• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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• pp.194-198
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• 2000

In this paper, we developed a Windows 98 version off-line programming system which can simulate a track vehicle model in 3D graphics space. The track vehicle was adopted as an objective model. The interface between users and the off-line program system in the Windows 98' graphic user interface environment was also studied. The developing language is Microsoft Visual C++. Graphic libraries, OpenGL, by Silicon Graphics, Inc. were utilized for 3D graphics.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.69.4-69
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• 2001

In this paper, we developed a Windows 98 version of off-line programming system which can simulate a track vehicle model in 3D graphics space. The track vehicle was adopted as an objective model. The interface between users and the off-line program system in the Windows 98´s graphic user interface environment was also studied. The developing language is Microsoft Visual C++. Graphic libraries, OpenGL, by Silicon Graphics, Inc. were utilized for 3D Graphics.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.305-305
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• 2000

In this paper, we developed a Windows 98 version off-line programming system which can simulate a track vehicle model in 3D graphics space. The track vehicle was adopted as an objective model. The interface between users and the off-line program system in the Windows 98's graphic user interface environment was also studied. The developing language is Microsoft Visual C++. Graphic libraries, OpenGL, by Silicon Graphics, Inc. were utilized for 3D Graphics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.129-129
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• 1998

Most of the surface/interface analysis tools have limited depth profiling c capability in terms of the profiling range and the depth resolution. However, M MEIS can profile the surface and subsurface composition and structure q quantitatively and non-destructively with atomic layer depth resolution. I In this presentation, the MEIS system developed at KRISS will be briefly d described with an introduction on the principle of MEIS. Recent MEIS r results on the surface and interface composition and structural change due to i ion bombardment will be presented for preferential sputtering of T:없Os and d damage depth profiles of SHooD, Pt(l11), and Cu(l1D due to Ar+ ion b bombardment. Direct observation of strained Si lattices and its distribution i in the SHool)-SiCh interface and the initial stage of Co growth on Pt(l11) w will be reported. H surfactant effects on epitaxial growth of Ge on Si(ooD w will be discussed with STM results from SND.

• 제어로봇시스템학회논문지
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• 제13권8호
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• pp.735-742
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• 2007

The importance of the interaction capability of a robot increases as the application of a robot is extended to a human's daily life. In this paper, a portable mediate interface Handybot is developed with various interaction channels to be used with an intelligent home service robot. The Handybot has a task-oriented channel of an icon language as well as a verbal interface. It also has an emotional interaction channel that recognizes a user's emotional state from facial expression and speech, transmits that state to the robot, and expresses the robot's emotional state to the user. It is expected that the Handybot will reduce spatial problems that may exist in human-robot interactions, propose a new interaction method, and help creating rich and continuous interactions between human users and robots.

• 시스템엔지니어링학술지
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• 제4권2호
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• pp.55-61
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• 2008

In this paper, there is the case study which assesses the systems engineering capability maturity of the safety organization that performs the Railway Safety project using systems engineering method. To In ore effective and efficient a research and development to railway safety domain, a new research and development method can be progressively needed such as systems engineering. To assess quantitatively research of systems engineering efforts in the railway safety project, SECM(EIA/IS 731) Standard is utilized in the paper. It is by questionnaire that the capability maturity assessment is executed wit h the safety organization and staffs who performs the systems engineering activities; requirement analysis and management, interface control management. product verification and validation, and so on. As a result, the systems engineering capability level of the safety organization rises from 0 level at the initial project to 2 level after two years and all staffs give an affirmative answer about the importance and effectiveness of the systems engineering approach.

