• Title/Summary/Keyword: Capacity Probe

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Capacity Planning and Control of Probe Process in Semiconductor Manufacturing (반도체 Probe 공정에서의 생산 능력 계획)

  • Jeong, Bong-Ju;Lee, Young-Hoon
    • IE interfaces
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    • v.10 no.1
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    • pp.15-22
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    • 1997
  • In semiconductor manufacturing, the probe process between fabrication and assembly process is constrained mostly by the equipment capacity because most products pass through the similar procedures. The probe process is usually performed in a batch mode with relatively short cycle times. The capability of the probe process can be determined by the optimal combination of the equipments and the products. A probe line usually has several types of equipment with different capacity. In this study, the probe line is modeled in terms of capacity to give the efficient planning and control procedure. For the practical usage, the hierarchical capacity planning procedure is used. First, a monthly capacity plan is made to meet the monthly production plan of each product. Secondly, the daily capacity planning is performed by considering the monthly capacity plan and the daily fabrication output. Simple heuristic algorithms for daily capacity planning are developed and some experimental results are shown.

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The Capacity of Applying Electrical Resistance Probe in Natural Corrosion Tests of Vietnam

  • Pham, Thy San;Le, Thi Hong Lien;Le, Quoc Hung
    • Corrosion Science and Technology
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    • v.2 no.2
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    • pp.98-101
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    • 2003
  • The Electrical Resistance Probe of carbon steel and weight loss coupons were exposed in atmosphere and in the lake water of Hanoi. The comparison of data received by two methods after one year exposure was presented. The correspondence of the data of these methods on the exposure time in both environments showed a capacity of using Electrical Resistance Probe in Vietnamese natural corrosion testing of Carbon steel.

The simultaneous measurement for thermal properties of liquids using transient probe method (과도탐침법을 이용한 액체의 열물성 동시측정)

  • Bae, Sin-Cheol;Kim, Myeong-Yun
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.21 no.2
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    • pp.303-315
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    • 1997
  • The theoretical model for the transient probe method is the modified Jaeger model which is used perfect line source theory. The transient probe technique has been developed for the simultaneous determination of thermal conductivity, diffusivity and volumetric heat capacity of liquids. The Levenberg-Marquardt iteration method is adapted to obtain thermal property within nonlinear range. Experimental results of liquids were found to agree well with recommended thermal property data.

Development of 121 pins/mm2 High Density Probe Card using Micro-spring Architecture (마이크로 스프링 구조를 갖는 121 pins/mm2 고밀도 프로브 카드 제작기술)

  • Min, Chul-Hong;Kim, Tae-Seon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.20 no.9
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    • pp.749-755
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    • 2007
  • Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

Design and analysis of slider and suspension in 4${\times}$l near-field probe array

  • Hong Eo-Jin;Oh Woo-Seok;Jung Min-Su;Park No-Cheol;Yang Hyun-Seok;Park Young-Pil;Lee Sung-Q;Park Kang-Ho
    • 정보저장시스템학회:학술대회논문집
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    • 2005.10a
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    • pp.47-52
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    • 2005
  • A lot of information storage devices have been introduced and developed for recently years. The trends of those devices are high capacity, compact size, low power consumption, reliability, and removability for data interchange with other device. As a satisfaction of these trends, near-field technique is in the spotlight as the next generation device. In order for a near-field recording to be successfully implemented in the storage device, a slider and suspension is introduced as actuating mechanism. The optical slider is designed considering near-filed optics. Suspension is not only supports slider performance, and tracking servo capacity but also meets the optical characteristics such as tilt aberration, and guarantee to satisfy shock performances for the mobility fir the actuator. In this study, the optical slider and the suspension for near-field probe array are designed and analyzed considering dynamic performance of head-gimbal assembly and shock simulation..

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Analysis of OPEN LOOP Power Control in CDMA Reverse Link (CDMA 역방향 링크에서 OPEN LOOP 전력제어 알고리즘 분석)

  • 이철희;박종안
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.22 no.4
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    • pp.804-811
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    • 1997
  • In the CDMA mobile communication system, reverse power control can be used to minimize the interference level for a good quality of the voice channel, and used to maxmize the system capacity. In this paper, we have analyed the environment of the K-parameter and the access procedure for the mobile station, and proposed a new algorithm for the access probe procedure of the station. K-parameter is determined according to the environment of the base station and access probe can adaptively control the power according to the position changes of the mobile station or the rapid and various state changes of the channel. Simulation results in the limited test environment show that it can increase the system capacity and decrease the power comsumption of the mobile station while maintaining the good and stable quality of the voice channel.

