• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 추계학술대회논문집B
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• pp.124-130
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• 2001

The heat transfer and flow measurements were made on a cylindrical pedestal mounted on a flat plate with a turbulent impinging air jet. The heat transfer coefficient distributions on the flat plate were measured using the shroud-transient technique and liquid crystal was used to measure the surface temperature. The jet Reynolds number (Re) is 23,000, the dimensionless nozzle-to-surface distance (L/d) from 2 to 10, the dimensionless pedestal diameter-to-height (H/D) from 0 to 1.5, the dimensionless 2nd pedestal diameter-to-height ($H/D_2$) from 0 to 0.4 and the distance from the stagnation point to 2nd pedestal (p/D). The results show that for H/D = 0.5 to 1.5, the Nusselt number distributions on the plate surface exhibit a maximum between $r/d\;{\cong}\;1.0$ and 1.5. The presence of the pedestal appears to cause the flow separation and reattachment on the plate surface, which results in the maximum heal transfer coefficient. Also, for p/D = 2.5 and $H/D_2$ = 0.3, the local Nusselt number in the region corresponding to $r/d\;{\cong}\;1.1$ was increased up to 50% compared to that for $H/D_2=0$.

• 한국공작기계학회논문집
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• 제14권1호
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• pp.8-14
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• 2005

The purposes of using cutting fluid during cutting have been cooling, lubricating, chip washing, and anti-corroding. However, the present manufacturing industry restricts the use of cutting fluid because cutting fluid contains poisonous substances which are harmful to the human body. Therefore dry cutting becomes an unavoidable assignment and a lot of researches have studied cutting methods without using cutting fluid. Because dry turning is a continuous work, tools life is reduced by continuous heat generation and surface gets rough due to reduced lubrication, so it is important to consider these situations. In this paper, the way of selecting the optimal machining condition by the minimum number of experiments and the effectiveness of using compressed air in high hardness materials through Taguchi method have been found. Dry cutting using compressed air showed better cutting characteristics than normal dry cutting with respect to by cutting force, tool wear, and surface roughness. Also, the optimal machining condition f3r dry cutting using compressed air could be selected through Taguchi method.

• 대한기계학회논문집B
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• 제25권12호
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• pp.1844-1852
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• 2001

Recent developments in microfluidic devices based on microelectromechanical systems (MEMS) technique find many practical applications, which include electronic chip cooling devices, power MEMS devices, micro sensors, and bio-medical devices among others. For the design of such micro devices, flows characteristics inside a microchannel have to be clarified which exhibit somewhat different characteristics compared to conventional flows in a macrochannel. In the present study microchannels of various hydraulic diameters are fabricated on a silicon wafer to study the pressure drop characteristics. The effect of abrupt contraction and expansion is also studied. It is found from the results that the friction factor in a straight microchannel is about 15% higher than that in a conventional macrochannel, and the loss coefficients in abrupt expansion and contraction are about 10% higher than that obtained through conventional flow analysis.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 추계학술대회 논문집 학회본부 C
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• pp.586-588
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• 2000

본 논문은 전자 패키징의 방열 성능을 개선하기 위하여 초소형 히트 파이프를 제작하고 열전달 성능을 시험한 결과를 보여준다. IC 칩이 점점 고성능화되고 고집적화되어 감에 따라 발열 문제가 대두되는데, 이 열은 전도만으로는 충분히 소산시킬 수 없고 패키징 표면에 별도의 장치를 장착하는 것은 시스템 소형화의 장애 요소가 된다. 따라서, 고성능 칩 개발을 위한 선결 과제로 고성능 초소형 냉각 장치가 요구되고 있다. 히트파이프는 밀봉된 파이프 내의 2상 유동과 상변화 잠열을 이용하여 열원으로부터 히트 싱크로 열을 효과적으로 전달하는 열교환 장치이다. 본 논문에서는 전자 패키징 내에 집적화할 수 있도록 초소형 히트 파이프 어레이를 제작하여 그 성능을 시험한 결과 증발부의 온도가 $12.1^{\circ}C$ 감소됨을 보인다.

• 한국기계가공학회지
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• 제16권5호
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• pp.150-156
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• 2017

This study tests the characteristics of heat radiation by applying the pin-height variables to 30-W LED floodlights. The angle of the heat sink enables us to identify the characteristics of the heat radiation based on the temperature distribution. The results of the study are as follows. When the heat sinks are set towards the ground, the heat transfer decreases in speed only to expands the temperature distribution, which adversely affects the characteristics of heat radiation and expands the temperature distribution of PCB with the LED chip. We verify that the characteristics of heat radiation are adversely affected when the height of the cooling pin decreases and the heat radiation area decreases, which impedes the heat transfer and increases the temperature distribution on the heat sink.

