• 설비공학논문집
• /
• 제19권5호
• /
• pp.418-425
• /
• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• 한국전기전자재료학회논문지
• /
• 제31권4호
• /
• pp.267-271
• /
• 2018

A high directivity TIR (total internal reflection) lens in the UV-A region was designed using a silicone resin, and a UV light source module with a maximum irradiation density of $150mW/cm^2$ was fabricated. The beam angle of the TIR lens was designed to be $8.04^{\circ}$ and the maximum diameter of the TIR lens was Ø13.5. A silicone resin having a UV transmittance of 93% and a refractive index of 1.4 at a wavelength of 365 nm was used, and the lens was manufactured using an aluminum mold, from which silicone could be easily released. The module was fabricated in a metal printed circuit board of COB (chip on board) type using a $0.75{\times}0.75mm^2$ UV chip. A jig was used to adjust the focal length between lens and chip and to fix the position of the lens. The optical characteristics such as illumination distributions of the lens and module were designed using 'LightTools' optical simulation software. The heat dissipation system was designed to use a forced-air cooling method using a heat-sink and fan.

• 대한기계학회논문집B
• /
• 제22권6호
• /
• pp.888-898
• /
• 1998

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5 ~ 7.5% for paraffin slurry, heat flux of 10 ~ 40 W/cm$^{2}$ for the simulated VLSI chips and Reynolds numbers of 5,300 ~ 15,900. The apparatus consisted of test section, paraffin slurry maker, pump, constant temperature baths, flowmeter, etc. The test section made of in-line, four-row array of 12 heat sources for simulating 4 * 3 multichip module which was flush mounted on the top wall of a horizontal rectangular channel with the aspect ratio of 0.2. The inlet temperature was 20 deg. C for all experiments. The size of paraffin slurry was constant as 10 ~ 40 .mu.m befor and after the experiment. The chip surface temperatures for paraffin slurry with the mass fraction of 7.5% showed lower by 16 deg. C than those for water when the heat flux is 40 W/cm$^{2}$. The local heat transfer coefficients for the paraffin slurry with the mass fraction of 7.5% were larger by 17 ~ 25% than those for water at the first and the fourth row. The local heat transfer coefficients reached to a row-number-independent, thermally fully developed value approximately after the third row. The local Nusselt numbers at the fourth row for paraffin slurry with the mass fraction of 7.5% were larger by 23 ~ 29% than those for water.

• 한국컴퓨터정보학회논문지
• /
• 제16권7호
• /
• pp.1-11
• /
• 2011

사용자들의 높은 요구 사항을 만족시키는 컴퓨팅 시스템을 개발하기 위해 프로세서의 성능을 향상시키기 위한 연구는 지속적으로 진행되어 왔다. 공정 기술 발달을 비롯한 다양한 기술 발전을 통하여 프로세서의 성능은 비약적으로 발전하였으나 그 이면에는 새로운 문제들이 발생하게 되었다. 그 중에서, 최근 들어 주된 문제점 중 하나로 인식되고 있는 열섬 현상은 칩의 신뢰성에 심각한 영향을 미치기 때문에 프로세서 설계 시 성능, 전력 효율성과 함께 반드시 고려되어야 한다. 과거에는 기계적인 냉각 기법으로 프로세서의 온도를 효과적으로 제어할 수 있었지만, 최근에는 프로세서의 성능이 높아져 발생되는 온도가 높아 냉각 비용이 급속히 증가하고 있다. 이로 인해, 최근의 온도 제어 연구는 기계적인 냉각 기법보다는 구조적 기법을 통한 온도 제어에 더욱 집중되는 추세를 보이고 있다. 하지만, 구조적 기법을 통해 온도를 제어하는 방안은 프로세서의 온도를 낮추는 데에는 효율적이지만 이를 위해 성능을 희생한다는 단점이 존재한다. 따라서, 기계적 냉각 기법을 통해 프로세서의 온도를 효율적으로 제어할 수 있다면, 성능 저하가 발생되는 구조적 기법을 통한 온도 제어기법의 사용 빈도가 줄어 그 만큼 성능이 향상될 수 있을 것으로 기대된다. 본 논문에서는 고성능 멀티코어 프로세서에서 발생하는 온도를 기계적인 냉각 기법이 얼마나 효율적으로 제어할 수 있는지를 상세하게 분석해 보고자 한다. 공랭식 냉각기와 수랭식 냉각기를 이용하여 다양한 실험을 수행한 결과, 공랭식 냉각기와 비교하여 수랭식 냉각기가 온도를 효과적으로 제어하는 반면에 전력 소모가 더 많음을 확인할 수 있다. 특히, 1W의 전력을 통해 낮출 수 있는 온도를 분석해 보면 공랭식에 비해서 수랭식이 더 효율적임을 알 수 있으며, 수랭식 냉각기의 경우에는 냉각 단계가 냉각 효율은 오히려 감소하게 됨을 확인할 수 있다. 실험 결과를 바탕으로 온도에 따라 적절하게 기계적 냉각 기법을 활용한다면 프로세서의 온도를 더욱 효과적으로 제어할 수 있을 것으로 기대된다.

