as an important features of burr formation. It is found that the burr formation process is divided into three stage-initiation, development of negative shearing, and formation of the burr with appropriate assumptions. Using above the burr formation mechanism, the size of burr can be estimated by cutting conditions.