• River and Culture
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• v.8 no.4
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• pp.58-63
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• 2012

• The Korea Swine Journal
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• v.14 no.11 s.159
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• pp.58-61
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• 1992

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2005.11a
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• pp.58-58
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• 2005

• 한국초전도학회:학술대회논문집
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• v.11
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• pp.58-58
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• 2001

• Kyungpook Mathematical Journal
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• v.58 no.4
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• pp.589-597
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• 2018

For $A,B{\in}M_2(\mathbb{C})$, let the Jordan product be AB + BA and G(A) the eigenvalue inclusion set, the Gershgorin set of A. Characterization is obtained for maps ${\phi}:M_2(\mathbb{C}){\rightarrow}M_2(\mathbb{C})$ satisfying $$G[{\phi}(A){\phi}(B)+{\phi}(B){\phi}(A)]=G(AB+BA)$$ for all matrices A and B. In fact, it is shown that such a map has the form ${\phi}(A)={\pm}(PD)A(PD)^{-1}$, where P is a permutation matrix and D is a unitary diagonal matrix in $M_2(\mathbb{C})$.

• ETRI Journal
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• v.38 no.6
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• pp.1163-1171
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• 2016

Integration technologies involving flexible substrates are receiving significant attention owing the appearance of new products regarding wearable and Internet of Things technologies. There has been a continuous demand from the industry for a reliable bonding method applicable to a low-temperature process and flexible substrates. Up to now, however, an anisotropic conductive film (ACF) has been predominantly used in applications involving flexible substrates; we therefore suggest low-temperature lead-free soldering and bonding processes as a possible alternative for flex-on-flex applications. Test vehicles were designed on polyimide flexible substrates (FPCBs) to measure the contact resistances. Solder bumping was carried out using a solder-on-pad process with Solder Bump Maker based on Sn58Bi for low-temperature applications. In addition, thermocompression bonding of FPCBs was successfully demonstrated within the temperature of $150^{\circ}C$ using a newly developed fluxing underfill material with fluxing and curing capabilities at low temperature. The same FPCBs were bonded using commercially available ACFs in order to compare the joint properties with those of a joint formed using solder and an underfill. Both of the interconnections formed with Sn58Bi and ACF were examined through a contact resistance measurement, an $85^{\circ}C$ and 85% reliability test, and an SEM cross-sectional analysis.

• KSBB Journal
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• v.18 no.1
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• pp.14-18
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• 2003

In this study of the simultaneous saccharification and fermentation (SSF) of paper sludge, fed-batch cultivation of Lactobacillus paracasei subsp. paracasei KLB58 was attempted to produce viable KLB58 cells and lactic acid. Optimal culture conditions, including the temperature and concentration of the supplemented enzyme, were examined in terms of lactic acid production and viable cell count. When the effects of culture temperature and $\beta$-glucosidase concentration were examined in fed-batch SSF, the highest viable cell counts and lactic acid production (i.e. 5$\times$$10^9$ CFU/ml and 45 g/L, respectively) were obtained at 37$^{\circ}C$ and 2 unit/ml of $\beta$-glucosidase.

• Magazine of the Korea Concrete Institute
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• v.19 no.4
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• pp.52-58
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• 2007

• The Korean Journal of Pesticide Science
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• v.2 no.2
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• pp.97-101
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• 1998

Agrobacterium vitis causes a crown gall disease in grapevine and that is one of the major hindrances for the wide cultivation and production of grapevine. We studied the possibility of biological control using selected biological control agent. One isolate from the infected soil, named as strain 27, was able to inhibit the biovar 1; A. tumefaciens C58 and Ach5, biovar 2; A. rhizogenes 13264, and biovar 3; A. vitis, in vitro and in vivo test. The putative biological control agent, A. radiobacter strain 27 was carrying the plasmid and the size of isolated plasmid was very similar to that of pAgK84 of A. radiobacter K84.

• Journal of the Korean institute of surface engineering
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• v.50 no.6
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• pp.510-515
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• 2017

In this study, a transient liquid phase sintering (TLPS) process of Ag pastes mixed with a fusible metal alloy of Bi58Sn42 with the melting temperature of $138^{\circ}C$, was examined. After screen printing of the Ag pastes with and without Bi58Sn42 powders on polyimide (PI) substrates, the electrodes were heat-treated at different temperatures in the range between 150 and $300^{\circ}C$ for 60 min in air. Comparing the electrical conductivity of the Ag pastes with and without Bi58Sn42 alloy powder after the heat treatment, it was manifested that the low melting temperature alloy definitely played a major role in an increased conductivity when it is added into the Ag pastes by providing more electrical conduction paths between Ag particles. This can be explained by the fact that capillary force of the melts of Bi58Sn42 can contribute to the rearrangement of the Ag particles during the heat-treatment inducing better connectivity between the Ag particles.