• Title/Summary/Keyword: CDBA

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Realization of OTA-based CDBA

  • Kaewpoonsuk, Anucha;Petchmaneelumka, Wandee;Kamsri, Thawatchai;Riewruja, Vanchai
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.229-232
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    • 2005
  • This paper presents the OTA-based current differencing buffered amplifier (CDBA), which has a simple configuration comprised four OTAs. The proposed circuit is ease of design and suitable for analog signal processing applications in both voltage and current modes. The first order allpass filters were implemented as the application examples in order to demonstrate the performances of the proposed CDBA. PSPICE analog simulation and the commercially available OTAs-based experimental results verifying the circuit performances are also included.

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Colorless and Transparent Polyimide Films from Poly(amic acid)s with Cross-linkable Anhydride End (가교 반응이 가능한 말단 무수물을 이용한 무색투명한 폴리이미드 필름)

  • Min, Ung-Ki;Chang, Jin-Hae
    • Polymer(Korea)
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    • v.34 no.6
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    • pp.495-500
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    • 2010
  • Crosslinked PI films were synthesized from 4,4'-(hexafluoro isopropylidene)diphthalic anhydride (6FDA) and bis[4-(3-aminophenoxy) phenyl] sulfone(BAPS) with various ratios of the reactive monomer cis-4-cyclohexene-1,2-dicarboxylic anhydride(CDBA). We prepared crosslinked poly(amic acid) (PAA) using a 0.1 wt% Grubbs catalyst as a crosslinking agent. The crosslinked PAA was heat-treated at different temperatures to give PI films. The thermo-mechanical properties and optical transparency of the PI films were investigated. The thermal properties of the PI films were examined using Fourier transform infrared (FTIR) spectroscopy, differential scanning calorimetry(DSC), thermogravimetric analysis(TGA), thermo-mechanical analysis(TMA), and universal tensile machine(UTM), and their optical transparencies were investigated using UV-vis. spectrophotometry. The thermomechanical properties of the PI films improved with increasing CDBA content. However, the optical transparency of the PI films decreased slightly with increasing CDBA content.

Constraint based Dynamic Burst Assemble algorithm to Reduce Energy Consumed in OBS network (OBS 망의 에너지 소비 감소를 위한 통제 기반 동적 버스트 어셈블 알고리즘)

  • Kang, Dong-Ki;Kim, Young-Chon;Youn, Chan-Hyun
    • Proceedings of the Korea Information Processing Society Conference
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    • 2011.11a
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    • pp.673-674
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    • 2011
  • 본 논문에서는 OBS 망의 에지 라우터에서 소비되는 에너지를 절감하기 위한 통제 기반 동적 버스트 어셈블 알고리즘 (Constraint based Dynamic Burst Assemble algorithm : CDBA) 을 제안한다. 기존의 버스트 어셈블 알고리즘은 망의 성능 및 QoS (Quality of Service) 만을 고려한 고정된 버스트 어셈블 임계값을 사용하였으나 제시한 알고리즘은 에지 라우터에서 발생하는 에너지 소비율을 감소시키면서도 버스트 길이 및 패킷 지연과 같은 지표를 일정 수준이내로 유지함으로써 망의 성능을 보장한다. 제시한 알고리즘 평가를 위해 OPNET Modeler 를 사용하여 시뮬레이션을 수행하였으며, 에너지 절감율 및 패킷 지연 시간 관점에서 기존의 버스트 어셈블 알고리즘과 성능을 비교, 분석하였다.

Residual Stress Behavior and Characterization of Polyimide Crosslinked Networks via Ring-opening Metathesis Polymerization (개환 복분해 중합을 통한 가교형 폴리이미드 박막의 잔류응력 거동 및 특성 분석)

  • Nam, Ki-Ho;Seo, Jongchul;Jang, Wonbong;Han, Haksoo
    • Polymer(Korea)
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    • v.38 no.6
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    • pp.752-759
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    • 2014
  • Crosslinked polyimides (PIs) were synthesized by reacting 4,4'-(hexafluoroisopropylidene)-diphthalic anhydride (6FDA) and 2,2'-bis(trifluoromethyl)benzidine (TFDB) with various ratios of the cross-linkable, end-capping agent cis-1,2,3,6-tetrahydrophthalic anhydride (CDBA) via ring-opening metathesis polymerization. Residual stress behaviors were investigated in-situ during thermal imidization of the crosslinked PI precursors using a thin film stress analyzer (TFSA) by wafer bending method. The thermal properties were investigated via differential scanning calorimetry (DSC), thermomechanical analysis (TMA), and thermogravimetric analysis (TGA). The optical properties were measured by ultraviolet-visible spectrophotometer (UV-vis) and spectrophotometry. All properties were interpreted with respect to their morphology of crosslinked networks. With increasing the amounts of the end-capping agent, the residual stress decreased from 27.9 to -1.3 MPa, exhibited ultra-low stress and high thermal properties. The minimized residual stress and enhanced thermal properties of the crosslinked PI makes them potential candidates for versatile high-density multi-layer structure applications.