• Journal of the Korean Magnetics Society
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• v.11 no.5
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• pp.184-188
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• 2001

Using a DC-sputter and changing the substrate temperature to room temperature and 200$\^{C}$, we manufactured each Co-22%Cr alloy thin-films, which has a uniform micro-structure at room temperature, and a fine self-organized nato structure (SONS) at the inside of the grain at the elevated temperature. We also investigated the microstructure and domain structure using a transmission electron microscope (TEM) and a magnetic force microscope (MFM). We managed to corrode selectively Co-enriched phase, then investigate the microstructure using a TEM. We found that it has a uniform composition when it is manufactured at room temperature, but, we found that it has a unique microstructure, which has a plate-like fine Co-enriched phase, with the formation of SONS at the inside of the grain at the elevated temperature. In MFM characterization, we found maze-type domains at the period of 5000 when the substrate temperature maintains at room temperature. We define that the maze-type domain has a disadvantage at the high density recording because it generates noises easily as the exchange coupling energy between the grains is big. On the other hand, there is only a fine domain structure at the period of 500 when the substrate temperature maintains at 200 $\^{C}$. We define that the fine domain structure has an advantage at the high density magnetic recording because it has thermal stability due to small exchange coupling energy.

• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.164-169
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• 2017

Ni-Cr-X ternary interlayers were investigated to improve the adhesion of Cu/Ni-Cr/Polyimide flexible copper clad laminates. The ternary compounds are sputtered Ni-Cr-X films (where X is one of Nb, V, Mo, or Ti), and the effect of third elements on the adhesion was evaluated and investigated chemically and mechanically. The feel strength was higher in the order of Ni-Cr-Nb > Ni-Cr-V > Ni-Cr > Ni-Cr-Mo > Ni-Cr-Ti. Nb, which has a comparable standard electrode potential to Cr, increased the adhesion, while Ti, with a low standard electrode potential, degraded the adhesion. The Ni-Cr-Nb interlayer was amorphous, while Ni-Cr-Ti was partially crystalline. The similar morphology structure of the Ni-Cr-Nb interlayer with polyimide resulted in a better adhesion.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.10
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• pp.532-535
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• 2001

The sputtering condition of Cr thin film was established in order to get Cr gate electrode having a vertical wall structure for Mo-tip FEA. In case of Mo-tip FEA which had a vertically-etched Cr gate electrode, the field enhancement factor, was relatively increased and so the field emission performance in terms of turn-on voltage, emission current and trans-conductance could be improved when compared with the devices having a tapered gate wall.

• Communications of the Korean Mathematical Society
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• v.29 no.1
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• pp.131-140
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• 2014

In this paper we investigate (n+1)($n{\geq}3$)-dimensional contact CR-submanifolds M of (n-1) contact CR-dimension in a complete simply connected Sasakian space form of constant ${\phi}$-holomorphic sectional curvature $c{\neq}-3$ which satisfy the condition h(FX, Y)+h(X, FY) = 0 for any vector fields X, Y tangent to M, where h and F denote the second fundamental form and a skew-symmetric endomorphism (defined by (2.3)) acting on tangent space of M, respectively.

• Korean Journal of Crystallography
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• v.19 no.1
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• pp.14-20
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• 2008

The absolute structure of a compound $C_{56}H_{56}Cl_6Cr_2P_4$ with enantiomorphic space groups $P6_122$ was confirmed by means of anomalous dispersion effect.

