• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.197-198
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• 2009

This paper describes the Raman scattering characteristics of polycrystalline (poly) 3C-SiC films, which were deposited on the thermally oxidized Si(100) substrate by the atmosphere pressure chemical vapor deposition (APCVD) method according to growth temperature. TO and LO phonon modes to 2.0m thick poly 3C-SiC deposited at $1180^{\circ}C$ were measured at 794.4 and $965.7\;cm^{-1}$ respectively. From the intensity ratio of $I_{(LO)}/I_{(TO)}$ 1.0 and the broad full width half maximum (FWHM) of TO modes, itcan be elucidated that the crystallinity of 3C-SiC forms polycrystal instead of disordered crystal and the crystal defect is small. At the interface between 3C-SiC and $SiO_2$, $1122.6\;cm^{-1}$ related to C-O bonding was measured. Here poly 3C-SiC admixes with nanoparticle graphite with the Raman shifts of D and G bands of C-C bonding 1355.8 and $1596.8\;cm^{-1}$. Using TO mode of 2.0 m thick poly 3C-SiC, the biaxial stress was calculated as 428 MPa.

• Cement
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• s.66
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• pp.12-15
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• 1977

석회석과 고로수재 slag을 1.6 : 1로 혼합 분쇄한 원료를 1,450$^{\circ}C$에서 소결하여 고$C_3A$ clinker를 얻었다. 이 clinker 중에는 $C_3S$ 40$\%$, $C_2S$ 31$\%$, $C_3A$ 22$\%$, $C_4AF$ 2$\%$를 함유하고 있으며 보통 크링카 보다 $C_3A$ 함량이 2$\~$3배 정도 높고, clinker 색은 연두색을 띄는 것이 특색이다. 이와 같이 $C_3A$ 함량이 높은 시멘트의 특성 및 제조 가능성을 검토한 결과는 다음과 같다. 1) 석회석과 slag를 1.6 : 1(61.5$\%$ : 38.5$\%$)로 사용할 경우 보통 시멘트 제조시 석회석 사용량 보다 약 28$\%$ 정도 절감되나 고품위의 석회석이 요구된다. 2) 동일 free CaO 0.4$\%$를 기준으로 소성할 경우 고$C_3A$ clinker가 보통 clinker 보다 소성 시간이 20분 단축된다. 3) carbonate 분해열을 비교하면 고$C_3A$ 시멘트 원료가 보통 시멘트 원료보다 116Kcal/$\cal{kg}$-cl 절감된다. 4) $C_3A$ 함량이 높아 가소성이 저하되고 표준연도의 시멘트 paste를 얻기 위하여서는 보통 시멘트 보다 많은 물량이 요구되며 응결시간도 빠르다. 5) Blaine 3,000$cm^3$/g으로 분쇄한 고$C_3A$ 시멘트의 3 일강도는 보통 시멘트 보다 40$\~$50$\cal{kg}$/$cm^3$ 더 높으나 28 일 강도는 다소 저하되는 경향이며 Blaine 5,000$cm^2$/g으로 분쇄한 고$C_3A$ 시멘트는 조강 시멘트와 같은 강도 수준이다.

• Journal of Sensor Science and Technology
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• v.17 no.5
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• pp.325-328
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• 2008

This paper describes the electrical properties of poly (polycrystalline) 3C-SiC thin films with different nitrogen doping concentrations. In-situ doped poly 3C-SiC thin films were deposited by APCVD at $1200^{\circ}C$ using HMDS (hexamethyildisilane: $Si_2(CH_3)_6)$) as Si and C precursor, and $0{\sim}100$ sccm $N_2$ as the dopant source gas. The peak of SiC is appeared in poly 3C-SiC thin films grown on $SiO_2/Si$ substrates in XRD(X-ray diffraction) and FT-IR(Fourier transform infrared spectroscopy) analyses. The resistivity of poly 3C-SiC thin films decreased from $8.35{\Omega}{\cdot}cm$ with $N_2$ of 0 sccm to $0.014{\Omega}{\cdot}cm$ with 100 sccm. The carrier concentration of poly 3C-SiC films increased with doping from $3.0819{\times}10^{17}$ to $2.2994{\times}10^{19}cm^{-3}$ and their electronic mobilities increased from 2.433 to $29.299cm^2/V{\cdot}S$, respectively.

