• Journal of Adhesion and Interface
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• v.17 no.1
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• pp.7-14
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• 2016

Epoxy composites with concentrations of 5-70 wt% of silica particles were prepared in order to improve mechanical property and poor thermal stability. The mechanical and thermal properties were investigated and compared to the corresponding properties of neat epoxy composite. Furthermore, the effects of silane compound treatment on silica particles were observed by the experimental results of the tensile strength, glass transition temperature, and thermal stability of epoxy composite. Tensile strength of epoxy composites was measured by universal testing machine (UTM) and after that, the structure and morphology analysis of epoxy nanocomposites were analyzed by field emission scanning electron microscope (FE-SEM) and energy dispersive spectroscopy (EDS). The increased solid content of CA0030 particle improved the tensile strength of epoxy/ modified composites to give 30-50 MPa. The thermal expansion coefficients (CTE) of neat epoxy resin and epoxy/silica composites measured with a thermomechanical analyzer (TMA) showed that the incorporation of silica particles was helpful to reduce the CTE of neat epoxy resin.

• Polymer(Korea)
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• v.37 no.5
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• pp.557-562
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• 2013

The thermal expansion and mechanical properties of diglycidyl ether of bisphenol A (DGEBA) with mercaptan hardeners were studied by a comparative method with an amine-adduct type hardener. Thermal expansion and dynamic mechanical properties were measured by thermo mechanical analysis (TMA) and dynamic mechanical ananlysis (DMA), respectively. The $T_g$ and the coefficient of thermal expansion (CTE) of epoxy/amine-adduct type hardener system were $82.6^{\circ}C$ and 71.2 $ppm/^{\circ}C$, respectively. As the number of -SH functional group of mercaptan hardener increased, the $T_g$ rapidly decreased and gradually increased up to ca. $80^{\circ}C$ and the CTE under the $T_g$ rapidly increased to ca. 200 $ppm/^{\circ}C$ from 80 $ppm/^{\circ}C$ and decreased to ca. 100 $ppm/^{\circ}C$. The crosslinking density of epoxy with amine-adduct type hardener was ca.1.5 $mol/cm^3$, while that of epoxy with mercaptan hardeners increased from 1.0 to 1.7 $mol/cm^3$, as the number of -SH functional group increased. The storage modulus can increase up to 2700MPa at $30^{\circ}C$.

• Journal of the Korean Society of Food Science and Nutrition
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• v.30 no.6
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• pp.1184-1189
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• 2001

This study was conducted to investigate the effect of Hijikia fusiforme extracts on serum lipid and liver antioxidative enzyme activities in triton-induced hyperlipidemic rats. Sprague-Dawley male rats divided into 7 groups : We injected saline to a normal group (N), saline and tween 80 to control groups (CS, CT) and tot extracts to experimental groups (CSA, CTEtOH, CTE, CTH) for 7 days and then injected triton at the last day. Serum and liver free cholesterol contents were significantly lower in hexane-treated group (CTH) than control group (CT) whereas serum HDL-cholesterol content was higher in aqueous extract group (CSA) than control group (CS). Total cholesterol and phospholipid contents in serum and liver were lower in aqueous extract group (CSA) than control group (CS). Serum and liver triglyceride contents were significantly lower in ethanol (CTEtOH) and hexane treated group (CTH) than control group (CT). Thiobarbituric acid reactive substances of liver were lower in tot extract groups (CSA, CTEtOH, CTE, CTH) than control groups (CS, CT). Superoxide dismutase activities in liver were significantly lower in aqueous extracts group (CSA) and hexane treated group (CTH) than control groups (CS, CT). Liver catalase activity was the lowest in ethylacetate extract group. These results showed that some Hijikia fusiforme extracts have reduction effect of lipid and antioxidative effect in triton-induced hyperlipidemic rats.