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Design of the Slider and Suspension for 4 × 1 Near-field Probe Array in Micro Optical Disk Drives (마이크로 광디스크 드라이브용 4 × 1 근접장 탐침 어레이를 위한 슬라이더와 서스펜션의 설계)

  • Hong, Eo-Jin;Jung, Min-Su;Oh, Woo-Seok;Park, No-Cheol;Yang, Hyun-Seok;Park, Young-Pil
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.15 no.2 s.95
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    • pp.184-191
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    • 2005
  • The near-field scanning micro scope (NSOM) technique is in the spotlight as the next generation storage device. Many different types of read/write mechanism for NSOM have been introduced in the literature. In order for a near-field probe to be successfully implemented in the system, a suitable slider and suspension are needed to be properly designed. The optical slider is designed considering near-filed optics and probe array. The suspension generally supports slider performance, and tracking servo capacity in HDD. Moreover, the suspension for optical slider also should meet the optical characteristics, and is also required to satisfy shock performances for the mobility for the actuator. In this study, the optical slider and the suspension for near-field probe array are designed and analyzed.

Design of the Slider and Suspension for 4x1 Near-field Probe Array in Micro Optical Disk Drives (마이크로 광디스크 드라이브용 4x1 근접장 탐침 어레이를 위한 슬라이더와 서스펜션의 설계)

  • Hong, Eo-Jin;Jung, Min-Su;Oh, Woo-Seok;Park, No-Cheol;Yang, Hyun-Seok;Park, Young-Pil
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2004.11a
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    • pp.393-398
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    • 2004
  • The near-field scanning micro scope (NSOM) technique is in the spotlight as the next generation storage device. Many different types of read/write mechanism for NSOM have been introduced in the literature. In order for a near-field probe to be successfully implemented in the system, a suitable slider and suspension are needed to be properly designed. The optical slider is designed considering near-filed optics and probe array. The suspension generally supports slider performance, and tracking servo capacity in HDD. Moreover, the suspension for optical slider also should meet the optical characteristics, and is also required to satisfy shock performances for the mobility for the actuator. In this study, the optical slider and the suspension fer near-field probe array are designed and analyzed.

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A Photosensitive Glass Chip for DNA Purification of Nucleic Acid Probe Assay

  • Kim, Joon-Ho;Kim, Byung-Gyun;Yoon, Jun-Bo;Euisik Yoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.1 no.4
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    • pp.232-238
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    • 2001
  • A new DNA purification chip is proposed and fabricated for the sample preparation of Nucleic Acid (NA) probe assay. The proposed DNA purification chip is fabricated using photosensitive glass substrate and polydimethylsiloxane (PDMS) cover fixture. We have successfully captured and eluted the DNA using the fabricated photosensitive glass chip. The fabricated DNA purification chip showed a binding capacity of $15ng/\textrm{cm}^2$and a minimum extractable input concentration of $100copies/200\muL$. The proposed DNA purification chip can be applied for low-cost, disposable sample preparation of NA probe assays.

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Development of a scratch tester using a two-component force sensor (2축 힘센서를 이용한 스크레치 테스트 개발)

  • 김종호;박연규;이호영;박강식;오희근
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1018-1021
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    • 2003
  • A scratch tester was developed to evaluate the adhesive strength at interface between thin film and substrate(silicon wafer). Under force control, the scratch tester can measure the normal and the horizontal forces simultaneously as the probe tip of the equipment approaches to the interface between thin film and substrate of wafer. The capacity of each component of force sensor is 0.1 N ∼ 100 N. In addition, the tester can detect the signal of elastic wave from AE sensor(frequency range of 900 kHz) attached to the probe tip and evaluate the bonding strength of interface. Using the developed scratch tester. the feasibility test was performed to evaluate the adhesive strength of semiconductor wafer.

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