• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.11
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• pp.5117-5122
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• 2011

In this paper, thermal analysis simulation program by taking advantage of COMSOL Multiphysics, LED Module for the production of the most preferred package type, omitting the COH Type COB Type and board simulation of the thermal analysis is in progress. LED Module that passes through the Heat-sink of the simulation results, depending on the location of the COB Type Max. Approximately $78^{\circ}C$ ~ Min. Approximately $62^{\circ}C$, COH Type the Max. Approximately $88^{\circ}C$ ~ Min. Approximately $67^{\circ}C$ has been confirmed that the temperature stability. Compared with COB Type Max. AIthough temperature difference is about $10^{\circ}C$, Min. At a temperature of about $5^{\circ}C$ confirmed to be enough to reduce the gap, LED Point confirming the results of the temperature curves for COB Type Max. Approximately $100^{\circ}C$ ~ Min. Approximately $77^{\circ}C$, COH Type the Max. Approximately $100^{\circ}C$ ~ Min. Approximately $86^{\circ}C$ temperature stability was confirmed that, COB Type COH Type, compared to approximately $10^{\circ}C$ temperature was higher.

• Journal of the Korean Society of Food Culture
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• v.23 no.6
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• pp.720-728
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• 2008

The objective of this article is to examine Korean consumers' perception level of the country-of-origin of brand (COB) of global restaurant franchises. Although global brands have rushed onto the Korean food service market since 1980, there has been little or no research conducted regarding consumers' perception of COB of global restaurant franchises. In this study, we surveyed consumers to determine their perception of COB for 27 foreign global restaurant brands; specifically, we attempted to determine whether or not Korean consumers could correctly recognize the COB of each brand. The results of this research revealed that Korean consumers correctly perceived the COB of certain restaurant brands, and incorrectly perceived some other brands. For instance, Korean consumers' perception level of the COB of McDonald's and KFC were quite high, and conversely their perceptions of the COB of Outback Steakhouse and Pohoa were relatively low. When consumers select a restaurant brand, COB image was shown to be more influential than brand image.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4757-4761
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• 2012

LED chip on board(COB) package has been fabricated using aluminum substrate and aluminum anodization process. An alumina layer, used as a dielectric in COB substrate, is produced on aluminum substrate by selective anodization process. Also, selective anodization process makes it possible to construct a thermal via with a fully-filled via hole. Two types of the COB package are fabricated in order to analyze the effects of their substrate types on thermal resistivity and luminous efficiency. The aluminum substrate with the thermal via shows more improved measurement results compared with the alumina substrate. These results demonstrate that selective anodization process and thermal via can increase heat dissipation of COB package in this work. In addition, it is proved experimentally that these parameters also can be enhanced using efficient layout of multiple chip in the COB package.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.561-566
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• 2014

The high power COB(Chip on Board) LED, densely arranged chips on a board, are increasing to resolve heat problems in LED that has luminous semiconductor chips as main materials. In case of high-power COB LED, protection against heat is necessary due to the power consumption is high. Also if the temperature of device increases, the optical emission becomes less efficient and the life rapidly reduces due to thermal stress. This study packaged 13.5W COB LED and heat sink with difference form and produced 13.5W COB LED down-light heat sink by analyzing the thermal modes with Solidworks Flow Simulation. And finally it analyzed and evaluated the thermal modes using contacting and non-contacting thermometers.

• Asian-Australasian Journal of Animal Sciences
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• v.6 no.1
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• pp.123-126
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• 1993

Hand dibbling in rows produced higher (p < 0.05) fresh and dry matter (DM), fodder yield, higher plant density and cob yield than broadcasted. However, the varying seed rates (40, 50 and 55 kg/ha) did not affect (p < 0.05) the fresh and DM yield and cob yield except for 30 kg/ha seed rate which produced the lowest (p < 0.01). However, the overall average fresh fodder yield and the fresh and DM yield of cob were 24.97, 10.04 and 6.90 t/ha respectively. The overall average plant height (cm), cob/plant (nos.) plant/ha, (nos.) cob/ha (nos.) and weight (g) of one cob were 178, 1.11, 664141, 70104 and 145 respectively for both the sowing methods and the four seed rates. Crude protein contents of maize plant and cob by-products (8.12% and 7.34% respectively) indicated promising cattle feeds along with human food.

• Asian-Australasian Journal of Animal Sciences
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• v.6 no.3
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• pp.367-371
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• 1993

The feeding value of maize cob meal was investigated in a trial involving one hundred and forty Arbor Acre day-old chicks raised to eight weeks of age. The maize cob meal which contained 32.5% fibre, 2.5% protein and had a gross energy value of 2,550 kcal/kg, was incorporated into the experimental diets at either 0, 2.9, 5.8, 11.6 or 23.2% level. All diets were formulated to contain 3,200 kcal/kg of metabolizable energy and approximately 22% protein by varying the proportions of maize and whole cooked soyabean meal in the diets. The inclusion of maize cob meal up to 11.6% in the diet did not significantly (p>0.05) affect body weight gains, feed consumption and utilization, as well as carcass yield and dressing percentage. However, at the 23.2% level of maize cob meal inclusion, body weight gains, feed utilization and carcass yields were significantly (p<0.05) reduced. The use of maize cob meal reduced feed cost for raising birds and either maintained or improved gross profit returns with up to 11.6% level of inclusion in the diet. It was concluded that maize cob meal can be included up to 11.6% in the diet of broiler chickens provided dietary energy concentration is maintained at 3,200 kcal of metabolisable energy per kilogramme of feed by using high energy density feed ingredient such as boiled whole seed soyabean meal.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.12
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• pp.1435-1440
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• 2014

This paper was designed to analyze thermal properties using thermoelectric element for air-cooling heat dissipation of 13.2W-class COB LED. For comparative analysis with generally used air cooling methods, the heat sink was designed and produced, and this experiment was conducted to measure the temperature distribution using a contact thermometer while the COB LED was operating for 100 minutes. One result was about $75^{\circ}C$ for the general cooling method, and the other was $57^{\circ}C$ while the thermoelectric element was operating with applying the current of 0.8A to the thermoelectric element. This results confirmed that the method of applying thermoelectric element was much better in the dissipation of thermal condense on the COB LED than that of the general air cooling one. The temperature on the contact points of COB LED using thermoelectric element was decreased about 31% compared with the air cooling method from $75^{\circ}C$ to $57^{\circ}C$.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.2
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• pp.189-194
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• 2015

In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.2
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• pp.401-407
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• 2014

There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.59 no.9
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• pp.1615-1620
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• 2010

A thin film thermoelectric cooler for COB direct assembly was proposed and the COB cooler structure was modeled by electrical equivalent circuit by using SPICE model of thermoelectric devices. The embedded cooler attached between the die chip and metal plate can offer the possibility of thin film active cooling for the COB direct assembly. We proposed a driving method of TEC by using pulse width modulation technique. The optimum power to the TEC is simulated by using a SPICE model of thermoelectric device and passive components representing thermal resistance and capacitance. The measured and simulated results offer the possibility of thin film active cooling for the COB direct assembly.