• 제목/요약/키워드: Chemical reaction process

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의약품 원료 DIET 합성 중 H2O2를 이용한 붕소제거 반응공정에서의 폭주반응 위험성 평가 (Hazard Evaluation of Runaway Reaction in Deboronation Process Using H2O2 in DIET Synthesis of Pharmaceutical Raw Material)

  • 김원성;이근원
    • 한국가스학회지
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    • 제22권4호
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    • pp.49-54
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    • 2018
  • 원료의약품 제조회사에서는 화학반응에 의해 제품이 생산되기 때문에 화학반응 전 단계인 원료 분말을 투입하는 과정에서 화재 폭발사고가 자주 발생하고 있다. 이에 대한 실질적인 화학반응 단계에서 사고원인 분석을 통한 안전대책 연구는 많지 않다. 본 연구에서는 화학반응 단계에서의 위험성을 알아보고자 붕소제거 반응공정에서 발열에 대한 실험을 진행했다. 연구대상 반응공정은 실제 원료의약품 공장에서 합성하고 있는 제품을 대상으로 반응열량계를 이용하여 열적 거동을 조사하였다. 실제 제조현장의 반응공정에서 냉각실패 등의 이유로 발열할 수 있는 합성반응의 최대온도와 기술적 근거에 의한 최대온도를 비교해서 위험도를 예측하였다. 이러한 결과를 가지고 실제 제조현장에 적용하여 발열에 따른 폭주반응 위험성을 제어하는 안전대책을 제시하였다.

Optimal Reaction Conditions for Minimization of Energy and Byproducts in a Poly(ethylene terephthalate) Process

  • Ha, Kyoung-Su;Rhee, Hyun-Ku
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1999년도 제14차 학술회의논문집
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    • pp.248-251
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    • 1999
  • The optimal reaction conditions are determined for a PET process, which consists of transesteriflcation, prepolymerization and polycondensation reactors in series. Based on the simulation results of the reactor system, we scrutinize the cause and effect between the reaction conditions and the final properties of the polymer product. We then select the process variables with significant influence on the properties of polymer as control variables and calculate the optimal reaction conditions by iterative dynamic programming (IDP) algorithm with constraints. A new reaction scheme incorporating reactions for by-products as well as three main reactions is considered in the constrained IDP method.

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Effects of chemical reaction on the polishing rate and surface planarity in the copper CMP

  • Kim, Do-Hyun;Bae, Sun-Hyuk;Yang, Seung-Man
    • Korea-Australia Rheology Journal
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    • 제14권2호
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    • pp.63-70
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    • 2002
  • Chemical mechanical planarization (CMP) is the polishing process enabled by both chemical and mechanical actions. CMP is used in the fabrication process of the integrated circuits to achieve adequate planarity necessary for stringent photolithography depth of focus requirements. And recently copper is preferred in the metallization process because of its low resistivity. We have studied the effects of chemical reaction on the polishing rate and surface planarity in copper CMP by means of numerical simulation solving Navier-Stokes equation and copper diffusion equation. We have performed pore-scale simulation and integrated the results over all the pores underneath the wafer surface to calculate the macroscopic material removal rate. The mechanical abrasion effect was not included in our study and we concentrated our focus on the transport phenomena occurring in a single pore. We have observed the effects of several parameters such as concentration of chemical additives, relative velocity of the wafer, slurry film thickness or ash)tract ratio of the pore on the copper removal rate and the surface planarity. We observed that when the chemical reaction was rate-limiting step, the results of simulation matched well with the experimental data.

화학반응 공정에서의 공정조건 및 허용차설계 (Parameter and Tolerance Designs of the Chemical Reaction Process)

  • 안종석;윤원영
    • 품질경영학회지
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    • 제30권1호
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    • pp.97-117
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    • 2002
  • We apply Taguchi method to the process optimization problem of chemical reaction process, and some case studies are done to find out the way for cost reduction and quality improvement The parameter and tolerance designs of Taguchi mettled are done with operation data of a chemical process and we propose a procedure how to use and analyze the operation data to find the optimal process conditions and tolerance limits. In order to use the continuous values in experiment conditions, it is suggested how to determine the interval of each level by discrete values and to treat any missing values caused from discrete 4 levels.

화합물 합성반응 중 Fridel - Crafts Acylation 공정에서의 폭주반응 위험성평가 (The Risk Assessment of Runway Reaction in the Process of Fridel-Crafts Acylation for Synthesis Reaction)

  • 이광호;김원성;전진우;주영종;박교식
    • 한국안전학회지
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    • 제36권3호
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    • pp.24-30
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    • 2021
  • Heat is generated during the synthesis and mixing process of chemical compounds due to a change in activation energy during the reaction. A runaway reaction occurs when sufficient heat is not removed during the heat control process within a reactor, rapidly increasing the temperature, reaction speed, and rate of heat generation inside the reactor. A risk assessment was executed using an RC-1 (Reaction Calorimeter) during Friedel-Crafts acylation. Friedel-Crafts acylation runs the risk of rapid heat generation during Active Pharmaceutical Ingredient (API) manufacturing; it was used to confirm the risk of a runaway reaction at each synthesis stage and during the mixing process. This study used experimental data to develop a safety efficiency improvement plan to control the risks of runaway and other exothermic reactions, which was implemented at the production site of a chemical plant.

