• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.221-221
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• 2006

The SMD type P-N junction diode with ceramic package for diode case were fabricated. It was made this diode with simple process from $Al_2O_3$ ceramic chip, solder preform, diode chip, coating reagent and conductive paste for chip terrmination. Its merit is small size, easy manufacture. fast cooling with ceramic case. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5 28ns, 1322V, 1.08V, $0.45{\mu}A$.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.6
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• pp.496-501
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• 2007

In order to enhance sintering characteristics on the $ZnO-Pr_6O_{11}$ based multilayer chip varistors (MLVs), a response surface analysis using central composite design method were carried out. As a result, varistor voltage($V_{1mA}$), nonlinear coefficient ($\alpha$), leakage current ($I_L$) and capacitance (C) were considered to be mainly affected by sintered temperature and holding time. MLVs sintered at $1200^{\circ}C$ and above $1200^{\circ}C$ revealed poor electrical characteristics, possibly due to the reaction between electrode materials(Pd) and $ZnO-Pr_6O_{11}$ based ceramics. On the sintering temperature range $1150{\sim}1175^{\circ}C$, nonlinear coefficient ($\alpha$) and leakage current ($I_L$) were shown to be $60{\sim}69$ and below $0.3{\mu}A$, respectively. In particular, MLVs sintered at $1175^{\circ}C$, 1.5 hr and $2^{\circ}C/hr$ (cooling speed) showed stable ESD(Electrical Static Discharge) characteristics under the condition of 10 times at 8 Kv with deviation varistor voltage, and deviation nonlinear coefficient were 0.3% and 0.33% (at positive), 0.55% (at negative), respectively.

• Structural Engineering and Mechanics
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• v.76 no.5
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• pp.561-578
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• 2020

The present work addresses the surface integrity and chip morphology in finish hard turning of AISI D3 steel under nanofluid assisted minimum quantity lubrication (NFMQL) condition. The surface integrity aspects include microhardness, residual stress, white layer formation, machined surface morphology, and surface roughness. This experimental investigation aims to explore the feasibility of low-cost multilayer (TiCN/Al2O3/TiN) coated carbide tool in hard machining applications and to assess the propitious role of minimum quantity lubrication using graphene nanoparticles enriched eco-friendly radiator coolant based nano-cutting fluid for machinability improvement of hardened steel. Combined approach of central composite design (CCD) - analysis of variance (ANOVA), desirability function analysis, and response surface methodology (RSM) have been subsequently employed for experimental investigation, predictive modelling and optimization of surface roughness. With a motivational philosophy of "Go Green-Think Green-Act Green", the work also deals with economic analysis, and sustainability assessment under environmental-friendly NFMQL condition. Results showed that machining with nanofluid-MQL provided an effective cooling-lubrication strategy, safer and cleaner production, environmental friendliness and assisted to improve sustainability.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.75-79
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• 2013

Demands for semiconductor devices are dramatically increasing, and advancements in fabrication technology are allowing a step-up in the number of devices per unit area. As a result, semiconductor devices require higher heat dissipation, and thus, cooling solutions have become important for guaranteeing their operational reliability. In particular, in chip-in-board packages, in which chips and passives are embedded in the substrates for efficient device layout, heat dissipation is of greater importance. In this study, a thermal model for layers of different materials has been proposed, and then, the heat transfer has been simulated by imposing a set of appropriate boundary conditions. Heat generation can be predicted based on the results, which will be utilized as practical data for actual package design.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.7 no.2
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• pp.266-275
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• 1995

A numerical investigation on the conduction-natural convection-surface radiation conjugate heat transfer in the enclosure having substrate and chips has been performed. A 2-dimensional simulation model is developed by considering heat transfer by conduction, convection and radiation. The solutions to the equation of radiative transfer are obtained by the discrete ordinates method using S-4 quadrature. The effects of Rayleigh number and the substrate-fluid thermal conductivity ratio on the cooling of chip are analyzed. The result shows that radiation is the dominant heat transfer mode in the enclosure.

• Journal of computational fluids engineering
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• v.18 no.2
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• pp.9-16
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• 2013

The heat transfer enhancement of heat sink with mist flow is studied numerically by solving the conservation equations for mass, momentum and energy in the continuous and dispersed phases. A Lagrangian method is used for tracing dispersed water droplets in the heat sink and an Eulerian species transport model for air and steam mixture. The continuous and dispersed phases are interacted with the drag and evaporation source terms. The computed results show that addition of evaporating mist droplets enhances the cooling performance of heat sink significantly.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.7
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• pp.351-363
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• 2001

This paper presents an experimental investigation on the heat trensfer characteristic of micro pipe (MHP) array with 38 triangular microgrooves. A heat pipe is an effective heat exchanger operating without external power. The heat pipe transfers heat by means of the latent heat of vaporization and two-phase fluid flow driven by the capillary force. The overall size of the MHP array can be put undermeath a microelectonic die and integrated into the electrronic package of a microelectronin device to dissipate the heat from the die. The MHP array is fabricated by micromachining with a silicon wafer and a glass substrate. The MHP was filled with water and sealed. The experimental results show the temperature decrease of 12.1$^{\circ}C$ at the evaporator section for the input power of 5.9 W and the improvement of 28% in the heat transfer rate.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.430-431
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• 2006

Thermoelectric thick film was fabricated by screen printing process with using p-type Bi-Te-Sb powders. The powder was synthesized by melting, milling and sintering process and hydrogen reduced to enhance the thermoelectric property. The thick film of Bi-Te-Sb powder was fabricated by screen printing method and baked at the optimized conditions. The thermal conductivity, the electrical resistivity and Seeback coefficient of thick film were measured and the thermoelectric performance was analyzed in terms of film characteristics and its microstructure. Finally, the feasibility of thermoelectric thick film into micro cooling device on CPU chip was discussed in this study.