• Title/Summary/Keyword: Characteristic inspection

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The Area Segmentation Pattern Matching for COG Chip Alignment (COG 칩의 얼라인을 위한 영역분할 패턴매칭)

  • KIM EUNSEOK;WANG GI-NAM
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.9 no.6
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    • pp.1282-1287
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    • 2005
  • The accuracy of chip alignment in inferior product inspection of COG(Chip On Glass) to be measured a few micro unit is very important role since the accuracy of chip inspection depends on chip alignment. In this paper, we propose the area segmentation pattern matching method to enhance the accuracy of chip alignment. The area segmentation pattern matching method compares, and matches correlation coefficients between the characteristic features within the detailed area and the areas. The three areas of pattern circumference are learned to minimize the matching error by bad pattern. The proposed method has advantage such as reduction of matching time, and enhanced accuracy since the characteristic features are searched within the segmented area.

Wavelet Analysis to Real-Time Fabric Defects Detection in Weaving processes

  • Kim, Sung-Shin;Bae, Hyeon;Jung, Jae-Ryong;Vachtsevanos, George J.
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • v.2 no.1
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    • pp.89-93
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    • 2002
  • This paper introduces a vision-based on-line fabric inspection methodology of woven textile fabrics. Current procedure for determination of fabric defects in the textile industry is performed by human in the off-line stage. The advantage of the on-line inspection system is not only defect detection and identification, but also 벼ality improvement by a feedback control loop to adjust set-points. The proposed inspection system consists of hardware and software components. The hardware components consist of CCD array cameras, a frame grabber and appropriate illumination. The software routines capitalize upon vertical and horizontal scanning algorithms characteristic of a particular deflect. The signal to noise ratio (SNR) calculation based on the results of the wavelet transform is performed to measure any deflects. The defect declaration is carried out employing SNR and scanning methods. Test results from different types of defect and different style of fabric demonstrate the effectiveness of the proposed inspection system.

A study on the Automatic Detection of the Welding Dimension Defect of Steel Construct using Digital Image Processing (디지털 화상처리에 의한 강.구조물의 용접부 치수 결함 검출의 자동화에 관한 연구)

  • Kim, Jae-Yeol;You, Sin;Park, Ki-Hyung
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.8 no.3
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    • pp.92-99
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    • 1999
  • The inspection unit which is developed and used in this study, is processed the shape data from the CCD camera to seek welding bite section shape, and then calculated as a real dimension from measuring the value of each inspection item. The reason of measuring with the real in this study is came out from the image method which used for a long time, which is extricated the characteristic as the dimension of pixel by recognize pixel. The measurement method of the section shape is that we decide the thresholding value after we drew the histogram to binarizate the object. After that, we make flat the object to get rid of the noise and measure the shape of welded part through the boundarization of the object. The shape measurement is that measure the value of the welding part to adapt the actual operation program from using the ratio between the actual dimension of the standard specimen and the dimension of image, to measure the ratio between the actual product and the camera image. The inspection algorithm which estimates the quality of welded product is developed and also, the software GUI(Graphic User Interface) which processes the automatic test function of the inspection system is developed. We make the foundation of the inspection automatic system and we will help to apply other welding machine.

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Classification Technique for Ultrasonic Weld Inspection Signals using a Neural Network based on 2-dimensional fourier Transform and Principle Component Analysis (2차원 푸리에변환과 주성분분석을 기반한 초음파 용접검사의 신호분류기법)

  • Kim, Jae-Joon
    • Journal of the Korean Society for Nondestructive Testing
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    • v.24 no.6
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    • pp.590-596
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    • 2004
  • Neural network-based signal classification systems are increasingly used in the analysis of large volumes of data obtained in NDE applications. Ultrasonic inspection methods on the other hand are commonly used in the nondestructive evaluation of welds to detect flaws. An important characteristic of ultrasonic inspection is the ability to identify the type of discontinuity that gives rise to a peculiar signal. Standard techniques rely on differences in individual A-scans to classify the signals. This paper proposes an ultrasonic signal classification technique based on the information tying in the neighboring signals. The approach is based on a 2-dimensional Fourier transform and the principal component analysis to generate a reduced dimensional feature vector for classification. Results of applying the technique to data obtained from the inspection of actual steel welds are presented.

