• Korean Journal of Human Ecology
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• v.5 no.2
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• pp.55-74
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• 2002

This study, observing each respectively packaged Kongdduk during 12-day storing period and comparing it with unpackaged Kongdduk, through a cross-sectional view of its fiber and temperament, through a sensory evaluation rheometer measurement of rheological change depending on storing period and packaging type and through the organic acid content, micro-organic change, and retrogressive process. The results are as follows: 1. Kongdduk made of bean oil shows better chewiness, cohesiveness, and moistness than Kongdduk made of bean flour while Kongdduk made of bean flour shows better rheological properties as to roasted nutty taste or roasted nutty order. 2. The test of the cutted loaves of Kongdduk shows that adding oil of proper proportion to the dough of steamed rice cake in accordance with the amount of rice flour has a good influence on rheological properties of softness. 3. Rice cakes were prepared by addition of yellow soybean flour or peanut flour and packaged with CMP or VP, and their physical characteristics were monitored by sensory evaluation and mechanical measurement while storing for 6 days. For VP samples, yellow soybean rice cake showed little changes in cohesiveness, moistness and chewiness for 6 days of storage, while pure rice cake and peanut rice cake showed an increase in strength and hardness from the 4th day of storage. In case of CMP, yellow soybean rice cake hardly showed a difference in cohesiveness, moistness and chewiness for 6 days, while pure rice cake and peanut rice cake showed a significant difference from the 4th day in sensory evaluation. 4. For rheometer measurement, yellow soybean rice cake with CMP or VP showed little changes in strength or hardness for 6 days, while peanut rice cake and pure rice cake showed a drastic decrease in cohesiveness, from the End day and adhesiveness from the 4th day of storage. As there was no remarkable difference or deterioration for 6 days of storage in yellow soybean rice cake between CMP and VP, the ingredients of rice cakeappeared to be more important than the type of packaging in terms of quality deterioration of rice cake. 5. As the storing period passed by, organic acid is detected less at CMP-packaged Knngdduk than at wrapped. and its increasing speed proves to be slower as well. 6. The one wrapped with plyethylene film began to get moldy from pure rice cake or Kongdduk (rice cake mixed with yellow soybean or peanut) after 6 days, and more and more modly after 9 daysor after 12 days, but the CMP-packaged ones didn't get modly until 12 days or more. 7. CMP-packaged Kongdduk showed higher enthalpy of retrogradation than PE-wrapped one. As storing Period Passed by, Kongdduk,s enthalpy grew high. That is to say, it shows that Kongdduk got retrograded.

• Korean journal of food and cookery science
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• v.17 no.3
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• pp.204-210
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• 2001

Rice cakes were prepared by the addition of yellow soybean flour or peanut flour and packaged with $CO_2$-modified packaging(CMP) or vacuum packaging(VP), and their physical characteristics were monitored by sensory evaluation and mechanical measurement while storing for 6 days. For VP samples, yellow soybean rice cake showed little changes in cohesiveness, moistness and chewiness for 6 days of storage, while pure rice cake and peanut rice cake showed an increase in strength and hardness from the 4th day of storage. In case of CMP, yellow soybean rice cake hardly showed a difference in cohesiveness, moistness and chewiness for 6 days, while pure rice cake and peanut rice cake showed a significant difference from the 4th day in sensory evaluation. For rheometer measurement, yellow soybean rice cake with CMP or VP showed little changes in strength or hardness for 6 days, while peanut rice cake and pure rice cake showed a drastic decrease in cohesiveness from the 2nd day and adhesiveness from the 4th day of storage. As there was no remarkable difference or deterioration for 6 days of storage in yellow soybean rice cake between CMP and VP, the ingredients of rice cake appeared to be more important than the type of packaging in terms of the quality deterioration of rice cake.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.3 s.234
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• pp.432-438
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• 2005

CMP characteristics such as material removal rate and edge effect were measured and investigated in accordance with pad grooving effect, groove width, depth and pitch. GSQ (Groove Stiffness Quotient) and GFQ (Groove Flow Quotient) were proposed to estimate pad grooving characteristics. GSQ is defined as groove depth(D) divided by pad thickness(T) and GFQ is defined as groove width(W) divided by groove pitch(P). As GFQ value increased, material removal rate increased some point but gradually saturated. It seems that material removal rate is not affected by each parameter respectively but by interaction of these parameters such as groove dimensions. In addition, an increase in GFQ and GSQ causes edge effect to be improved. Because, pad stiffness decreases as GSQ and GFQ increase. In conclusion, groove influences relative pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. The change of groove dimensions has influence on pad stiffness and slurry flow, so that polishing results such as removal rate and edge effect become changed.

• Tribology and Lubricants
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• v.32 no.2
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• pp.67-71
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• 2016

This study investigates the characteristics of the sapphire wafer chemical mechanical polishing (CMP) process. The material removal rate is one of the most important factors since it has a significant impact on the production efficiency of a sapphire wafer. Some of the factors affecting the material removal rate include the pressure, platen speed and slurry. Among the factors affecting the CMP process, we analyzed the trends in the material removal rate and surface roughness, which are mechanical factors corresponding to both the pressure and platen speed, were analyzed. We also analyzed the increase in the material removal rate, which is proportional to the pressure and platen speed, using the Preston equation. In the experiment, after polishing a 4-inch sapphire wafer with increasing pressure and platen speed, we confirmed the material removal rate via thickness measurements. Further, surface roughness measurements of the sapphire wafer were performed using atomic force microscopy (AFM) equipment. Using the measurement results, we analyzed the trends in the surface roughness with the increase in material removal rate. In addition, the experimental results, confirmed that the material removal rate increases in proportion to the pressure and platen speed. However, the results showed no association between the material removal rate and surface roughness. The surface roughness after the CMP process showed a largely consistent trend. This study demonstrates the possibility to improve the production efficiency of sapphire wafer while maintaining stable quality via mechanical factors associated with the CMP process.