• Journal of the Korean Ceramic Society
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• v.37 no.11
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• pp.1114-1118
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• 2000

Ti 및 C 입자로 이루어진 다공질 성형체에 용융 Si의 침윤 및 반응으로 새로운 Ti$_3$SiC$_2$합성공정이 개발되었다. 용융 Si 침윤에 의한 Ti$_3$SiC$_2$합성공정에서는 이제까지 연구된 합성방법 보다 넓은 조성 범위에서 Ti$_3$SiC$_2$의 합성이 이루어졌다. 용융 Si을 활성 매질로 사용한 Ti$_3$SiC$_2$의 합성에서는 성형체 조성, 원료 입자 크기 및 침윤되는 용융 Si의 양에 따라 합성되는 상 및 각 합성상의 양이 다르게 나타났다. Ti:Si:C=3:1:6 조성을 제외한 모든 조성의 시편에서 Ti$_3$SiC$_2$상이 합성되었으며, 일부 조성을 제외한 모든 조성의 시편에서 Ti$_3$SiC$_2$, TiC 및 SiC가 함께 합성되었다. 작은 Ti 입자로 이루어진 성형체를 사용하여 합성한 시편에서 Ti$_3$SiC$_2$상의 합성이 용이하게 이루어졌으며, 성형체 조성 및 침윤되는 Si의 양이 화학양론적으로 Ti$_3$SiC$_2$에 근접한 조성을 갖는 시편에서 Ti$_3$SiC$_2$를 높은 수율로 합성할 수 있었다.

• Journal of the Korean Ceramic Society
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• v.40 no.1
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• pp.87-92
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• 2003

$Ti_3AlC_2$was synthesized from TiCx and Al powder as a starting materials at the temperature range between$800^{circ}C;and;1500^{\circ}C$. The vacuum sintering and hot pressing methods were imployed to synthesize$Ti_3AlC_2$. The high purity$Ti_3AlC_2$was synthesized using TiCx and Al powder as starting materials without formation of Ti-Al intermetallic compound and Al-C compound.$Ti_2$AlC and$Ti_3AlC_2$were preferentially synthesized at$800^{\circ}C$and above$1200^{\circ}C$, respectively.$Ti_2$AlC formed at low temperature was transformed to$Ti_3AlC_2$by further reaction with TiC. In this study, the synthesis mechanism for$Ti_3AlC_2$was proposed. The synthesized$Ti_3AlC_2$showed the nano laminating structure consisting of$Ti_3AlC_2$crystal with the thickness of 45~120 nm.

• Korean Journal of Metals and Materials
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• v.50 no.8
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• pp.569-573
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• 2012

In order to understand the difference in SiC deposition between the $CH_3SiCl_3-H_2$ and $C_3H_8-SiCl_4-H_2$ systems, we calculate the phase stability among ${\beta}$-SiC, graphite and silicon. We constructed the phase-diagram of ${\beta}$-SiC over graphite and silicon via computational thermodynamic calculation considering pressure (P), temperature (T) and gas composition (C) as variables. Both P-T-C diagrams showed a very steep phase boundary between the SiC+C and SiC region perpendicular to the H/Si axis, and also showed an SiC+Si region with a H/Si value of up to 6700 in the $C_3H_8-SiCl_4-H_2$, and 5000 in the $CH_3SiCl_3-H_2$ system. This difference in phase boundaries is explained by the ratio of Cl to Si, which is 4 for the $C_3H_8-SiCl_4-H_2$ system and 3 for the $C_3H_8-SiCl_4-H_2$ system. Because the C/Si ratio is fixed at 1 in the $CH_3SiCl_3-H_2$ system while it can be variable in the $C_3H_8-SiCl_4-H_2$ system, the functionally graded material is applicable for better mechanical bonding during SiC coating on graphite substrate in the $C_3H_8-SiCl_4-H_2$ system.

