• The Journal of Engineering Geology
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• v.30 no.1
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• pp.17-30
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• 2020

An optical televiewer is a geophysical logging device that produces continuous high-resolution full-azimuth images of a borehole wall using a light-emitting-diode and a complementary metal-oxide semiconductor image sensor to provide valuable information on subsurface discontinuities. Recently, borehole imaging logging has been applied in many fields, including ground subsidence monitoring, rock mass integrity evaluation, stress-induced fracture detection, and glacial annual-layer measurements in polar regions. Widely used commercial borehole imaging logging systems typically have limitations depending on equipment specifications, meaning that it is necessary to clearly verify the scope of applications while maintaining appropriate quality control for various borehole conditions. However, it is difficult to directly check the accuracy, implementation, and reliability for outcomes, as images derived from an optical televiewer constitute in situ data. In this study, we designed and constructed a modular fractured borehole model having similar conditions to a borehole environment to report unprecedented results regarding reliable data acquisition and processing. We investigate sonde magnetometer accuracy, color realization, and fracture resolution, and suggest data processing methods to obtain accurate aperture measurements. The experiment involving the fractured borehole model should enhance not only measurement quality but also interpretations of high-resolution and reliable optical imaging logs.

• Journal of Korea Multimedia Society
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• v.13 no.5
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• pp.641-650
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• 2010

Color image sensors (CIS) output color images through image sensors and image signal processing. Image sensors that convert light to electrical signal are divided into CMOS image sensor and CCD image sensor according to transferring method of signal charge. In general, a CIS has RGB output signals from tri-stimulus XYZ of the scene through image signal processing. This paper presents an adaptive colorimetric analysis method to obtain chromaticity and luminance using CIS under various environments. An image sensor for the use of colorimeter is characterized based on the CIE standard colorimetric observer. We use the method of least squares to derive a colorimetric characterization matrix between camera RGB output signals and CIE XYZ tristimulus values. We first survey the camera characterization in the standard environment then derive a SGL(shutter-gain-level) function which is relationship between luminance and auto exposure (AE) characteristic of CIS, and read the status of an AWB(auto white balance) function. Then we can apply CIS to measure luminance and chromaticity from camera outputs and AE resister values without any preprocessing. Camera RGB outputs, register values, and camera photoelectric characteristic are used to analyze the colorimetric results for real scenes such as chromaticity and luminance. Experimental results show that the proposed method is valid in the measuring performance. The proposed method can apply to various fields like surveillant systems of the display or security systems.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.3
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• pp.479-485
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• 2006

The double gate(DG) MOSFET is a promising candidate to further extend the CMOS scaling and provide better control of short channel effect(SCE). DGMOSFETs, having ultra thin undoped Si channel for SCEs control, ale being validated for sub-20nm scaling. A novel analytical transport model for the subthreshold mode of DGMOSFETs is proposed in this paper. The model enables analysis of short channel effect such as the subthreshold swing(SS), the threshold voltage roil-off$({\Delta}V_{th})$ and the drain induced barrier lowering(DIBL). The proposed model includes the effects of thermionic emission and quantum tunneling of carriers through the source-drain barrier. An approximative solution of the 2D Poisson equation is used for the distribution of electric potential, and Wentzel-Kramers-Brillouin approximation is used for the tunneling probability. The new model is used to investigate the subthreshold characteristics of a double gate MOSFET having the gate length in the nanometer range $(5-20{\sim}nm)$ with ultra thin gate oxide and channel thickness. The model is verified by comparing the subthreshold swing and the threshold voltage roll-off with 2D numerical simulations. The proposed model is used to design contours for gate length, channel thickness, and gate oxide thickness.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.4
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• pp.475-483
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• 2012

This paper presents new type of the hybrid supply modulator for the next reconfigurable transmitters. The efficiency of the hybrid supply modulator is one of the most important performance. For enhancement the efficiency, multi-switching structure in the hybrid supply modulator is employed. Additionally, input envelope signal sensing stage is employed for implementation multi-mode operation. To compare the performance of the proposed hybrid supply modulator, the conventional hybrid supply modulator is also designed. The measured efficiency of the proposed hybrid supply modulator is 85 %/84 %/79 % for EDGE/WCDMA/LTE signals which have 384 kHz/3.84 MHz/5 MHz bandwidth, respectively. The efficiency of the proposed hybrid supply modulator is higher than the conventional hybrid supply modulator. Therefore, this structure shows good candidate for the reconfigurable transmitters.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.27-36
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• 2006

