• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.105-124
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• 2011

TFT-LCD consists of LCD panel on the top, circuit unit on the side and BLU on the bottom. The recent development issues of BLU-dependent TFT-LCD have been power consumption minimization, slimmerization and size maximization. As a result of this trend, LED is adopted as BLU instead of CCFL to increase brightness and to reduce thickness. In liquid crystal displays, the light efficiency is below 10% due to the loss of light in the path from a light source to an LCD panel and presence of absorptive polarizer. This low efficiency results in low brightness and high power consumption. One way to circumvent this situation is to use a reflective polarizer between backlight units and LCD panels. Since a nano-wire grid polarizer has been known as a reflective polarizer, an idea was proposed that it can be used for the enhancement of the brightness of LCD. The use of reflective polarizing film is increasing as edge type LED TV and 3D TV markets are growing. This study has been carried out to fabrication of the nano-wire grid polarizer(NWGP) and investigated the brightness enhancement of LCD through polarization recycling by placing a NWGP between an c and a backlight unit. NWGPs with a pitch of 200nm were fabricated using laser interference lithography and aluminum sputtering and wet etching. And The NWGP fabrication process was using by the UV imprinting and was applied to plastic PET film. In this case, the brightness of an LCD with NWGPs was 1.21 times higher than that without NWGPs due to polarization recycling.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1657-1658
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• 2006

An external electrode fluorescent lamps (EEFLs) have the advantage of a long lifetime in the early stages of the study on plasma discharge, interest in the lamp continues. Studies on the operation of external electrode fluorescent lamps have focused mainly on its use of a type of high frequency (MHz). By performing high brightness using a square wave operation method with the low frequency below 100kHz, which is applied to a narrowed tube type lamp that has several mm of lamp diameter. To solve these problems of CCFL, EEFL (External Electrode Fluorescent Lamp) is introduced. Because electrode of EEFL is on the outer surface of discharge tube, the electrode is perfectly prevented from the sputtering by accelerated ions. And it is possible to drive the many CCFLs at the same time, because EEFL shows the positively resistant characteristic. But EEFL has the large non-radiative power loss in sheath. In this study the novel electrode structure was introduced in order to reduce non-radiative power loss in sheath of EEFL. The novel electrode structure comes from the idea to combine conceptually capacitive discharge with inductive discharge. Thus, this study verifies the change in the optical characteristics according to the change in electrode structure through a Maxwell's electromagnetic field simulation and examines the relationship between the change in the EEFL electrode structure and brightness by measuring the optical characteristics.

• Journal of Energy Engineering
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• v.28 no.3
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• pp.26-33
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• 2019

A comparison of CL 13% and 17% IBLOCA counterpart tests(CPTs) between the ATLAS and LSTF facilities was carried out and the behavior of peak cladding temperatures(PCTs) and related thermal hydraulic phenomena were investigated and discussed. There appeared quite a big difference in PCT behavior between the two CPTs and a further comparison of reactor coolant system design between the two facilities was performed. As a result, there was a difference in fuel alignment plate (FAP) design, e.g., one FAP in ATLAS, a combination of upper core plate and upper end box in LSTF, respectively. The FAP design mainly affects the reflux condensate behavior in IBLOCA tests and any difference in FAP design can be a possible reason for different PCT behavior between the two facilities. It should be a further study to find the reason of different PCT behvior between the two facilites.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.3973-3982
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• 2023

As for two-phase flow in rectangular channels, the flow regimes especially like churn-turbulent and annular flow are significant for the physical problem like Countercurrent Flow Limitation (CCFL). In this study, the rectangular channels with cross-sections of 4 × 66 mm, 6 × 66 mm, 8 × 66 mm are adopted to investigate the flow regimes of air-water vertical upward two phase flow under adiabatic condition. The gas and liquid superficial velocities are 0 ≤ j_g ≤ 20m/s and 0.25 ≤ j_f ≤ 3m/s respectively which covering bubbly to annular flow. The flow regimes are identified by random forest algorithm and the flow regime maps are obtained. As the results, the transitional void fraction from slug to churn turbulent flow fluctuate from 0.47 to 0.58 which is significantly affected by the dimensional size of channel and flow rate. Besides, the void fraction at transitional points from churn-turbulent (slug) to annular flow are 0.66-0.67, which are independent with the gap size. Furthermore, a new criteria of slug to churn-turbulent flow is established in this study. In addition, by introducing the interfacial force model, the criteria of churn-turbulent (slug) flow to annular flow is verified.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.7
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• pp.420-424
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• 2016

