• Journal of the Korean Ceramic Society
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• v.39 no.5
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• pp.438-445
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• 2002

In this study, the glass frit of $PbO-TiO-2-SiO_2-BaO-ZnO-Al_2O-3-CaO-B_2O_3-Bi_2O_3-MgO$ system was manufactured. The glass was melted at $1,400{\circ}C$, quenched and attrition-milled. The glass frit powder was pressed and fired for 2h at the range of $750~1,000{\circ}C$. The crystallization of glass frit began at about $750{\circ}$ and at low temperature, the main crystal phases were hexagonal celsian($BaAl_2Si_2O_8$) and alumina. As the firing temperature increased, the crystal phases of monoclinic celsian, zinc aluminate, zinc silicate, calcium titanium silicate and titania appeared. And the increase of firing temperature led to transformation of hexagonal celsian to monoclinic. The only glass frit containing 15wt% PbO had the crystal phase of solid solution of $PbTiO_3-CaTiO_3$. At the frequency of 1 MHz, the dielectric constant of glass frit crystallized was in the range of 11~16 and the dielectric loss less than 0.020. But the glass frit containing 15wt% PbO had the dielectric constant of 17~26 and loss of 0.010~0.015 because of crystal phase of solid solution of $PbTiO_3-CaTiO_3$.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.238-243
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• 2013

We investigated the effect of Pb-metal filler added to a hybrid paste(PbO-$Bi_2O_3-B_2O_3$-ZnO glass frit and Pb-powder), for joining flip-chip sat lower temperatures than normal. The glass transition temperature was detected at $250^{\circ}C$ and the softening point occurred at $330^{\circ}C$. As the temperature increased, the specific density decreased due to the volatility of the Pb-metal and boron component in the glass. When the glass was heat-treated at $350^{\circ}C$ for 5 min, XRD results revealed a crystalline $Pb_4Bi_3B_7O_{19}$ phase that had been initiated by the addition of Pb-filler in the hybrid paste. The addition of the Pb-metal filler caused are action between the Pb-metal and glass that accelerated the formation of the liquid phase. The liquid phase that formed, promoted bonding between the flip-chip substrate sat lower temperature.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.17-22
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• 2004

In this study, BNT($BaO-Nd_{2}O_3-TiO_2$) and $70P_{2}O_5-5B_{2}O_3-(25-x)BaO-xNa_{2}O$ glass-ceramic composites were fabricated and investigated in order to apply for low temperature cofired ceramic. The prepared BNT based glass-ceramic composites were sintered at $800{\sim}950^{\circ}C$ with the glass fit contents ranging from 10 to $15\;wt\%$. The properties such as sintering and dielectric property were investigated in the ceramic compositions according to the phosphate glass frit. The dielectric constant was varied between 10 to 40 and shrinkage rate was increased according to increasing glass frit.

• Journal of the Korean Ceramic Society
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• v.26 no.5
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• pp.677-681
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• 1989

On the preparation of silica glass by sol-gel process, we used fine powder of silica gel to prevent cracking. In this case, the best condition of silica glass preparation is the contents of 10~40wt% seed and the gelation time of solution in contract. The dried gels conversed to silica glass by heat treatment up to 125$0^{\circ}C$.

• Journal of the Korean Ceramic Society
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• v.28 no.4
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• pp.324-328
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• 1991

Monolithic silica gel and glass were prepared from TMOS solution with high concentration of HCl. Appearance of the dried gels and gelation time varied with content of HCl and H2O were observed in the TMOS-CH3OH-HCl-H2O system. The conversion from gel to glass during heat treatment stage was investigated using TG-DTA, XRD, IR and SEM and characteristics of the gel were examined by measuring bulk density, linear shrinkage and Vicker's hardness. A transparent silica glass was prepared from the gel after heat treatment at 1050℃.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.613-618
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• 2009

We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

• Applied Chemistry for Engineering
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• v.10 no.3
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• pp.394-399
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• 1999

As the prosthetic application of natural mineral substituted for chemical reagent, composites and a glass-ceramics containing hydro-xyapatite isolated from tuna bone were prepared by solid state reaction. On x-ray examinations, the major phases of composites were identified as pseudowollastonite(${\alpha}-CaSiO_3$) and ${\beta}$-tricalcium phosphate($\beta$-TCP) and the phase of a glass-ceramics was observed as $\beta$-TCP and fluoroapatite caused by $CaF_2$ respectively. SEM images depict that the microstructures of grain at the composites were a function of temperature. The measured strength of a glass-ceramics prepared at $900^{\circ}C$ for 4 hr in air was 90 MPa as a 4-point bending method and this value was similar to the cortical bone, as 50~150 MPa but it was lower than its maximum strength.

• Journal of the Korean Ceramic Society
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• v.29 no.6
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• pp.451-458
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• 1992

Dense glass-ceramics for low firing temperature substrate were prepared by addition of CeO2 flux to the glass of MgO-Al2O3-SiO2 system. Glass powders were fabricated by melting at 150$0^{\circ}C$ and ball milling. Glass powder compacts were sintered at 800~100$0^{\circ}C$ for 3h. The crystallization and the shrinkage behaviors of glass powder compacts were analyzed by XRD, DTA and TMA. The shrinkage of glass powder compact increased with increasing the amount of CeO2. Because the softening temperature decreased and the crystallization temperature increased with increasing the amount of CeO2. Apparently, addition of CeO2 prevented formation of $\mu$-cordierite phase from the glass-ceramics and improved formation of $\alpha$-cordierite phase. Therefore crystallization properties were enhanced.

• Journal of the Korean Ceramic Society
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• v.37 no.6
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• pp.545-551
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• 2000

Sintering behaviors of the glass-alumina composites for low firing temperature were investigated as a function of the particle size of glass frit. The system of glass frit was Pb-B-Si-Al-O. The median particle sizes of the glass frits were 2.72$\mu\textrm{m}$, 2.67$\mu\textrm{m}$ and 1.33$\mu\textrm{m}$, which were prepared with changing ball-milling times as 24 h, 48 h and 96 h. The glass-alumina composites showed maximum density at certain temperature, and further heating led to dedensification behaviors, so called over-firing. The sintering temperature, which showed maximum density, raised from 425$^{\circ}C$ to 475$^{\circ}C$ with increase of particle size of glass frit from 1.33$\mu\textrm{m}$ to 2.72$\mu\textrm{m}$. Especially, the over firing behaviors, which were occurred at high sintering temperatures, were greatly increased with decrease of particle size of glass frit.