We fabricated thermally evaporated 10 nm-Ni/(poly)Si, 10 nm-Ni/l nm-Ir/(poly)Si and 10 nm-Ni/l nm-Pt/(poly)Si films to investigate the thermal stability of nickel monosilicides at the elevated temperatures by rapid annealing them at the temperatures of $300{\sim}1200^{\circ}C$ for 40 seconds. Silicides of 50 nm-thick were formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to examine sheet resistance. A scanning electron microscope and field ion beam were employed for thickness and microstructure evolution characterization. An X-ray diffractometer and an Auger depth profiler were used for phase and composition analysis, respectively. Nickel silicides with platinum have no effect on widening the NiSi stabilization temperature region. Nickel silicides with iridium farmed on single crystal silicon showed a low resistance up to $1200^{\circ}C$ while the ones formed on polycrystalline silicon substrate showed low resistance up to $850^{\circ}C$. The grain boundary diffusion and agglomeration of silicides lowered the NiSi stable temperature with polycrystalline silicon substrates. Our result implies that our newly proposed Ir added NiSi process may widen the thermal process window for nano CMOS process.

• Journal of the Semiconductor & Display Technology
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• v.6 no.3
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• pp.19-23
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• 2007

The NiSi is very promising candidate for the metallization in 45 nm CMOS process such as FUSI(fully silicided) gate and source/drain contact because it exhibits non-size dependent resistance, low silicon consumption and mid-gap workfunction. Ni film was first deposited by using ALD (atomic layer deposition) technique with Bis-Ni precursor and $H_2$ reactant gas at $220^{\circ}C$ with deposition rate of $1.25\;{\AA}/cycle$. The as-deposited Ni film exhibited a sheet resistance of $5\;{\Omega}/{\square}$. RTP (repaid thermal process) was then performed by varying temperature from $400^{\circ}C$ to $900^{\circ}C$ in $N_2$ ambient for the formation of NiSi. The process temperature window for the formation of low-resistance NiSi was estimated from $600^{\circ}C$ to $800^{\circ}C$ and from $700^{\circ}C$ to $800^{\circ}C$ with and without Ti capping layer. The respective sheet resistance of the films was changed to $2.5\;{\Omega}/{\square}$ and $3\;{\Omega}/{\square}$ after silicidation. This is because Ti capping layer increases reaction between Ni and Si and suppresses the oxidation and impurity incorporation into Ni film during silicidation process. The NiSi films were treated by additional thermal stress in a resistively heated furnace for test of thermal stability, showing that the film heat-treated at $800^{\circ}C$ was more stable than that at $700^{\circ}C$ due to better crystallinity.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.68.1-68.1
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• 2012

The best part of graphene is - charge-carriers in it are mass less particles which move in near relativistic speeds. Comparing to other materials, electrons in graphene travel much faster - at speeds of $10^8cm/s$. A graphene sheet is pure enough to ensure that electrons can travel a fair distance before colliding. Electronic devices few nanometers long that would be able to transmit charge at breath taking speeds for a fraction of power compared to present day CMOS transistors. Many researches try to check a possibility to make it a perfect replacement for silicon based devices. Graphene has shown high potential to be used as interconnects in the field of high frequency electrical devices. With all those advantages of graphene, we demonstrate characteristics of electrical and optical properties of graphene such as the effect of graphene geometry on the microwave properties using the measurements of S-parameter in range of 500 MHz - 40 GHz at room temperature condition. We confirm that impedance and resistance decrease with increasing the number of graphene layer and w/L ratio. This result shows proper geometry of graphene to be used as high frequency interconnects. This study also presents the optical properties of graphene oxide (GO), which were deposited in different substrate, or influenced by oxygen plasma, were confirmed using different characterization techniques. 4-6 layers of the polycrystalline GO layers, which were confirmed by High resolution transmission electron microscopy (HRTEM) and electron diffraction analysis, were shown short range order of crystallization by the substrate as well as interlayer effect with an increase in interplanar spacing, which can be attributed to the presence of oxygen functional groups on its layers. X-ray photoelectron Spectroscopy (XPS) and Raman spectroscopy confirms the presence of the $sp^2$ and $sp^3$ hybridization due to the disordered crystal structures of the carbon atoms results from oxidation, and Fourier Transform Infrared spectroscopy (FTIR) and XPS analysis shows the changes in oxygen functional groups with nature of substrate. Moreover, the photoluminescent (PL) peak emission wavelength varies with substrate and the broad energy level distribution produces excitation dependent PL emission in a broad wavelength ranging from 400 to 650 nm. The structural and optical properties of oxygen plasma treated GO films for possible optoelectronic applications were also investigated using various characterization techniques. HRTEM and electron diffraction analysis confirmed that the oxygen plasma treatment results short range order crystallization in GO films with an increase in interplanar spacing, which can be attributed to the presence of oxygen functional groups. In addition, Electron energy loss spectroscopy (EELS) and Raman spectroscopy confirms the presence of the $sp^2$ and $sp^3$ hybridization due to the disordered crystal structures of the carbon atoms results from oxidation and XPS analysis shows that epoxy pairs convert to more stable C=O and O-C=O groups with oxygen plasma treatment. The broad energy level distribution resulting from the broad size distribution of the $sp^2$ clusters produces excitation dependent PL emission in a broad wavelength range from 400 to 650 nm. Our results suggest that substrate influenced, or oxygen treatment GO has higher potential for future optoelectronic devices by its various optical properties and visible PL emission.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.812-818
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• 2000

