• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.3
• /
• pp.265-271
• /
• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.09a
• /
• pp.21-30
• /
• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of the Microelectronics and Packaging Society
• /
• v.15 no.2
• /
• pp.7-15
• /
• 2008

In this paper, the Chip-On-Flex (COF) assembly process using anisotropic conductive films (ACFs) was investigated and the reliability of COF assemblies using ACFs was evaluated. Thermo-mechanical properties of ACFs such as coefficient of thermal expansion (CTE), storage modulus (E'), and glass transition temperature $(T_g)$ were measured to investigate the effects of ACF material properties on the reliability of COF assemblies using ACFs. In addition, the bonding conditions for COF assemblies using ACFs such as time, temperature, and pressure were optimized. After the COF assemblies using ACFs were fabricated with optimized bonding conditions, reliability tests were then carried out. According to the reliability test results, COF assemblies using the ACF which had lower CTE and higher $T_g$ showed better thermal cycling reliability. Consequently, thermo-mechanical properties of ACFs, especially $T_g$, should be improved for high thermal cycling reliability of COF assemblies using ACFs for compact camera module (CCM) applications.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.10
• /
• pp.1049-1055
• /
• 2004

Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2015.11a
• /
• pp.33-42
• /
• 2015

오늘날 연성회로기판(FCCL : Flexible Copper Clad Laminate)은 디스플레이, 스마트폰, 자동차, 항공, 의료 기기, 산업용 컨트롤 기기 등 거의 모든 고급 전자 제품들에 사용되고 있다. 특히 디스플레이 분야에서는 뛰어난 연성과 내구성을 바탕으로 경박단소화에 유리할 뿐만 아니라 구동부에 적용이 가능한 장점 등으로 그 적용처가 점점 늘어나고 있는 추세이다. 이 가운데서도 LCD와 OLED의 구동소자(Display Driver IC)를 장착하는 COF(Chip on Film)는 대표적인 연성회로기판(FCCL) 적용 부품으로서, 최근 인기를 끌고 있는 디스플레이의 제로-베젤(Zero-bezel)을 가능케 하는 핵심 부품이다. COF용 연성회로기판(FCCL) 소재로는 우수한 평탄도, 파인피치(Fine-pitch)구현성, 내굴곡성, 광투과성 등을 보유하고 있는 Sputtering Type FCCL이 사용되고 있다. 특히 최근 Display 분야의 화두가 되고 있는 POLED(Plastic-OLED) 패널을 장착한 Flexible Mobile 디스플레이의 경우, 기존의 COG(Chip on Glass) 접합방식이 아닌 COF 접합방식을 채택하고 있으며, 기존의 단면 COF보다 3배의 고해상도 구현이 가능한 양면 COF를 채택하기에 이르렀다. 기존의 COF 제작공정과 달리 Semi Additive 공정으로 제작되는 양면 COF 시장의 태동으로 양면 연성회로기판(FCCL)의 수요 증가가 예상되는 등 최근 디스플레이 기술 발전은 소재 분야에도 큰 변화를 잉태하고 있다. 이러한 최근 디스플레이 업계의 고해상도, 고속 신호 전송, 슬림화, Flexible 추세에 대응 가능한 최적의 특성을 보유하고 있는 Sputtering Type FCCL을 중심으로 디스플레이의 발전에 대응하는 소재의 기술 개발 동향을 살펴보고자 한다.

• Applied Chemistry for Engineering
• /
• v.34 no.4
• /
• pp.455-459
• /
• 2023

Three different optimization studies were conducted for the synthesis of MIL-100(Fe) and MIL-100(Fe)@COF using design of experiments. In the first study, the optimal concentration of precursors was determined using a mixture design method, and a modified molar ratio of 0.4155:0.2664:0.3182 was found to yield the highest crystallinity. In the second study, a central composite design was used to optimize the main factors of synthesis temperature and time with a synthesis temperature of 161℃ and a synthesis time of 12 hours. In the third study, a screening design method was used to determine the effect of five precursors on the formation of MIL-100(Fe)@COF, and the presence of characteristic peaks at 1552, 1483, and 1354 cm^-1 was found to be important for the existence of the COF structure. MIL-100(Fe)@COF synthesized with a modified molar ratio of 0.4831:0.4169:0.1 was predicted to exhibit optimal conditions.

