• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2009.06a
• /
• pp.1051-1052
• /
• 2009

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2013.10a
• /
• pp.785-786
• /
• 2013

• Korean Journal of Applied Biomechanics
• /
• v.17 no.2
• /
• pp.11-21
• /
• 2007

The study was undertaken to present the quantitative materials available in underwater industries, underwater rehabilitation & physical training through comparison & analysis of effects contributing to propulsion of COG by types of fin-kick in underwater activities. For this 3D cinematography was performed for the skilled subjective and conclusions obtained on the basis of analysis of kinematic variables were as follows. In temporal variable the delay in the order of flutter>side>dolphin kick in elapsed time by total & phase resulted in longer sliding phase by larger fin kick of extension & flexion of both leg and thus more contributed in propulsion of COG. than those of the otherwise. In linear variable the contribution ratio to the result of propulsion of COG in both propulsive(mean $35.39{\pm}7.93cm$ in Y axis) and sliding phases(mean $66.36{\pm}11.01cm$ in Y axis)was shown to be order of flutter>dolphin>side fin kick. the maximum velocity of COG in Y direction was showed in both propulsive and sliding phases, and the contribution ratio to the propulsion of COG was in the order of flutter$\geq$dolphin>side fin kick. In angular variable the Significant difference in angle of leg joint by types of fin kick in both leg was showed but no routine order. The Significant difference in angular velocity of leg joint by types of fin kick in both leg was showed in the order of flutter>dolphin$\geq$side fin kick in propulsive but no in sliding phase. The Fluid resistance by tilting angle of trunk in both propulsive and sliding phase was decreased in the order of flutter>dolphin$\geq$side fin kick and tilting angle of trunk of the skilled was smaller than that of the unskilled in difference of maximum mean 7.97degree and minium mean 2.06degree. In summary of the above, It will desirable fin kick type because of more contribution to COG propulsion by the velocity & displacement in Y-axis and less fluid resistance by tilting angle of trunk and larger angular velocity in the case of more delayed in elapsed time of propulsive phase than that of the otherwise.

• Journal of KIISE:Software and Applications
• /
• v.36 no.2
• /
• pp.131-143
• /
• 2009

Based on the fact that a human being walks naturally and stably with consuming a minimum energy, this paper proposes a new method of generating a natural gait of 5-link biped robot like human by analyzing a COG (Center Of Gravity) trajectory of human's gait. In order to generate a natural gait pattern for 5-link biped robot, it considers the COG trajectory measured from human's gait images on the sagittal and frontal plane. Although the human and 5-link biped robot are similar in the side of the kinematical structure, numbers of their DOFs(Degree Of Freedom) are different. Therefore, torques of the human's joints cannot are applied to robot's ones directly. In this paper, the proposed method generates the gait pattern of the 5-link biped robot from the GA algorithm which utilize human's ZMP trajectory and torques of all joints. Since the gait pattern of the 5-link biped robot model is generated from human's ones, the proposed method creates the natural gait pattern of the biped robot that minimizes an energy consumption like human. In the side of visuality and energy efficiency, the superiority of the proposed method have been improved by comparative experiments with a general method that uses a inverse kinematics.

• Journal of The Korean Society of Integrative Medicine
• /
• v.2 no.3
• /
• pp.1-7
• /
• 2014

Purpose : The purpose of this study was to evaluate the influence of Lowenstein Occupational Therapy Cognitive Assessment(LOTCA) and Activities of Daily Living(ADL) by CogPack program in elderly with Alzheimer's dementia. Method : The subjects of this study, elderly diagnosed with Alzheimer's dementia, 8 patients were picked up, who were agreed with this research. Cognitive training for 6 weeks, which consisted of 3 times per week, 30 min of memory, attention and performance with cogpack program. Cognitive and ADL measured by LOTCA and FIM. The SPSS Ver. 14.0 statistical program was used for data processing. The significance level for statistical inspection was set as 0.05. Result : In comparison of LOTCA was significantly correlated in the pre and post test but FIM was not significantly correlated in the pre and post test. Conclusion : Therefore, the CogPack program is useful to improve the LOTCA in elderly with Alzheimer's dementia.

• Proceedings of the Korean Society for Bioinformatics Conference
• /
• 2003.10a
• /
• pp.210-219
• /
• 2003

오페론(operon)은 보통 미생물에서 다수의 인접한 유전자들로 구성된 그룹으로 하나의 유전자처럼 공통된 프로모터에 의해 전사되는 단위이다. 오페론을 구성하는 유전자들은 기능적으로 서로 유사하거나 같은 물질대사경로(metabolic pathway) 상에 존재하는 특징을 지니기 때문에 이들은 중요한 의미를 가지며, 미생물 유전체 분석에서 오페론을 구성하는 유전자들을 예측하는 것은 상당히 중요하다. 오페론을 예측하는 이전 연구들로는 이미 알려진 오페론의 특징인 유전자간 거리나 오페론을 구성하는 평균 유전자 개수 등을 이용하는 방법, 마이크로어레이 발현 실험을 이용한 방법, 전유전체(whole genome)들 간의 보존된 유전자 집합(conserved gene cluster)을 이용한 방법 그리고 물질대사경로를 이용한 방법 등이 있다. 본 논문에서는 COG 기능(function) 거리, 유전자 간의 거리, 코돈 사용빈도(codon usage) 그리고COG 기능 거리와 유전자간 거리를 같이 적용한 방법을 이용하여 오페론 예측을 위한 전처리 모델을 생성하였다 전처리 모델을 E. coli 전유전체에 적용해본 결과, 알려진 오페론들의 약 90%가 이를 포함하였다. 따라서 본 논문에서 제시한 전처리 모델은, 추후 오페론 예측을 위한 좋은 도구로 활용할 수 있을 것이다.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2011.05a
• /
• pp.64.1-64.1
• /
• 2011

LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.9
• /
• pp.831-838
• /
• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.11a
• /
• pp.103-105
• /
• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.9 no.6
• /
• pp.1282-1287
• /
• 2005

The accuracy of chip alignment in inferior product inspection of COG(Chip On Glass) to be measured a few micro unit is very important role since the accuracy of chip inspection depends on chip alignment. In this paper, we propose the area segmentation pattern matching method to enhance the accuracy of chip alignment. The area segmentation pattern matching method compares, and matches correlation coefficients between the characteristic features within the detailed area and the areas. The three areas of pattern circumference are learned to minimize the matching error by bad pattern. The proposed method has advantage such as reduction of matching time, and enhanced accuracy since the characteristic features are searched within the segmented area.