• 한국가스학회:학술대회논문집
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• 2003.05a
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• pp.224-231
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• 2003

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2002.11a
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• pp.191-194
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• 2002

매체 순환식 연소(Chemical-Looping Combustion, CLC)는 금속 산화물(산소공여매체, oxygen carrier)의 산소를 이용하여 화석연료를 산화(연료 연소 공정)시키고, 환원된 금속을 다시 산화(매체 산화 공정)시키는 간접적인 연소 공정의 하나이다. 이 방식은 온실효과의 주발생원인 $CO_2$를 원천적으로 회수할 수 있고, 또한 화염이 없는 상태에서 연소반응이 진행됨으로 thermal NOx의 발생을 미연에 방지할 수 있어 고효율의 환경친화적인 연소공정이다.(중략)

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.9
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• pp.438-443
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• 2001

In the shallow trench isolation(STI)-chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control, within-wafer-non-uniformity, and the possible defects such as pad oxide damage and nitride residue. The defect like nitride residue and silicon (or pad oxide) damage after STI-CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI fill and STI-CMP were discussed. Consequently, we could conclude that law trench depth and high CMP thickness can cause nitride residue, and high trench depth and over-polishing can cause silicon damage.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.10
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• pp.441-446
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• 2003

The chemical mechanical polishing (CMP) process is now widely employed in the ultra large scale integrated (ULSI) semiconductor fabrication. Especially, shallow trench isolation (STI) has become a key isolation scheme for sub-0.13/0.10${\mu}{\textrm}{m}$ CMOS technology. The most important issues of STI-CMP is to decrease the various defects such as nitride residue, dishing, and tom oxide. To solve these problems, in this paper, we studied the planarization characteristics using slurry additive with the high selectivity between $SiO_2$ and $Si_3$$N_4$ films for the purpose of process simplification and in-situ end point detection. As our experimental results, it was possible to achieve a global planarization and STI-CMP process could be dramatically simplified. Also, we estimated the reliability through the repeated tests with the optimized process conditions in order to identify the reproducibility of STI-CMP process.

• Proceedings of the Korean Institute of Resources Recycling Conference
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• 2003.10a
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• pp.196-200
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• 2003

A novel prepurification method was developed aiming at increasing yield and purity, also reducing solvent usage for purification of paclitaxel. The use of a micelle and precipitation in the prepurification process allows for rapid separation of paclitaxel from interfering compounds and dramatically reduces solvent usage compared to alternative methodologies. The prepurification process serves to minimize the size and complexity of the HPLC operations for paclitaxel purification. The process is readily scalable to a pilot plant and eventually to a production environment where multikilogram quantities of material are expected to be produced. As much as possible, the process has been optimized to minimize solvent usage, complexity, and operating costs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.501-504
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• 1999

In the shallow trench isolation(STI) chemical mechanical polishing(CMP) process, the key issues are the optimized thickness control within- wafer-non-uniformity, and the possible defects such as nitride residue and pad oxide damage. These defects after STI CMP process were discussed to accomplish its optimum process condition. To understand its optimum process condition, overall STI related processes including reverse moat etch, trench etch, STI filling and STI CMP were discussed. It is represented that the nitride residue can be occurred in the condition of high post CMP thickness and low trench depth. In addition there are remaining oxide on the moat surface after reverse moat etch. It means that reverse moat etching process can be the main source of nitride residue. Pad oxide damage can be caused by over-polishing and high trench depth.

• Korean Chemical Engineering Research
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• v.44 no.2
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• pp.129-135
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• 2006

In this study, computer modeling and simulation works were performed to obtain nearly pure toluene product from toluene containing non-aromatic compounds using sulfolane as a solvent through an extractive distillation process. NRTL liquid activity coefficient model was adopted for phase equilibrium calculations and Aspen Plus release 12.1, a commercial process simulator, was used to simulate the extractive distillation process. In this study, it was concluded that the toluene product with a purity of 99.8 percent by weight and a recovery of 99.65 percent was obtained through an extractive distillation process.

• Bulletin of the Korean Chemical Society
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• v.18 no.8
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• pp.814-818
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• 1997

The chemical waste treatment, APEG (alkali/polyethylene glycol) process has been shown to be effective for the dechlorination of PCBs in transformer oil. Considerable amount of PCBs, however, still remains in the waste exceeding the 25-50 ppm limit set by regulatory agency. A new thermal regeneration technology has been developed in our laboratory for disposal of hazardous organic wastes. Due to the limited oxidation of carbon surface through the reverse movement of flame front to oxidant flow, this technology was termed counterflow oxidative system (COS). Specially, the oxidant flow in the COS process is a principal parameter which determines the optimum conditions regarding acceptable removal and destruction efficiency of adsorbed organic wastes at minimal carbon loss. The COS process, under optimum conditions, was found to be very effective and the removal and destruction efficiency of 99.99% or better was obtained for residual PCBs in the waste while bulk (≥90%) of carbon was recovered. Any toxic formation of polychlorinated dibenzo-p-dioxins (PCDDs) and polychlorinated dibenzo furans (PCDFs) were not detected in the regenerated carbon and impinger traps. The results of surface area measurement showed that the adsorptive property of regenerated carbon is mostly reclaimed during the COS process.

• Journal of the Korean institute of surface engineering
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• v.40 no.5
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• pp.234-240
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• 2007

As a reactor coolant pump (RCP) is operated in the nuclear power system for a long time, so its surface is continuously contaminated by radioactive scales. In order to maintain for RCP internals, a special chemical decontamination process should be used to reduce the radiation from the RCP surface. In this study, applicable possibility in chemical decontamination for RCP was investigated for the various stainless steels. The stainless steel (STS) 304 showed the best electrochemical properties for corrosion resistance and the lowest weight loss ratio in chemical decontamination process model 3-1 than other materials. However, the pitting corrosion was generated in both STS 415 and STS 431 with the increasing numbers of cycle. The intergranular corrosion in STS 415 was sporadically observed. The sizes of their pitting corrosion were also increased with increasing cycle numbers.

• Journal of Environmental Science International
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• v.14 no.7
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• pp.683-689
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• 2005

The consecutive combination process of a biological process as the pre-treatment and a chemical process as the post-treatment is applied for the dyeing wastewater. The poor efficiency of biological treatment using pure oxygen makes the chemical treatment cost high. It is necessary to improve the efficiency of biological treatment in order to reduce the cost of chemical treatment. The purpose of this paper is to find the minimum dose of chemical reagent to fit the Discharged Water Quality Standards for the different biological treatment effluents. Results revealed that the minimum dosage of Fenton's reagent lead to save the cost of chemical treatment based on the guideline dose in the treatment plant. The possible maximum saving reagents was up to $70\%$ for the effluent of the pilot plant packed with the carrier imbedded microorganisms which were selected from the present treatment plant.