• 대한환경공학회지
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• 제31권9호
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• pp.743-748
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• 2009

화학적인 슬러지 개량은 하수슬러지의 탈수성을 개선하기 위해 주로 사용된다. 이 공정은 개량제를 이용하여 처리한 후 농축 및 탈수된다. 본 연구는 DAF 부상장치를 이용하여 하수슬러지의 개량(혐기성 보관시간, 응집제 종류, 및 주입량) 및 부상조건(슬러지 농도 및 A/S 비)에 따른 부상농축효율을 평가한 것이다. 혐기성 보관시간에 따라 하수슬러지의 비표면적과 여과비저항은 증가하였다. $Al_2(SO_4)_3$, $Fe_2(SO_4)_3$ 및 PSO-M을 주입하여 개량된 하수슬러지는 보관시간이 경과에 따라 부상농축효율이 거의 감소되지 않았다. 개량된 하수슬러지는 A/S 비가 0.01 mL/mg 이상이면, 부상농축효율이 저하되지 않고 96% 이상 유지할 수 있었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.171-175
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics and metal, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter level dielectrics and metal. Especially, defects like (micro-scratch) lead to severe circuit failure, and affects yield. Current conditioning method - bladder type, orbital pad motion - usually provides unsuitable pad profile during ex-situ conditioning near the end of pad life. Since much of the pad wear occurs by the mechanism of bladder tripe conditioning and its orbital motion without rotation, we need to implement new ex-situ conditioner which can prevent abnormal regional force on pad caused by bladder-type and also need to rotate the pad during conditioning. Another important study of ADPC is related to the orbital scratch of which source is assumed as diamond grit dropped from the strip during ex-situ conditioning. Scratch from diamond grit damaged wafer severely so usual1y scraped. Figure 1 shows the typical shape of scratch damaged from diamond. We suspected that intensive forces to the edge area of bladder type stripper accelerated the drop of Diamond grit during conditioning, so new designed Flat stripper was introduced.

• 설비공학논문집
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• 제19권8호
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• pp.607-614
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• 2007

This paper investigated that the functional group and chemical structure of additives affect ice adhesion in aqueous solutions cooling with stirring. In order to compare the effect on the ice adhesion in aqueous solutions, the functional group like carboxyl (-COOH), hydroxyl(-OH) or amine($-NH_{2}$) one were compared each other. Among the functional group, the strength of the hydrogen bonding force order is amine, hydroxyl and carboxyl one. It supports that ethylene diamine 7 mass% solution including amine group was effective to suppress the ice adhesion, though it is corrosive. Also, the ice adhesion were effectively resisted and formed lots of ice slurries in cooling experiment of 7 mass% solution of 1, 2-and 1, 3-propanediol which is different molecular structure but equal molecular weight each other.

• 한국정밀공학회지
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• 제18권11호
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• pp.168-173
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• 2001

The chemical mechanical polishing (CMP) is generally consisted of pad, slurry including abrasives and so on. However, there are some problems in a general CMP: defects, a high Cost of Consumable (CoC), an environmental problem. The slurry including abrasives especially gives rise to not only increase a CoC, but also prohibition from achieving an eco-process. This paper introduces an abrasive capsulation pad to achieve an eco-process decreasing abrasives used is CMP. The binder wth a water a water swelling and a water soluble characteristic is used for an auto-conditioning, and the $CeO_2$abrasive is selected for an abrasive capsulation pad. Comparing with a conventional CMP, an abrasive capsulation pad appears good characteristics in ILD CMP and is able to achieve an eco-process decreasing wasted slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.651-652
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• 2005

Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in integrated circuit manufacturing. Especially, polishing pad is considered as one of the most important consumables because of its properties. Generally, conventional polishing pad has irregular pores and asperities. If conditioning process is except from whole polishing process, smoothing of asperities and pore glazing occur on the surface of the pad, so repeatability of polishing performances cannot be expected. In this paper, CMP pad with microstructure was made using micro-molding technology and repeatability of ILD(interlayer dielectric) CMP performances and was evaluated.

• 대한의용생체공학회:의공학회지
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• 제38권5호
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• pp.242-247
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• 2017

This study presents a bio-chemical energy harvesting system which can generate electric power from bioorganic substance contained in vermicompost. It produced electricity by inoculating microbial fuel cell(MFC) with earthworm-composted food waste. The generated electricity was converted into usable voltage level for mobile electronics through power conditioning circuits. The implemented prototype showed $200{\mu}W$ of maximum output electric power, which successfully supplied a beacon device which continuously transmitted data to nearby smartphone without a battery. The proposed system can help develop portable or bio-mimetic energy supply for sustainable use with further improvement.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2003년도 하계학술대회 논문집
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• pp.154-154
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• 2003

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.731-734
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. Polishing pads play a key role in CMP, which has been recognized as a critical step to improve the topography of wafers for semiconductor fabrication. It is investigated the performance of $SiO_2-CMP$ process using commercial silica slurry as a pad conditioning temperature increased after CMP process. This study also showed the change of SEM images in the pore geometry on the CMP pad surface after use with a different pad conditioning temperature.

• 한국전기전자재료학회논문지
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• 제20권10호
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.86-89
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• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.