플라즈마 프로세스 및 촉매 표면화학반응에 의한 유기화합물 분해효율 향상에 대한 연구 (A Study on the Improvement of Decomposition Efficiency of Organic Substances Using Plasma Process and Catalytic Surface Chemical Reaction)

  • 한상보
    • 전기학회논문지
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    • 제59권5호
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    • pp.932-938
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    • 2010
  • This paper proposed the effective treatment method for organic substances using the barrier discharge plasma process and catalytic chemical reaction followed from ozone decomposition. The decomposition by the plasma process of organic substances such as trichloroethylene, methyl alcohol, acetone, and dichloromethane carried out, and ozone is generated effectively at the same time. By passing through catalysts, ozone easily decomposed and further decomposed organic substances. And, 2-dimensional distribution of ozone using the optical measurement method is performed to identify the catalytic surface chemical reaction. In addition, CO is easily oxidized into $CO_2$ by this chemical reaction, which might be induced oxygen atom radicals formed at the surface of catalyst from ozone decomposition.

Chemiluminescence Determination of Balofloxacin Based on Europium (III)-Sensitized KBrO3-Na2S2O4 Reaction in Micellar Medium

  • Zhao, Fang;Qi, Yu;Xiong, Wei
    • Bulletin of the Korean Chemical Society
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    • 제33권1호
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    • pp.204-208
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    • 2012
  • A novel chemiluminescence (CL) flow injection method for the determination of balofloxacin is described. The method is based on the weak CL signal arising from the reaction of $KBrO_3$ with $Na_2S_2O_4$ in acidic medium being significantly enhanced by balofloxacin in the presence of europium (III) ion and sodium dodecyl benzene sulfonate (SDBS). The experimental conditions that affected CL intensity were carefully optimized and the CL reaction mechanism was briefly discussed. Under the optimum conditions, the relative CL intensity was proportional to the concentration of balofloxacin in the range of $7.0{\times}10^{-11}$ to $3.0{\times}10^{-7}g\;mL^{-1}$. The detection limit was $2.7{\times}10^{-11}g\;mL^{-1}$ and the relative standard deviation was 2.1% for $7.0{\times}10^{-10}g\;mL^{-1}$ balofloxacin (n = 13). The proposed method was successfully applied to the determination of balofloxacin in pharmaceutical formulations and biological fluids.

Synthesis of polyphenylcarbosilane via thermal rearrangement of polymethylphenylsilane in supercritical cyclohexane

  • Shin, Hee-Yong;Ryu, Jae-Hun;Bae, Seong-Youl;Lee, Yoon-Joo;Kwon, Woo-Teck;Kim, Young-Hee;Kim, Soo-Ryong
    • 한국응용과학기술학회지
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    • 제30권1호
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    • pp.9-15
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    • 2013
  • A new process for the synthesis of polyphenylcarbosilane (PPCS) via thermal rearrangement of polymethylphenylsilane (PMPS) in supercritical cyclohexane was proposed and investigated at reaction temperatures of $380-420^{\circ}C$, reaction times of 1-2 h, and a pressure of 15 MPa. The structure, molecular weight, and molecular weight distribution of the product were characterized by FT-IR, Si-NMR, and GPC. The ceramic yield was also measured by TGA analysis. High-quality PPCS with high molecular weight and ceramic yield can be synthesized via a supercritical process. Furthermore, this process, when compared to the conventional method, tends to moderate the reaction conditions such as reaction temperature and time. It is concluded that thermal rearrangement in supercritical fluid is an efficient and viable process in terms of the resulting yield, efficiency, and reaction time compared with those of the conventional PCS production process.

Permeability of pH-sensitive membranes grafted by Fenton-type reaction: An experimental and modeling study

  • Gac, Jakub M.;Bojarska, Marta;Stepniewska, Izabela;Piatkiewicz, Wojciech;Gradon, Leon
    • Membrane and Water Treatment
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    • 제6권5호
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    • pp.411-422
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    • 2015
  • Membrane modification by different concentrations of acrylic acid has been described. Grafting of acrylic acid to the surface of a polypropylene membrane was obtained by a Fenton-type reaction. Membrane permeability seemed to have been dependent on the value of pH in the solution. To explain tendency, a simple theoretical model was developed. The model incorporates explicitly statistical conformations of a polyacid chain grafted onto the pore surface. The charged capillary model with a varying diameter for porous membranes was then used to evaluate the permeability of the membrane. It has been shown both theoretically and experimentally that the permeability of a grafted membrane depends on the pH of the solution.

고체/기체계 가역 화학 반응열 이용 HEAT PUMP 기술 개발

  • 이종호
    • 한국에너지공학회:학술대회논문집
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    • 한국에너지공학회 1993년도 추계학술발표회 초록집
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    • pp.78-81
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    • 1993
  • AN EXTENSIVE RESEARCH AND DEVELOPMENT WORK WILL BE CARRIED OUT FOR THE COMMERCIALIZATION OF THE CHEMICAL HEAT PUMP SYSTEM WHICH BASED ON THE ELF AQUITAINE FRANCE PATENTED AND KIME LICENSED SOLID/GAS CHEMICAL REACTION TECHNOLOGY. TOWARD ON THAT GOAL, THE BASIC AND ENGINEERING DETAILS SUCH AS IMPEX BLOCK MATERIAL, PHYSICO-CHEMICAL AND THERMO-CHEMICAL CHARACTERISTICS OF REACTION MECHANISMS IN THE SOLID/GAS CHEMICAL REACTION HEAT PUMP SYSTEMS. THREE KIND OF APPLICATION SYSTEM ARE NOW INVESTIGATED; AIR CONDITIONING, REFRIGERATOR AND INDUSTRIAL PROCESS HEATING AND COOLING SYSTEM.

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