• 한국식품저장유통학회지
• /
• 제11권2호
• /
• pp.250-256
• /
• 2004

국내의 기상조건 및 벼의 수확후 처리여건에 적합한 곡물냉각기를 개발하고, 냉각능력, 재열능력, 가열능력, 소요전력 및 성능계수 등의 성능을 측정하여 설계조건에 적합한지를 분석하였다. 그 결과를 요약하면 다음과 같다. 압축기 무부하전자변과, 재열기 및 증발기에 고온고압의 냉매가스를 공급하여 냉각능력을 0∼100%까지 제어할 수 있고, 온도 5$^{\circ}C$이상, 상대습도 54∼95%의 정온정습 공기를 발생할 수 있는 1일 최대 벼 200톤을 냉각할 수 있는 곡물냉각기를 개발하였다. 이 곡물냉각기의 최대냉각능력은 35,284㎉/hr, 송풍량 및 정압은 각각 120㎥/min, 279mmAq이었으며, 재열기를 통한 냉각공기의 최대 온도상승 및 상대습도의 저하범위는 각각 7.6∼8.6$^{\circ}C$, 34.5∼41.0%이었으며, 최대가열능력은 5.6$^{\circ}C$이었다. 또한, 최대 소요동력은 22.8㎾이었으나, 압축기의 무부하 전자변이 작동될 때는 총소요동력의 33.3%, 압축기 소요축동력의 44.7%가 절약되는 것으로 나타났으며, 제어조건에 따라 전체소요동력의 26.7～33.3%정도가 절약되는 것으로 나타났으며, 냉동시스템의 성능계수는 과냉각으로 인해 표준냉동사이클하에서의 4.0보다 높은 4.71이었으며, 전성능계수는 1.8로 나타났다.

• 대한기계학회논문집
• /
• 제18권3호
• /
• pp.729-737
• /
• 1994

A three-dimensional finite element model of a 20-pin plastic dual-in-line package(PDIP) plugged into a PCE has been developed by using the finite element code ANSYS. The model has been used for thermal characterization of the package during its normal operation under natural convection cooling. Temperature distributions in the package and PCB are obtained from numerical analysis and compared with experimentally measured data. Various cases are assumed and analyzed to study the effects of package and PCB materials on thermal characteristics of PDIP with and without aluminum heatspreader. Thermal dissipation capability of PDIP is greatly increased due to copper die pad/lead frame and heatspreader. However, thermally induced stresses in the package and fatigue life of chip are improved for PDIP with Alloy 42 die pad/lead frame and no heatspreader. It is also found that the role of PCB on thermal characteristics of PDIP is very imporatant.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2003년도 추계학술대회
• /
• pp.19-24
• /
• 2003

Recently, various efforts to make more speedy and precision machine tool to improve productivity and also various efforts to solve environmental problem are going on, so that dry cutting in manufacturing industry, which needs environmental conscious design and development of manufacturing technique, is becoming a very important assignment to solve. Because dry cutting does not use cutting fluid, we need other methods that can be used instead of cutting fluid, which does cooling, lubricating, chip washing, and anti-corrosion. Especially, because turning is a continuous work, the consideration of tool life and surface roughness due to continuous heat and poor lubrication is important. The purposes of this paper are the consideration of how well the compressed air can work instead of cutting fluid, and also the development of the method to select the optimum machining condition by the minimum numbers of experiments through the Taguchi method.

• 한국정밀공학회지
• /
• 제15권4호
• /
• pp.36-43
• /
• 1998

We experimented turning SCM440, called difficult-to-cut materials in general, using tungsten carbon tool(PIO) in order to elevate machinability by a new cutting method. The cutting tool designed and made to study was cooled to -17$0^{\circ}C$ in about 1 minute by liquid nitrogen. Then, we operated cryogenic cutting by cooling tool with liquid nitrogen and stuided the effect about cutting force, chip thickness, surface roughness, behavior of tool wear and cutting temperature. In addition, we investigated the possibility that sur face roughness of workpiece can be predicted analyzing cutting characteristics.

• 한국공작기계학회논문집
• /
• 제15권2호
• /
• pp.59-65
• /
• 2006

The purposes of using cutting fluid during cutting have been cooling, lubricating, chip washing and anti-corroding. However, the present manufacturing industry restricts the use of cutting fluid because cutting fluid contains poisonous substances which are harmful to the human body. Therefore environmentally conscious machining and technology have more important position in machining process because cutting fluids have significant influence on the environment in milling process. In this study, environmentally conscious machining can be obtained by the way of selecting the optimum machinig conditon using the design of experiment. Cutting using oil-mist showed better cutting characteristics than dry, air and fluid cutting with respect to by cutting force, tool wear and surface roughness. Also, the optimum machining condition for cutting using oil-mist could be selected through Taguchi method.

• 한국마린엔지니어링학회:학술대회논문집
• /
• 한국마린엔지니어링학회 2005년도 전기학술대회논문집
• /
• pp.1113-1119
• /
• 2005

The power electric system is one of the most concerning factor for the reliability of the electric propulsion ship. operation in higher temperature decreases the device's reliability and power efficiency. the management of power loss and temperature of switching devices is indispensable for the reliability fo the power electric system. In this paper, IGBT chip of the switching devices is modeled and MIIR(Motor with Inverter Internal to Rotor)type of the propulsion motors is used. these parts interact with each other to calculate the loss and temperature of device. calculated Results is modeled and designed of the control and monitoring system for the electric propulsion system.