• Bulletin of the Korean Chemical Society
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• v.9 no.6
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• pp.365-368
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• 1988

Coordination chemistry of organotin(IV) dithiocarbamate complexes has been examined in terms of far infrared and $^{119}Sn$-NMR spectroscopies. Although the Sn-S stretching vibrational bands of the complex could not be correlated with the bonding nature of the dithiocarbamate ligand, $^{119}Sn$ chemical shifts were sensitive enough to distinguish clearly the coordination number of tin, and as such the bonding mode of the dithiocarbamate ligand could be indentified to be monodentate or bidentate. Thus the $^{119}Sn$-NMR study on new cyclohexyltin(IV) dithiocarbamate complexes along with the known complexes suggests that the bonding mode of the dithiocarbamate ligands and the consequent coordination number of tin are determined mainly by the inductive effects of the organic groups attached to the tin atom.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.139-139
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• 2012

With angle resolved photoemission spectroscopy (ARPES), the surface electronic band structures of Pt3Co (111) and Pt3Ni (111) single crystals are investigated, which allow to study the bonding interaction between chemically absorbed atomic oxygen and its surfaces. The d-band electrons of subsurface TM are separated from the direct chemical bonding with atomic oxygen. That is, the TM does not contribute to direct chemical bonding with oxygen. From the density functional theory (DFT) calculations, it is identified that the main origin of improved oxygen absorption property, i.e. softening of Pt-O bonding, is due to the suppression of Pt surface-states which is generated from change of interlayer potential, i.e. charge polarization, between Pt-top and TM-subsurface. Our results point out the critical roles of subsurface TM in modifying surface electronic structures, which in turn can be utilized to tune surface chemical properties.

• Journal of the Korean Chemical Society
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• v.54 no.3
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• pp.275-282
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• 2010

2-Fluorocyclopropanemethanol and 2-chlorocyclopropanemethanol have been studied with MP2 and B3LYP methods with 6-311++G(d,p) basis set. The optimized structures show several stable conformers. The most stable conformer show the possibility of intramolecular hydrogen bonding, but the distance between $H{\cdots}F$, or $H{\cdots}Cl$ is longer than van der Waals radii and it may not be strong covalent bonding. Rather the second stable conformer has optimum structure for intramolecular hydrogen bonding but the energy of the conformer is 5 ~ 7 kJ higher than the most stable conformer. When the methanol group and the F or Cl atom have opposite direction, the conformers are less stable than the most stable conformer.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.1
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• pp.35-40
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• 2007

The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.39-45
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• 2000

A small camera module fabricated by including bare chip bonding methods is utilized to realize advanced mobile devices. One of the driving forces is the TOG (Tape On Glass) bonding method which reduces the packaging size of the image sensor clip. The TOG module is a new thinner and smaller image sensor module, using flip chip interconnection method with the ACP (Anisotropic Conductive Paste). The TOG production process was established by determining the optimum bonding conditions for both optical glass bonding and image sensor clip bonding lo the flexible PCB. The bonding conditions, including sufficient bonding margins, were studied. Another bonding method is the flip chip bonding method for DSP (Digital Signal Processor) chip. A new AC\ulcorner was developed to enable the short resin curing time of 10 sec. The bonding mechanism of the resin curing method was evaluated using FEM analysis. By using these flip chip bonding techniques, small camera module was realized.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Korean Chemical Society
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• v.32 no.3
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• pp.249-259
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• 1988

The solvent effects of MeOH-solvent dimers were studied via AM1 Hamiltonian and supermolecule methods. Methanol, ethanol, acetone, dimethylsulfoxide, N,N-dimethylformamide, tetrahydrofuran, dioxane, and acetonitrile were considered as solvent molecules. Optimized geometries, electron densities, molecular energies, and hydrogen-bonding energies of monomers and dimers were calculated. We found that the stabilization energies contributed to the hydrogen-bonding were decreased in the order of dimethylsulfoxide > ethanol > N,N-dimethylformamide > acetone > methanol > tatrahydrofuran > dioxane > acetonitrile, and this order was explained by using the change of electron density and energy partition functions.

• Journal of the Korean Wood Science and Technology
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• v.37 no.1
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• pp.87-93
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• 2009

Properties and chemical bonding of wood charcoal were investigated to understand the chemistry occurring in wood carbonization. From the pH changes of wood charcoal, it is revealed that it becomes acidic to weakly basic for charcoal carbonized at about $300^{\circ}C$, whereas it turns to basic at higher carbonization temperature higher than $600^{\circ}C$. Also, the ratio of carbon atoms in the charcoal was increased with increasing the carbonization temperature, while those of oxygen and hydrogen atoms. This tendency was significant when the carbonization temperature was increased up to $600^{\circ}C$ and the ratio changes of the atoms became stable at above $600^{\circ}C$. In the changes of chemical bonding, the ratio of C-C bonding was increased and those of C-O-H and C-O-R bonding was decreased significantly. It is considered that bondings connected to oxygen atoms tends to be broken, and the ratio of C-C bonding increased. Consequently, it is expected that this change may causes occurrence of new functional groups. In addition to that, it seems to be that the chemical bondings undergo the partial decomposition, formation, and recombination steps, Because ratio of C=O bonding tended to be increased or decreased by increasing the carbonization temperature. This understanding of chemical bond changes in charcoal can be a compensative consideration on the knowledges made only by physical parameters in the properties of micro-pore which has limited to explain the phenomenon. Also, it is considered that this can be treated as a basic knowledge for upgrading and development of use of wood charcoal.

• Bulletin of the Korean Chemical Society
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• v.33 no.8
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• pp.2592-2596
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• 2012

Cysteine capped silver nanoparticles (Cys-AgNPs) have been synthesized by employing electrochemically active biofilm (EAB), $AgNO_3$ as precursor and sodium acetate as electron donor in aqueous solution at $30^{\circ}C$. Cys-AgNPs of 5-10 nm were synthesized and characterized by UV-Vis, FT-IR, XRD and TEM. Capping of the silver nanoparticles with cysteine provides stability to nanoparticles by a thiolate bond between the amino acid and the nanoparticle surface and hydrogen bonding among the Cys-AgNPs. In addition, the antibacterial effects of as-synthesized Cys-AgNPs have been tested against two pathogenic bacteria Escherichia coli (O157:H7) and Pseudomonas aeruginosa (PAO1). The results demonstrate that the as-synthesized Cys-AgNPs can proficiently inhibit the growth and multiplication of E. coli and P. aeruginosa.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$