• Title/Summary/Keyword: Chemical bonding

Search Result 1,186, Processing Time 0.027 seconds

Sol-Gel Transition in Di-(2-ethylhexyl) phthalate-Plasticized Poly(vinyl chloride)

  • Lee, Chang-Hyung;Nah, Jae-Woon;Cho, Kil-Won;Kim, Seong-Hun;Hahn, Ai-Ran
    • Bulletin of the Korean Chemical Society
    • /
    • v.24 no.10
    • /
    • pp.1485-1489
    • /
    • 2003
  • The gelation for di-(2-ethylhexyl) phthalate (DEHP)-plasticized poly(vinyl chloride) was studied by measuring time-resolved small-angle X-ray scattering (SAXS) and a flow of the solutions in test tube. It was found that for the gelation there were three regimes. At Regime I, the solution rapidly changed to a gel, and the SAXS intensity showed a peak and the peak intensity increased, keeping the peak angle constant. Applying the SAXS intensity to the kinetic analysis of the liquid-liquid phase separation, it was revealed that the spinodal decomposition proceeded to develop a periodic length of 29.9 nanometer in size, a hydrogen-bonding-type association in polymer rich phase followed, and then it induced fast gelation rate. At Regime II, the gelation slowly occurred and the SAXS intensity was not observed, suggesting that a homogeneous gel network was formed by a hydrogen-bonding. At regime III, the solution was a homogeneous sol.

Evaluation on Undrained Shear Strength considering Consolidation Characteristics for Busan Clay (부산 점토의 압밀특성과 연계한 비배수전단강도 평가)

  • Kim, Ju-Hyun
    • Journal of the Korean Geosynthetics Society
    • /
    • v.16 no.3
    • /
    • pp.41-49
    • /
    • 2017
  • In this study, a series of laboratory and in-situ tests such as FVTs and CPTUs were carried out to evaluate undrained shear strength related to quasi overconsolidated characteristics in the near-surface clay at Busan new port. Using unconfined compression and field vane test results, correlation between undrained shear strength and effective overburden pressure, that is, equation of $10+0.262{\sigma}^{\prime}v_0$ (kPa) was obtained. From oedometer tests, OCR is around 1.9 at depths lower than 7 m and OCR below this depth is very close to unit. As stated by Hanzawa et al. (1983), a natural clay deposit in the near-surface, even in normally consolidated state, is more and less apparently overconsolidated due to aging effects such as chemical bonding. Based on this concept, it can be inferred that intercept of equation is mobilized due to chemical bonding irrespective of effective overburden pressure and strength incremental ratio in normally consolidated state is 0.262. From CPTU results, same trend was confirmed. The further study should be necessary to judge whether upper clay is under overconsolidated state due to chemical bonding or not based on the depositional environment.

A Correlation Study on Surface Contamination of Semiconductor Packaging Au Wire by Components of Rinse (반도체 패키지용 Au Wire의 표면처리용 린스 성분에 따른 표면오염 비교 연구)

  • Ha-Yeong Kim;Yeon-Ryong Chu;Jisu Lim;Gyu-Sik Park;Jiwon Kim;Dahee Kang;Yoon-Ho Ra;Suk Jekal;Chang-Min Yoon
    • Journal of Adhesion and Interface
    • /
    • v.25 no.2
    • /
    • pp.63-68
    • /
    • 2024
  • In this study, the contamination of gold(Au) wire according to the types of rinse applied for surface treatment in the wire bonding process is investigated and confirmed. For the surface treatment, rinses containing silicon(Si) or those based on organic materials are mainly employed. To identify their effects, surface treatment is conducted on Au wire using two types of rinse at a 1.0 wt% concentration, referred to as Si-including and Oil-based rinse-coated Au wire. Subsequently, a simulation experiment is performed to verify the reactivity of dust containing Si components that could occur in the semiconductor process. Through optical microscopy (OM) and scanning electron microscopy(SEM) analysis, it is observed that a larger amount of dust is adsorbed on the surface of Si-including rinse-coated Au wire compared with the Oil-based rinse-coated Au wire. This is attributed that the rinse containing Si components is relatively polar, causing polar interactions with dust, which also has polarity. Therefore, it is expected that using a rinse without Si components can reduce contamination caused by dust, thereby decreasing the defect rate in the practical wire bonding process.

Cu/SiO2 CMP Process for Wafer Level Cu Bonding (웨이퍼 레벨 Cu 본딩을 위한 Cu/SiO2 CMP 공정 연구)

  • Lee, Minjae;Kim, Sarah Eunkyung;Kim, Sungdong
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.20 no.2
    • /
    • pp.47-51
    • /
    • 2013
  • Chemical mechanical polishing (CMP) has become one of the key processes in wafer level stacking technology for 3D stacked IC. In this study, two-step CMP process was proposed to polish $Cu/SiO_2$ hybrid bonding surface, that is, Cu CMP was followed by $SiO_2$ CMP to minimize Cu dishing. As a result, Cu dishing was reduced down to $100{\sim}200{\AA}$ after $SiO_2$ CMP and surface roughness was also improved. The bonding interface showed no noticeable dishing or interface line, implying high bonding strength.