• Transactions on Electrical and Electronic Materials
• /
• v.8 no.1
• /
• pp.26-31
• /
• 2007

The goal of this study is to determine if High Pressure Micro Jet (HPMJ) conditioning can be used as a substitute for, or in conjunction with, conventional diamond pad conditioning. Five conditioning methods were studied during which 50 ILD wafers were polished successively in a 100-mm scaled polisher and removal rate (RR), coefficient of friction (COF), pad flattening ratio (PFR) and scanning electron microscopy (SEM) measurements were obtained. Results indicated that PFR increased rapidly, and COF and removal rate decreased significantly, when conditioning was not employed. With diamond conditioning, both removal rate and COF were stable from wafer to wafer, and low PFR values were observed. SEM images indicated that clean grooves could be achieved by HPMJ pad conditioning, suggesting that HPMJ may have the potential to reduce micro scratches and defects caused by slurry abrasive particle residues inside grooves. Regardless of different pad conditioning methods, a linear correlation was observed between temperature, COF and removal rate, while an inverse relationship was seen between COF and PFR.

• Transactions on Electrical and Electronic Materials
• /
• v.8 no.2
• /
• pp.67-72
• /
• 2007

High Pressure Micro Jet (HPMJ) pad conditioning system was investigated as an alternative to diamond disc conditioning in copper CMP. A series of comparative 50-wafer marathon runs were conducted at constant wafer pressure and sliding velocity using Rohm & Haas IC1000 and Asahi-Kasei EMD Corporation (UNIPAD) concentrically grooved pads under ex-situ diamond conditioning or HPMJ conditioning. SEM images indicated that fibrous surface was restored using UNIPAD pads under both diamond and HPMJ conditioning. With IC1000 pads, asperities on the surface were significantly collapsed. This was believed to be due to differences in pad wear rates for the two conditioning methods. COF and removal rate were stable from wafer to wafer using both diamond and HPMJ conditioning when UNIPAD pads were used. Also, HPMJ conditioning showed higher COF and removal rate when compared to diamond conditioning for UNIPAD. On the other hand, COF and removal rates for IC1000 pads decreased significantly under HPMJ conditioning. Regardless of pad conditioning method adopted and the type of pad used, linear correlation was observed between temperature and COF, and removal rate and COF.

• Journal of the Korean Society of Safety
• /
• v.28 no.3
• /
• pp.33-38
• /
• 2013

Many occupational workers or professionals have to walk on the various floors for a long period of time. The objective of this study was to develop the safety shoes with increased traction through the material selection. In order to fulfill our objective, first, two kinds of filler were selected to compare the wear mechanism at outsole surface. The developed rubber materials were tested with two kinds of portable slip meters. The sample safety shoes with developed rubber materials were also tested with subject in the laboratory. During walking, the safety shoes were naturally abraded with counter surface. The coefficient of friction(COF) was gradually decreased with number of steps to 30,000, while the COF was abruptly increased from 30,000 to 40,000. The experimental results showed that COF tested with silica rubber was at least 10% higher than that with carbon black rubber in wet or detergent condition. It has been well recognized that filler properties play a important role in wet traction in the tire industry. However it has been unclear that filler properties would be decisive factor in safety shoes. Our study shows that silica exhibits a higher slip resistance than carbon black without reference to wear states in wet or detergent condition. So, this results will provide guides for outsole compounders to develop new products and improve product performance.

• The korean journal of orthodontics
• /
• v.45 no.1
• /
• pp.29-37
• /
• 2015

Objective: The coefficients of friction (COFs) of aesthetic ceramic and stainless steel brackets used in conjunction with stainless steel archwires were investigated using a modified linear tribometer and special computer software, and the effects of the bracket slot size (0.018 inches [in] or 0.022 in) and materials (ceramic or metal) on the COF were determined. Methods: Four types of ceramic (one with a stainless steel slot) and one conventional stainless steel bracket were tested with two types of archwire sizes: a $0.017{\times}0.025$-in wire in the 0.018-in slots and a $0.019{\times}0.025$-in wire in the 0.022-in slot brackets. For pairwise comparisons between the 0.018-in and 0.022-in slot sizes in the same bracket, an independent sample t-test was used. One-way and two-way analysis of variance (ANOVA) and Tukey's post-hoc test at the 95% confidence level (${\alpha}$ = 0.05) were also used for statistical analyses. Results: There were significant differences between the 0.022-in and 0.018-in slot sizes for the same brand of bracket. ANOVA also showed that both slot size and bracket slot material had significant effects on COF values (p < 0.001). The ceramic bracket with a 0.022-in stainless steel slot showed the lowest mean COF (${\mu}$ = 0.18), followed by the conventional stainless steel bracket with a 0.022-in slot (${\mu}$ = 0.21). The monocrystalline alumina ceramic bracket with a 0.018-in slot had the highest COF (${\mu}$ = 0.85). Conclusions: Brackets with stainless steel slots exhibit lower COFs than ceramic slot brackets. All brackets show lower COFs as the slot size increases.