• Bulletin of the Korean Mathematical Society
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• v.56 no.1
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• pp.169-178
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• 2019

Let $M^{2n+1}$, $n{\geq}1$, be a smooth manifold with a pseudoconvex integrable CR structure of hypersurface type. We consider a sequence of CR invariant subsets $M={\mathcal{S}}_0{\supset}{\mathcal{S}}_1{\supset}{\cdots}{\supset}{\mathcal{S}}_n$, where $S_q$ is the set of points where the Levi-form has nullity ${\geq}q$. We prove that ${\mathcal{S}}{_q}^{\prime}s$ are locally given as common zero sets of the coefficients $A_j$, $j=0,1,{\ldots},q-1$, of the characteristic polynomial of the Levi-form. Some sufficient conditions for local existence of complex submanifolds are presented in terms of the coefficients $A_j$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.251-254
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• 2000

This paper was to measure the structure, electric characteristics of 0.05Pb($(Al_{0.5}Nb_{0.5})$) - 0.95Pb$(Zr_{0.52}Ti_{0.48})O_3$ ceramics dopped with Cr+Fe. The results of this paper were gotten such as follows; The dielectric constants were decreased with Cr+Fe. The dielectric loss was minimum value of 1.008[%], dopped with Cr+Fe O.9[wt%] at 1200[$^{\circ}C$], In case of sintering at 1150[$^{\circ}C$], electromechanical factodkp) was maximum value of kp 42.73[%], at Cr+Fe 0.9[wt%]. The mechanical quality factor(Qm) was maximum value at Cr+Fe 1.2 [wt%], Also, in case of dopped with Cr+Fe, it make a improvement in temperature coefficient of resonant frequency at 0.3[wt%], 1150[$^{\circ}C$].

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.560-566
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• 2016

In this study, porcelain bonding strength and mechanical properties of sintered Ni-Cr-Ti alloy for dental prosthodontics have been researched experimentally. Mechanical and morphological characteristics of the alloys were examined by Vickers hardness test, tensile and bonding strength test, surface roughness test, field-emission scanning electron microscopy, energy dispersive X-ray spectroscopy, and X-ray diffraction. In the sintered Ni-13Cr-xTi alloys, morphology of sintered alloy showed porous matrix diffused with alloying elements of Cr and Ti, and showed dendritic structure after melting process. From the XRD results, the second phases of NiCr, $Ni_3Cr$, and $Ni_3Ti$ were formed in the case of sintered and melted Ni-13Cr-xTi alloys. The tensile strength and hardness of Ni-13Cr-xTi alloys increased, as Ti content increased. Surface roughness increased, as Ti content increased. The bonding strength between metal and porcelain of Ni-13Cr-5Ti alloy was higher than those of Ni-13Cr and Ni-13Cr-10Ti alloys

• Bulletin of the Korean Chemical Society
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• v.24 no.8
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• pp.1215-1218
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• 2003

An analysis of the bonding situation in CaM₂P₂ (M=Fe, Ni) with ThCr₂Si₂ structure is made in terms of DOS and COOP plots. The main contributions to covalent bonding are due to M-P and P-P interactions in both compounds. Particularly, the interlayer P-P bonding by variation in the transition metal is examined in more detail. It turns out that the shorter P-P bonds in CaNi₂P₂ form as a result of the decreasing electron delocalization into ${{\sigma}_p}^*$ of P₂ due to the weaker bonding interaction between the metal d and ${{\sigma}_p}^*$ as the metal d band is falling from Fe to Ni.

• Journal of the Korean institute of surface engineering
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• v.37 no.2
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• pp.92-98
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• 2004

The current efficiency and the microstructure of the trivalent Cr deposits plated in flow cell system were investigated according to additives in sulfate bath and current density. The current efficiency of the deposits plated in the formic acid complexed bath was noticeably higher than that of the deposits from glycine complexed bath. The current efficiency of the deposits from the complexed baths with boric acid buffer increased linearly with current density in the range of 60-100 A/dm$^2$, while that of the deposits from the baths with both Al sulfate and mixed buffers increased parabolically with current density. The nodular crystallite size of the deposits increased with current density, and the deposits plated in low current density region had relatively smooth surface appearance with fine grains. The structure of the deposits from the complexed baths with boric acid buffer changed from amorphous structure to crystalline one with strong (110)peak with increasing current density. The deposits from the baths with both Al sulfate and mixed buffers had generally amorphous structure.