• 한국콘텐츠학회논문지
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• 제21권11호
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• pp.543-552
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• 2021

마케팅-영업-인터페이스(MSI) 능력은 영업사원들이 시장에서의 지식과 경험을 보다 효과적으로 조직 내부 자원들과 소통하는 능력으로서 영업성과에 긍정적인 영향을 주는 것으로 알려져 있다. 본 연구는 제약회사 영업사원의 마케팅-영업-인터페이스(MSI) 능력이 직무만족도를 통해 영업성과에 영향을 미치는 매개효과를 분석하였다. 전국 제약회사 5곳의 영업사원을 대상으로 2021년 4월 15일부터 4월 23일까지 설문조사를 실시하였으며, 총 257부를 최종 분석에 사용하였다. 분석 결과 영업사원이 지각하는 MSI능력은 직무만족도 및 영업성과에 통계적으로 유의한 정(+)의 영향을 보였다. 또한 제약회사 영업사원이 지각하는 MSI능력은 직무만족도를 매개하여 영업성과에 통계적으로 유의한 정(+)의 영향을 보였다. 분석결과는 제약회사 영업사원의 영업성과 향상을 위해 MSI능력과 직무만족도의 중요성을 시사하며, 직무만족도의 매개효과에 주목하여 영업사원 관리와 관련된 방안 마련이 필요함을 보여준다.

• 한국통신학회논문지
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• 제37C권11호
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• pp.1162-1169
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• 2012

Mission critical 임무를 수행하는 Ethernet 기반 첨단 네트워크 시스템에서 자동 고장 극복 기능은 시스템의 중단 없는 운용을 위한 중요한 요구사항 중의 하나이다. 이러한 고장 극복 기능은 네트워크 시스템의 각 노드에 멀티 port를 지원하는 네트워크 인터페이스 카드 (Network Interface Card, NIC)를 설치함으로써 가능하다. 현재 가용한 NIC 장치는 두 개 또는 그 이상의 MAC (Media Access Control)을 사용하여, active port 고장 시에 MAC switching하여 자동 고장 극복 기능을 수행한다. 이러한 NIC 장치는 일반적으로 co-processor 및 이를 위한 펌웨어 (firmware)를 필요로 하며, 이에 따라 고장 극복 시간이 길어지고 throughput이 저하되는 단점이 있다. 또한 co-processor를 위한 펌웨어는 전술 환경 변화에 따라 upgrade를 해야 하므로 고장 극복 장치 가격도 상승하게 한다. 본 논문은 기존 하드웨어 방식에서 일반적으로 사용하는 co-processor와 다수 MAC 대신에, 하나의 MAC 만을 사용하는 새로운 하드웨어 방식 NIC 장치 설계 방안을 제시한다. 제시된 새로운 NIC은 단일 MAC과 일반 로직게이트 블럭으로 설계하여 고장 극복 기능을 수행한다. 제안 방식에 따라 NIC을 구현하여 성능 실험을 통해 기존 방식 대비 우수함을 입증하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 심포지엄 논문집 정보 및 제어부문
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• pp.203-205
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• 2005

A reactor protection system (RPS) plays the roles of generating the reactor trip signal and the engineered safety features (ESF) actuation signal when the monitored plant processes reach predefined limits. A Korean project group is developing a new digitalized RPS and the Cabinet Operator Module (COM) of the RPS which is used for the RPS integrity testing and monitoring by an equipment operator. A flat panel display (FPD) with a touch screen capability is provided as a main user interface for the RPS operation. To support the RPS COM user interface design, actually the FPD screen design, we developed a user interface style guide because the system designer could not properly deal with the many general human factors design guidelines. To develop the user interface style guide, various design guideline gatherings, a walk-though with a video recorder, guideline selection with respect to user interface design elements, determination of the properties of the design elements, discussion with the system designers, and a conversion of the properties into a screen design were carried out. This paper describes the process in detail and the findings in the course of the style guide development.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.247-251
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• 2002

In this paper the maximum current carrying capability of ACAs flip chip joint is investigated based on two failure mechanisms: (1) degradation of the interface between gold stud bumps and aluminum pads; and (2) ACA swelling between chips and substrates under high current stress. For the determination of the maximum allowable current, bias stressing was applied to ACAs flip chip joint. The current level at which current carrying capability is saturated is defined as the maximum allowable current. The degradation mechanism under high current stress was studied by in-situ monitoring of gold stud bump-aluminum pad ACA contact resistance and also ACA junction temperature at various current level. The cumulative failure distributions were used to predict the lifetime of ACAs flip chip joint under high current stressing. These experimental results can be used to better understand and to improve the current carrying capability of ACA flip chip joint.