• Journal of Adhesion and Interface
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• v.18 no.2
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• pp.68-74
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• 2017

Epoxy resins are widely used in various fields due to their excellent thermal, mechanical and chemical properties. In order to improve the mechanical properties of the epoxy composition after curing, various materials are mixed in the epoxy resin. Among the nano materials, CNT is the most widely used. However, CNT has limitations in terms of manufacturing process and manufacturing cost. Therefore, there is a growing interest in naturally occurring HNTs having similar structure to that of CNT. In this study, the thermal and mechanical properties of epoxy compositions containing HNTs treated with two types of silane compounds were investigated. The mechanical properties of silane-treated HNT were measured by using a universal testing machine. The differential scanning calorimeter (DSC), thermogravimetric analysis (TGA), and thermomechanical analysis (TMA) were used to measure thermal properties. As a result of the above tests, when the HNT was surface-treated with aminosilane, the tensile strength of the epoxy composition containing the HNT was higher than that of the epoxy composition containing epoxy silane treated HNT. The linear thermal expansion coefficients (CTE) obtained from the thermomechanical analysis of the two epoxy compositions for the comparison of dimensional stability showed that the HNT composition treated with aminosilane showed a lower value of CTE than that of epoxy composition including the pristine HNT.

• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.3
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• pp.67-74
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• 2011

Keys to high wiring density semiconductor packages include flip-chip bonding and build-up substrate technologies. The current issues are the establishment of a fine pitch flip-chip bonding technology and a low coefficient of thermal expansion (CTE) substrate technology. In particular, electromigration and thermomigration in fine pitch flipchip joints have been recognized as a major reliability issue. In this paper, electromigration and thermomigration in Cu/Sn-3Ag-0.5Cu (SAC305)/Cu flip-chip joints and electromigration in Cu/In/Cu flip chip joints are investigated. In the electromigration test, a large electromigration void nucleation at the cathode, large growth of intermetallic compounds (IMCs) at the anode, a unique solder bump deformation towards the cathode, and the significantly prolonged electromigration lifetime with the underfill were observed in both types of joints. In addition, the effects of crystallographic orientation of Sn on electromigration were observed in the Cu/SAC305/Cu joints. In the thermomigration test, Cu dissolution was accelerated on the hot side, and formation of IMCs was enhanced on the cold side at a thermal gradient of about $60^{\circ}C$/cm, which was lower than previously reported. The rate of Cu atom migration was found comparable to that of electromigration under current conditions.

• Carbon letters
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• v.22
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• pp.25-35
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• 2017

The aim of the work was to investigate the thermo-electrical properties of low cost and rapidly produced randomly oriented carbon/carbon (C/C) composite. The composite body was fabricated by combining the high-pressure hot-pressing (HP) method with the low-pressure impregnation thermosetting carbonization (ITC) method. After the ITC method step selected samples were graphitized at $3000^{\circ}C$. Detailed characterization of the samples' physical properties and thermal properties, including thermal diffusivity, thermal conductivity, specific heat and coefficient of thermal expansion, was carried out. Additionally, direct current (DC) electrical conductivity in both the in-plane and through-plane directions was evaluated. The results indicated that after graphitization the specimens had excellent carbon purity (99.9 %) as compared to that after carbonization (98.1). The results further showed an increasing trend in thermal conductivity with temperature for the carbonized samples and a decreasing trend in thermal conductivity with temperature for graphitized samples. The influence of the thickness of the test specimen on the thermal conductivity was found to be negligible. Further, all of the specimens after graphitization displayed an enormous increase in electrical conductivity (from 190 to 565 and 595 to 1180 S/cm in the through-plane and in-plane directions, respectively).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.12
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• pp.1157-1164
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• 2007

Ceramic honeycomb structures have performed successfully as catalyst supports for meeting hydrocarbon, carbon monoxide and nitrous emissions standards for gasoline-powered vehicles. Three-way catalyst converter has to withstand high temperature and thermal stress due to pressure fluctuations and vibrations. Thermal stress constitutes a major portion of the total stress which the ceramic catalyst support experiences in service. In this study, temperature distribution was measured at ceramic catalyst supports. Thermal durability was evaluated by power series dynamic fatigue damage model. Radial temperature gradient was higher than axial temperature gradient. Thermal stresses depended on direction of elastic modulus. Axial stresses are higher than tangential stresses. Tangential and axial stresses remained below thermal fatigue threshold in all engine operation ranges.