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http://dx.doi.org/10.3365/KJMM.2012.50.8.569

Thermodynamic Comparison of Silicon Carbide CVD Process between CH3SiCl3-H2 and C3H8-SiCl4-H2 Systems  

Choi, Kyoon (KICET Icheon Branch, Korea Institute of Ceramic Engineering and Technology)
Kim, Jun-Woo (KICET Icheon Branch, Korea Institute of Ceramic Engineering and Technology)
Publication Information
Korean Journal of Metals and Materials / v.50, no.8, 2012 , pp. 569-573 More about this Journal
Abstract
In order to understand the difference in SiC deposition between the $CH_3SiCl_3-H_2$ and $C_3H_8-SiCl_4-H_2$ systems, we calculate the phase stability among ${\beta}$-SiC, graphite and silicon. We constructed the phase-diagram of ${\beta}$-SiC over graphite and silicon via computational thermodynamic calculation considering pressure (P), temperature (T) and gas composition (C) as variables. Both P-T-C diagrams showed a very steep phase boundary between the SiC+C and SiC region perpendicular to the H/Si axis, and also showed an SiC+Si region with a H/Si value of up to 6700 in the $C_3H_8-SiCl_4-H_2$, and 5000 in the $CH_3SiCl_3-H_2$ system. This difference in phase boundaries is explained by the ratio of Cl to Si, which is 4 for the $C_3H_8-SiCl_4-H_2$ system and 3 for the $C_3H_8-SiCl_4-H_2$ system. Because the C/Si ratio is fixed at 1 in the $CH_3SiCl_3-H_2$ system while it can be variable in the $C_3H_8-SiCl_4-H_2$ system, the functionally graded material is applicable for better mechanical bonding during SiC coating on graphite substrate in the $C_3H_8-SiCl_4-H_2$ system.
Keywords
thin film; vapor deposition; phase diagram; thermodynamic calculation; computer simulation;
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Times Cited By KSCI : 2  (Citation Analysis)
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