The Surface Property and Shear Bonding Strength according to Composition of Ni-Cr alloy for Porcelain Fused to Metal Crown (도재용착주조관용 Ni-Cr계 합금의 조성에 따른 표면특성 및 전단결합강도 관찰)

  • Kim, Kap-Jin;Chung, In-Sung;Choi, Sung-Min
    • Journal of Technologic Dentistry
    • /
    • v.35 no.2
    • /
    • pp.113-120
    • /
    • 2013
  • Purpose: This study was to observe surface property and bonding strength according to composition of Ni-Cr alloy for porcelain fused to metal crown. The two kinds of Ni-Cr alloy with different composition ratio of parent metal were observed general properties and chemical properties of each alloy surface and measured the shear bonding strength between ceramic and each alloys. The aim of study was to suggest the material for design of parent metal's composition ratio to development of alloy for porcelain fused to metal crown. Methods: The two kinds of alloy as test specimen was Ni(71wt.%)-Cr(12wt.%) and Ni(63wt.%)-Cr(23wt.%) alloy. The oxide on surface was observed by SEM and EDX. And the shear test was performed by MTS. Results: The surface property and oxide characteristic analysis of oxide layer, weight percentage of Element O within $Ni_{71}Cr_{12}$ alloy measured 12.74wt.%, but $Ni_{63}Cr_{23}$ alloy was measured 15.91wt.%. And the maximum shear bonding strength was measured 106.14MPa between $Ni_{71}Cr_{12}$ alloy and vintage halo (VV group). Conclusion: The surface property and oxide characteristic of $Ni_{71}Cr_{12}$ alloy was similar to $Ni_{63}Cr_{23}$ alloy. And VV group has the strongest shear bonding strength.

A Study of Atmospheric Plasma Treatment on Surface Energetics of Carbon Fibers

  • Park, Soo-Jin;Chang, Yong-Hwan;Moon, Cheol-Whan;Suh, Dong-Hack;Im, Seung-Soon;Kim, Yeong-Cheol
    • Bulletin of the Korean Chemical Society
    • /
    • v.31 no.2
    • /
    • pp.335-338
    • /
    • 2010
  • In this study, the atmospheric plasma treatment with $He/O_2$ was conducted to modify the surface chemistry of carbon fibers. The effects of plasma treatment parameters on the surface energetics of carbon fibers were experimentally investigated with respect to gas flow ratio, power intensity, and treatment time. Surface characteristics of the carbon fibers were determined by X-ray photoelectron spectroscopy (XPS), scanning electron microscope (SEM), Fourier transform infrared (FT-IR), Zeta-potential, and contact angle measurements. The results indicated that oxygen plasma treatment led to a large amount of reactive functional groups onto the fiber surface, and these groups can form together as physical intermolecular bonding to improve the surface wettability with a hydrophilic polymer matrix.

A Novel One-Pot Synthesis of Quinoxaline Derivatives in Fluorinated Alcohols

  • Khaksar, Samad;Rostamnezhad, Fariba
    • Bulletin of the Korean Chemical Society
    • /
    • v.33 no.8
    • /
    • pp.2581-2584
    • /
    • 2012
  • Hexafluoroisopropanol (HFIP) is explored as an effective medium for the synthesis of quinoxaline derivatives in high yields at room temperature. The solvent (HFIP) can be readily separated from reaction products and recovered in excellent purity for direct reuse.

Arnoldi Algorithm for the Simulation of Multidimensional Infrared Spectroscopy

  • Hayashi, Tomoyuki;Mukamel, Shaul
    • Bulletin of the Korean Chemical Society
    • /
    • v.24 no.8
    • /
    • pp.1097-1101
    • /
    • 2003
  • The cubic and quartic anharmonic force field of malonaldehyde is calculated using density functional theory at the B3LYP/6-31G(d,p) level, and used to simulate coherent infrared vibrational spectra. 12 normal modes are included in the simulation, and the Arnoldi method is employed for the diagonalization of the Hamiltonian. The calculated three pulse infrared signals in the k1 + k2 - k3 direction show signatures of the intramolecular hydrogen bond couplings between the C=O stretch, H-O-C bend and O-H stretch vibrations.

Regiospecific Protein Perturbation on F NMR Shifts and Photoisomerization of Fluororhodopsins. An Interpretation Based on Recent Crystal Structures of Rhodopsin

  • Colmenares, Letica U.;Liu, Robert S.H.
    • Journal of Photoscience
    • /
    • v.10 no.1
    • /
    • pp.81-87
    • /
    • 2003
  • Based on structural information provided by recently reported crystal structures of rhodopsin, we present rationales for the regiospecific protein perturbation on the previously reported $\^$19/F chemical shifts of the vinyl and trifluoromethylrhodopsins and their photoproducts. The crystal structures also suggest that H-bonding is a likely cause for the earlier reported regiospecific photoisomerization of the 10-fluororhodopsins. Photoisomerization was revealed by chemical shift of the photoproducts. Additionally, possible use of 3-bond F,F coupling constants for following photoisomerization of retinal-binding proteins is discussed.

  • PDF