Detection of Flip-chip Bonding Error Through Edge Size Extraction of X-ray Image (X선 영상의 에지 추출을 통한 플립칩 솔더범프의 접합 형상 오차 검출)

  • Song, Chun-Sam;Cho, Sung-Man;Kim, Joon-Hyun;Kim, Joo-Hyun;Kim, Min-young;Kim, Jong-Hyeong
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.9
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    • pp.916-921
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    • 2009
  • The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

Determining the most profitable process mean for a production process where rejected item is sold at a reduced price or reworked (불합격 제품을 재가공하거나 할인판매하는 생산공정에 대한 공정평균의 경제적 결정)

  • 이민구;최인수;하태용
    • Journal of Korean Society for Quality Management
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    • v.26 no.3
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    • pp.46-59
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    • 1998
  • The problem of selecting optimal target values for the mean of the quality characteristic of interest for a production process in which an item is sold in one of two market with different profit / cost structures or reworked. Two profit models are constructed which involve four profit / cost components: profit, production, inspection, and rework costs. Assumed that the quality characteristic of interest is normally distributed, methods of finding the most profitable process mean are presented and a numerical example is given.

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An automated visual inspection of solder joints using 2D and 3D features (2차원 및 3차원 특징값을 이용한 납땜 시각 검사)

  • 김태현;문영식;박성한
    • Journal of the Korean Institute of Telematics and Electronics B
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    • v.33B no.11
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    • pp.53-61
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    • 1996
  • In this paper, efficient techniques for solder joint inspection have been described. Using three layers of ring shaped LED's with different illumination angles, three frames of images are sequentially obtained. From these images the regions of interest (soldered regions) are segmented, and their characteristic features including the average gray level and the percentage of highlights - refereed to as 2D features - are extracted. Based on the backpropagation algorithm of neural networks, each solder joint is classified intor one of the pre-defined types. If the output value is not in the confidence interval, the distribution of tilt angles-referred to as 3D features - is claculated, and the solder joint is classified based on the bayes classfier. The second classifier requires more computation while providing more information and better performance. The proposed inspection system has been implemented and tested with various types of solder joints in SMDs. The experimental results have verified the validity of this scheme in terms of speed and recognition rate.

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Determination of the Process Mean Based on Screening Variable with Inspection Error (스크리닝 변수를 이용한 공정 평균 설정 : 검사 오류가 있는 경우)

  • Seo, Young-Dae;Jang, Joong-Soon
    • Journal of Korean Society for Quality Management
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    • v.22 no.4
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    • pp.28-39
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    • 1994
  • This study is concerned with determination of an optimal target value in a filling process. Complete inspection procedures are widely used to improve outgoing quality of products. In many cases, however, it may be impossible or noneconomical to measure the quality characteristic, performance variable, directly. In such cases, it is a common practice to select an easily measurable variable which is highly correlated with the performance variable and perform screening products for the variable. This study proposes a model to determine the target value and the inspection rule based on the screening variable. This, study deals with the cases in which rejected products would be scrapped and sold at a reduced price in secondary markets.

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A Study on the Application of Image Processing Algorithm for Paper-cup Inner Defect Inspection (종이컵 내면불량 검사를 위한 영상처리 알고리즘 응용에 관한 연구)

  • Eom, Ki-Bok;Kim, Yong;Lee, Kyu-Hun;Kwon, Soon-Do;Yoon, Suk-Ho
    • Proceedings of the KIEE Conference
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    • 2002.07d
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    • pp.2521-2524
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    • 2002
  • In this paper, We propose an Image processing algorithm for a paper-cup inner defect inspection. First, we devide a cup image to four sections considering the characteristic of a cup and filter noises limit by using the flood-fill algorithm and median filter. Second, to obtain the clearer inspection result of the edge point inner cup, We apply the sharpening convolution filer to the objected inspect the edge points by using the LOG edge detector. Third, executing sub-pixel operation with the orignal image, we find the defect parts in the cup. Finally, denoting the inspected defect parts as rectangular, we recompose the images of the defected ones.

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Management Criteria of Underground Strage Tank for Prevention of Soil Contamination (토양오염방지를 위한 지하저장탱크의 관리 방안 연구)

  • Kim, Joon Hyun;Han, Young Han
    • Journal of Industrial Technology
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    • v.18
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    • pp.453-460
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    • 1998
  • The purpose of this study was to analyze their status of underground storage tank(UST) facilities and level of soil contamination, and to establish its management criteria. DB program was developed to analyze the correlation between specific characteristic of UST and level of soil contamination. For a suitable management of UST, leakage monitoring and inspection method of UST was investigated. Inspection period was established based on the leakage rate. The most dominant factor for leakage seemed to be caused by the corrosion. Therefore, main factor, construction method and installation year of UST, and corrosion protection system were suggested for optimal protection of UST. Considering the present management status of UST in Korea, inspection and management criteria of UST should be accomplished in term of contamination protection of leakage, and flexible regulation act should be introduced for each specific site.

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