In this study, we developed photocatalytic technology to address the emerging serious problem of air pollution through indoor air cleaning. A single layer of $WO_3$ was prepared by using the dry process of general RF magnetron sputtering. At a base vacuum of $1.8{\times}10^{-6}$[Torr], the optical and electrical properties of the resulting thin films were examined for use as a transparent electrode as well as a photocatalyst. The single layer of $WO_3$ prepared at an RF power of 100 [W], a pressure of 7 [mTorr] and Ar and $O_2$ gas flow rates of 70 and 2 sccm, respectively, showed uniform and good optical transmittance of over 80% in the visible wavelength range from 380 [nm] to 780 [nm]. The optical catalyst characteristics of the $WO_3$ thin film were examined by investigating the optical absorbance and concentration variance in methylene blue, where the $WO_3$ thin film was immersed in the methylene blue. The catalytic characteristics improved with time. The concentration of methylene blue decreased to 80% after 5 hours, which confirms that the $WO_3$ thin film shows the characteristics of an optical catalyst. Using the reflector of a CCFL (cold cathode fluorescent lamp) and the lens of an LED (lighting emitting diode), it is possible to enhance the air cleaning effect of next-generation light sources.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Korean Journal of Materials Research
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• v.19 no.3
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• pp.163-168
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• 2009

$Eu^{3+}$-doped $Y_2O_3$ red phosphor was synthesized in a flux method using the chemicals $Y_2O_3,\;Eu_2O_3,\;H_3BO_3$ and $BaCl_2{\cdot}2H_2O$. The effect of a flux addition on the preparation of $Y_2O_3:Eu_{3+}$ red phosphor used as a cold cathode fluorescence lamp was investigated. $H_3BO_3$ and $BaCl_2{\cdot}2H_2O$ fluxes were used due to their different melting points. The crystallinity, thermal properties, morphology, and emission characteristics were measured using XRD, TG-DTA, SEM, and a photo-excited spectrometer. Under UV excitation of 254 nm, $Eu_2O_3$ 3.7 mol% doped $Y_2O_3$ exhibited a strong narrow-band red emission, peaking at 612 nm. From this result, the phosphor synthesized by firing $Y_2O_3$ with 3.7 mol% of $Eu_2O_3$, 0.25 mol% of $H_3BO_3$ and 0.5 mol% of $BaCl_2{\cdot}2H_2O$ fluxes at $1400^{\circ}C$ for 2 hours had a larger particle size of $4{\mu}m$ on average compared to the phosphor of the $H_3BO_3$ flux alone. In addition, a phosphor synthesized by the two fluxes together had a rounder corner shape, which led to the maximum emission intensity.

• Journal of the Korean Vacuum Society
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• v.19 no.1
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• pp.36-44
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• 2010

The ambipolar diffusion equation has been solved in a fine-tube lamp of a few mm in diameter. In the diffusion of radial direction, the plasma diffuses and vanishes away at the glass wall by recombination with the characteristic time of plasma loss is given by $\tau_r\;=\;(r_0/2.4)^2/D_a$. With the radius $r_0{\sim}1\;mm$ and the ambipolar diffusion coefficient $D_a{\sim}0.01\;m^2/s$, the vanishing time is calculated $\tau_r{\sim}10\;{\mu}s$ which corresponds to the least value of frequency 30 kHz for the sustaining the plasma in the operation of high voltage AC-power. In the diffusion of longitudinal z-direction, a high density plasma generated at the area of a high voltage electrode, diffuses into the positive column with the characteristic time $\tau_z{\sim}0.1\;s$. The plasma diffusion velocity at the boundary of high density plasma is $u_D{\sim}10^2\;m/s$ at the time $t{\sim}10^{-6}$ s and the diffusion velocity becomes slow as $u_D{\sim}1\;m/s$ at $t{\sim}10^{-3}\;s$. Therefore, for the long lamp of 1 m, it takes about several seconds for the high density plasma at the area of electrode to diffuse through the whole positive column space.

• Journal of the Korean Vacuum Society
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• v.17 no.4
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• pp.331-340
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• 2008

A method of measuring the current and voltage is suggested in the circuit of cold cathode fluorescent lamps (CCFLs) which are driven at a high frequency of $50{\sim}100\;kHz$ and a high voltage of several kV. It is difficult to measure the current and voltage in the lamp circuit, because the impedance of the probe at high voltage side causes the leakage current and the variation of luminance. According to the analysis of equivalence circuit with the probe impedance and leakage current, the proper measuring method is to adjust the input DC voltage and to keep the specific luminance when the probe is installed at a high voltage circuit. The lamp current is detected with a current probe or a high frequency current meter at the ground side and the voltage is measured with a high voltage probe at the high voltage side of lamp. The lamp voltage($V_C$) is measured between the ballast capacitor and the lamp electrode, and the output voltage($V_I$) of inverter is measured between inverter output and ballast capacitor. As the phases of lamp voltage($V_C$) and current ($I_G$) are nearly the same values, the real power of lamp is the product of the lamp voltage($V_C$) by the lamp current($I_G$). The measured value of the phase difference between inverter output voltage($V_I$) and lamp current($I_G$) is appreciably deviated from the calculated value at $cos{\theta}=V_C/V_I$.