• 한국컴퓨터정보학회논문지
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• 제19권4호
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• pp.1-8
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• 2014

멀티코어 프로세서는 여러 개의 코어가 하나의 칩에 배치됨에 따라 전력 밀도가 상승하여 높은 발열이 발생한다. 이러한 발열 문제를 해결하기 위해서 최근까지 다양한 연구가 진행되고 있다. 마이크로프로세서의 온도 감소를 위한 기법으로는 기계적 냉각 기법, 동적 온도 관리 기법 등이 있지만 이러한 기법들은 추가적인 냉각 비용이 발생하거나 성능의 저하가 발생한다. 플로어플랜기법은 추가적인 냉각비용이 발생하지 않으며, 성능저하가 거의 발생하지 않는다는 장점을 지닌다. 본 논문에서는 멀티코어 프로세서의 특정 구성요소의 발열 문제를 해결하기 위해 코어 내부 구성요소와 L2 캐쉬의 다양한 플로어플랜을 활용하고자 한다. 실험 결과, 코어의 뜨거운 구성요소를 L2 캐쉬와 인접하게 배치할 경우 칩의 온도 감소에 매우 효과적임을 알 수 있다. 코어를 캐쉬 상단-가운데 배치하는 기본 플로어플랜과 비교하여, 코어를 중앙에 배치하고 뜨거운 구성요소를 L2 캐쉬와 인접하게 배치하는 플로어플랜의 경우에는 $8.04^{\circ}C$, 코어를 외곽에 배치하고 뜨거운 구성요소를 L2 캐쉬와 인접하게 배치하는 플로어플랜의 경우에는 $8.05^{\circ}C$의 최고온도 감소 효과를 보임을 알 수 있다.

• 천문학논총
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• 제23권1호
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• pp.1-12
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• 2008

Understanding of the basic characteristics of an astronomical instrument is a prerequisite to obtaining reliable data from the instrument. We have analyzed more than 1,000 calibration images from the Fairchild 486 CCD (hereafter the Maidanak 4k CCD system) attached to the AZT-22 1.5m telescope at Maidanak Astronomical Observatory in Uzbekistan. The Maidanak 4k CCD system supports three readout modes through 1, 2, or 4 amplifiers. In most cases observers use 4-amplifier readout mode to save time. We have tested the stability and seasonal variation of zero levels and confirm that two quadrants of the images (Amp 1 & 2) show no appreciable seasonal variation. but the other two quadrants (Amp 3 & Amp 4) show an evident seasonal variation in the bias level. The Cryo Tiger, the cooling system used at the Maidanak 4k CCD system, maintains the CCD temperature at -108'E, and effectively suppresses the dark electrons. The mean value versus the variance plot of the flat images does not show the expected relation for an ideal Poisson noise distribution and this is attributed to the large variation in quantum efficiency between different pixels. In addition, we confirm that there is no appreciable difference in gain between readout amplifiers, but there is a large variation in quantum efficiency across CCD chip especially in U. Due to the finite length of shutter opening and closing time, the effective exposure time varies across the science images. We introduce two parameters to quantify the effect of this uneven illumination and present a method to remove these effects. We also present a method to remove the interference patterns appearing in the images obtained with longer wavelength filters and investigate the spatial variation of the point spread function.

• Journal of Astronomy and Space Sciences
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• 제14권2호
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• pp.259-268
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• 1997

천문대에서 개발 중에 있는 CCD를 사용한 극미 광 영상장비의 시험모델 개발과 현재까지의 결과를 논의하였다. 고도의 저 잡음 도와 안정성이 요구되는 천문관측용 극미 광 영상장비는 자외선에서 가시 광 및 근 적외선 영역에 이르기까지 매우 넓은 파장영역에서 관측을 수행할 수 있는 장비로서 여러 분야에 널리 사용되고 있다. 그러나 현재가지 국내에서는 이 장비의 핵심부분인 controller의 자체설계 기술이 확보되어 있지 않은 실정이다. 이 연구에서 개발된 시스템의 전자 부는 한 개의 EPLD(Erasable Programable Logic Device)에 구현된 controller와, 그 외에 analog driver, video processor로 이루어져 있으며 CCD의 암잡음을 줄이기 위한 방법으로 액체질소 냉각방식을 사용하고 있다. 전체적인 제어와 자료처리는 범용성을 고려하여 개인용 컴퓨터(PC)를 이용하였다. 액체질소 냉각용 cryostat와 CCD 소자를 제외한 대부분이 자체 설계제작 되어진 이 시스템으로 실험실과 소백산천문대에서 시험영상을 얻는데 성공하였다.

• 한국산학기술학회논문지
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• 제8권4호
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• pp.733-737
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• 2007

본 논문은 MCPCB에 다수의 와트급 LED를 모듈화하여 조명기구로 사용함에 따라 발생하는 열을 해결하기 위한 제안이다. LED가 조명기구로 사용되려면 칩의 용량이 커야하며 이 결과 P-N접합부의 열이 증가하게 됨으로 이를 해결하기 위해 펠티어 소자와 방열판 그리고 Fan을 설치하여 온도변화특성을 측정하였다. 또한 부가적으로 냉각소자와 방열판을 접속하는 열전도판, 단열재, Thermal Grease에 따른 온도변화특성을 실험하였다. 그 결과 방열판의 종류 및 체적에 따른 온도 변화가 가장 중요한 요소로 나타났다. Fan의 on, off에 따른 온도변화는 최대 $18[^{\circ}C]$의 변화폭을 주었으며 부가적 재료들도 $2{\sim}3[^{\circ}C]$의 온도변화에 영향을 주어 무시할 수 없는 요소임을 확인하였다.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.