Transactions of the Korean Society of Mechanical Engineers B (대한기계학회논문집B)
- Volume 22 Issue 6
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- Pages.888-898
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- 1998
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- 1226-4881(pISSN)
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- 2288-5324(eISSN)
DOI QR Code
Cooling characteristics of the multichip module using paraffin slurry
파라핀 슬러리를 사용한 다칩모듈의 냉각특성
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Jo, Geum-Nam
(Sung Kyun Kwan University, Seoul) ;
- Choe, Min-Gu
- Published : 1998.06.01
Abstract
The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5 ~ 7.5% for paraffin slurry, heat flux of 10 ~ 40 W/cm
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