We studied the effects of Ge preamorphization (PAM) on 0.25$\mu\textrm{m}$ Ti-salicide junctions using comparative study with As PAM. For each PAM schemes, ion implantations are performed at a dose of 2E14 ion/$\textrm{cm}^2$ and at 20keV energy using $^{75}$ /As+and GeF4 ion sources. Ge PAM showed better sheet resistance and within- wafer uniformity than those of As PAM at 0.257m line width of n +/p-well junctions. This attributes to enhanced C54-silicidation reaction and strong (040) preferred orientation of the C54-silicide due to minimized As presence at n+ junctions. At p+ junctions, comparable performance was obtained in Rs reduction at fine lines from both As and Ge PAM schemes. Junction leakage current (JLC) revels are below ~1E-14 A/$\mu\textrm{m}^{2}$ at area patterns for all process conditions, whereas no degradation in JLC is shown under Ge PAM condition even at edge- intensive patterns. Smooth $TiSi_2$ interface is observed by cross- section TEM (X- TEM), which supports minimized silicide agglomeration due to Ge PAM and low level of JLC. Both junction break- down voltage (JBV) and contact resistances are satisfactory at all process conditions.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.2
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• pp.170-175
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• 2016

In order to transmit baseband signals through frequency dividing devices, we studied the transfer function of the device in the term of the baseband signal distortion. From the analysis, it is shown that the magnitude of the envelope signal is related to the mixer gain and the insertion loss of the low pass filter whilst the phase is the additional function with the 1/2 of the phase delay. For the purpose of the verification of the study, we designed a dynamic frequency divider at 1,400 MHz. The operating frequency range of the device is closely related to the conversion gain of mixers and the amplitude of input signal, and becomes wide as the conversion gain of mixers increases. The designed frequency divider operates between 0.9 GHz and 3.2 GHz, for -14.5 dBm input power. The circuit shows 20 mW power dissipation at $V_{DD}=2.5V$, and the simulation result shows that an amplitude modulated signal at 1,400 MHz with the modulation index of 0.9 was successfully downconverted to 700 MHz.

• Journal of IKEEE
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• v.5 no.1 s.8
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• pp.100-110
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• 2001

In this paper, we investigated several buffer management schemes for the design of shared-memory type ATM switches, which can enhance the utilization of switch resources and can support quality-of-service (QoS) functionalities. Our results show that dynamic threshold (DT) scheme demonstrate a moderate degree of robustness close to pushout(PO) scheme, which is known to be impractical in the perspective of hardware implementation, under various traffic conditions such as traffic loads, burstyness of incoming traffic, and load non-uniformity across output ports. Next, we considered buffer management strategies to support QoS functions, which utilize parameter values obtained via connection admission control (CAC) procedures to set tile threshold values. Through simulations, we showed that the buffer management schemes adopted behave well in the sense that they can protect regulated traffic from unregulated cell traffic in allocating buffer space. In particular, it was observed that dynamic partitioning is superior in terms of QoS support than virtual partitioning.