• Journal of the Korean Ceramic Society
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• v.48 no.4
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• pp.312-315
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• 2011

The effect of slurry composition and wafer flatness on a material removal rate (MRR) and resulting surface roughness which are evaluation parameters to determine the CMP characteristics of the on-axis 6H-SiC substrate were systematically investigated. 2-inch SiC wafers were fabricated from the ingot grown by a conventional physical vapor transport (PVT) method were used for this study. The SiC substrate after the CMP process using slurry added oxidizers into slurry consisted of KOH-based colloidal silica and nano-size diamond particle exhibited the significant MRR value and a fine surface without any surface damages. SiC wafers with high bow value after the CMP process exhibited large variation in surface roughness value compared to wafer with low bow value. The CMPprocessed SiC wafer having a low bow value of 1im was observed to result in the Root-mean-square height (RMS) value of 2.747 A and the mean height (Ra) value of 2.147 A.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.9
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• pp.1037-1041
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• 2014

Slurry used for polishing semiconductors processed by exchange, pressurization, and multi-step feeding has been studied to investigate the effect of the size and shape of slurry particles on the oxide CMP removal rate. First, spherical silica sol was prepared by the ion exchange method. The spherical silica particle was used as a seed to grow non-spherical silica sol in accordance with the multi-step feeding of silicic acid by the ion exchange and pressurization methods. The oxide removal rate of both non-spherical silica sol and commercially available slurry were compared with increasing average particle size in the oxide CMP. The more alkaline the pH level of the non-spherical silica sol, the higher was the removal rate and non-uniformity.

• Journal of the Korean Vacuum Society
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• v.7 no.2
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• pp.88-93
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• 1998

The fabrication process and emission characteristics of gated silicon field emitter arrays(FEAs) using chemical-mechanical-polishing (CMP) method are described. Novel fabrication techniques consisting of two-step dry etching with oxidation of silicon and CMP processes were developed for the formation of sharp tips and clear-cut edged gate electrodes, respectively. The gate height and aperture could be easily controlled by varying the polishing time and pressure in the CMP process. We obtained silicon FEAs having self-aligned and clear-cut edged gate electrode opening by eliminating the dishing problem during the CMP process with an oxide mask layer. The tip height of the finally fabricated FEAs was about 1.1 $\mu$m and the end radius of the tips was smaller than 100 $\AA$. The emission current meaured from the fabricated 2809 tips array was about 31 $\mu$A at a gate voltage of 80 V.

• The Mathematical Education
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• v.62 no.2
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• pp.237-255
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• 2023

The objective of this study is to explore the meaning generated through discourse in three different types of 1st-grade middle school textbooks in Korea and CMP textbook in the United States, specifically focusing on histograms. Through a discursive perspective, the study aims to analyze the characteristics of questioning within the stages of statistical problem-solving found in histogram tasks. The findings highlight several significant points. Firstly, variations exist in the definitions of histograms between Korean and US CMP textbooks. Secondly, diverse discursive structures contribute to the interpretation and understanding of histograms in textbooks. Thirdly, limitations are observed in the stages of statistical problem-solving reflected in histogram tasks. Lastly, distinctions are identified in the types of questioning employed in histogram tasks between Korean and US CMP textbooks. Building on these insights, the study suggests concrete ideas for enhancing the process of defining histograms and refining the questioning in histogram tasks.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.32 no.6
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• pp.511-520
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• 2010

Purpose: This study was conducted in order to compare the efficacy of osseointegration of three different calcium metaphosphate (CMP) coated implants in the rabbit's femur. Materials and Methods: Twenty four rabbits and three different type of CMP coated implants and RBM implants were used in this study. The animals were divided into 4 groups on the basis of implant surface characteristics. Two implants were installed into the condyle of femur of each rabbits. The animals were sacrificed at 2 and 4 weeks after installation. The undecalcified specimens were prepared for histological, radiological examination and histomorphometric analysis of implant-bone contact ratios (BIC) and bone area ratio (BA). Results: Two implants were failed to osseointegrate and implant success rate was 95.2%. There were not any significant inflammatory response in all groups. Fluorescent image at 4 weeks shows that remodeling is slower in RBM group than CMP group. CMP III showed more active remodeling than CMP I, II. In histomorphologic analysis, BIC ratio at 2 weeks was lower than 4 weeks. Conclusion: The results suggest that the ratios of CMP coated implants were higher than that of RBM control group but there is no significantly difference between RBM group and CMP group. In conclusion, CMP coated implant had more clinical availability than RBM implants.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.121-122
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• 2008

Lithium Niobate (LN:LiNbO3) is a compound of niobium, lithium and oxygen. The characteristics of LN are piezoelectricity, ferroelectricity and photoelectricity, and which is widely used in surface acoustic wave (SAW). To manufacture LN device, the LN surface should be a smooth surface and defect-free because of optical property, but the LN material is processed difficult by traditional processes such as grinding and mechanical polishing (MP) because of its brittleness. To decrease defects, chemical mechanical polishing (CMP) was applied to the LN wafer. In this study, the suitable parameters scuh as pressure and relative velocity, were investigated for the LN CMP process. To improve roughness, the LN CMP was performed using the parameters that were the highest removal rate among process parameters. And, evaluation of optical property was performed by the optical reflectance and non-linear characteristic.