• Korean Journal of Materials Research
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• v.7 no.8
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• pp.654-659
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• 1997

HMDS[Si$_{2}$(CH$_{3}$)$_{6}$]단일 선구체를 이용하여 화학증착 방법으로 성장된 3C-SiC/Si(001) 이종접합박막의 특성을 XRD, 라만 스펙트럼 및 투과전자현미경(TEM)등을 이용하여 조사하였으며 시판되고 있는 상용 3C-SiC/Si 시편을 같은 방법으로 분석하여 특성을 비교검토하였다. $C_{3}$H$_{8}$-SiH$_{4}$-H$_{2}$혼합가스를 선구체로 이용하여 5$\mu\textrm{m}$두께로 성장된 상용 3C-SiC/Si 이종접합박막 시료의 XRD스펙트럼에서는 강한 3C-SiC(002)피크 만이 관찰되었으며, 라만 스펙트럼의 LO피크는 970nm$^{-1}$ 정도에서 강하게 나타났다. TEM 관찰 결과 다수의 전위, 쌍정, 적층결함 및 APB와 같은 결정결함들이 3C-SiC/Si 계면 근처에 집중적으로 분포되어 있었으며 성장된 박막은 단결정임을 확인할 수 있었다. 선구체로 HMDS를 사용하여 0.3$\mu\textrm{m}$ 및 2$\mu\textrm{m}$ 두께로 성장시킨 3C-SiC/Si 박막 시료의 XRD 스펙트럼은 다소 완만한 3C-SiC(002) 피크와 함께 3C-SiC(111)피크가 관찰되었으며, TEM으로 확인한 결과 소경각 결정립들이 약 5˚-10˚ 정도 방위차를 가지고 성장하여 기둥구조(columnar structure)를 이루고 있기 때문임을 알 수 있었다. 라만 스펙트럼 분석 결과 박막의 LO 피크가 967-969nm$^{-1}$정도로 다소 낮은 wavenumber쪽으로 이동되어 박막 내에 상당한 응력이 존재함을 확인할 수 있었다. 이와 같은 HMDS 3C-SiC박막의 특성은 성장 온도가 낮고 박막 성장용 가스로 사용한 HMDS 선구체에서 탄소가 과잉으로 공급되기 때문으로 제안되었다.다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.275-275
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• 2008

This paper describe the fabrication of a Pd/polycrystalline 3C-SiC schottky diode and its characteristics, in which the polycrystalline 3C-SiC layer and Pd Schottky contact were deposited by using APCVD and sputter, respectively. Crystalline quality, uniformity, and preferred orientations of the Pd thin film were evaluated by SEM and XRD, respectively. Pd/poly 3C-SiC Schottky diodes were fabricated and characterized by I-V and C-V measurements. Its electric current density Js and barrier height voltage were measured as $2\times10^{-3}$ A/$cm^2$ and 0.58 eV, respectively. These devices were operated until about $400^{\circ}C$. Therefore, from these results, Pd/poly 3C-SiC Schottky devices have very high potential for high temperature chemical sensor applications.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.408-409
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• 2006

The polycrystalline 3C-SiC thin films heteroepitaxially grown by LPCVD method using single precursor 1. 3-disilabutane at $850^{\circ}C$. The crystallinity of the 3C-SiC thin film. was analyzed by XPS. Residual strain was investigated by Raman scattering. The surface morphology and voids between SiC and $SiO_2$ were measured by SEM. The grown poly 3C-SiC thin film is very good crystalline quality, surface like mirror, and low defect and strain. Therefore, the polycrystalline 3C-SiC is suitable for harsh environment MEMS applications.

• Childhood Kidney Diseases
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• v.17 no.1
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• pp.1-5
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• 2013

C3 glomerulonephritis (C3GN) is a recently described entity that shows a glomerulonephritis on light microscopy, bright C3 staining and the absence of C1q, C4, and immunoglobulins on immunofluorescence microscopy and mesangial and/or subendothelial electron-dense deposits on electron microscopy. The term 'C3 glomerulopathy' is often used to include C3GN and dense deposit disease (DDD), CFHR5 nephropathy, those of which result from dysregulation of the alternative pathway of complement. C3GN shares some aspects of atypical hemolytic uremic syndrome, MPGN, late stage of post infectious glomerulonephritis and other glomerulonephrtis. When C3GN is considered, measurement of serum complement proteins including C3, CFH, CFI, CFB and testing for the presence of C3 nephritic factor, anti-factor H autoantibodies are necessary. To screening for mutations, genes that encode complement regulators should be evaluated. This disorder equally affected all ages, both genders, and typically presented with hematuria and proteinuria. In both the short and long term, renal function remained stable in the majority of patients.