• Journal of Biomedical Engineering Research
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• v.38 no.1
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• pp.16-24
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• 2017

For the development of feasible retinal prosthesis, one of the important elements is acquiring proper judging tool if electrical stimulus leads to patient's visual perception. If evoked potential to electrical stimulus is recorded in primary visual (V1) cortex, it means that the stimulus effectively evokes visual perception. Therefore, in this study, we established VEP recording system on V1 cortex using BioPAC modules as the judging tool. And the measuring system was evaluated by recording VEP of mice. After anesthesia, normal mice (C57BL/6J strain; n = 6) were secured to stereotaxic apparatus (Harvard Apparatus, USA). For the recording of VEP, the stainless steel needle electrode (impedance: $2-5k{\Omega}$) was positioned on the surface of the cortex through the burr hole at 2.5 mm lateral and 4.6 mm caudal to bregma. DA 100C and EEG 100C BioPAC modules were used for the trigger signal and VEP recording, respectively. When left eye was blocked by black cover and right eye was stimulated by flash light using HMsERG (RetVet Corp, USA), VEP response at left V1 cortex was detected, but there was no response at right V1 cortex. Amplitudes and latencies of P2, N3 peaks of VEP recording varied according to the depths of the electrodes on V1 cortex. From the surface upto $600{\mu}m$ depth, amplitudes of P2 and N3 increased, while deeper than $600{\mu}m$, those amplitudes decreased. The deeper the insertion depth of the electrode, the latency of N1 peaks tends to be delayed. However, there was no statistically significant difference among the latencies of P2 and N3 peaks (P > 0.05, ANOVA). Our VEP recording data such as the insertion depth and the latency and amplitudes of peaks might be used as guidelines for electrically-evoked potential (EEP) recording experiment in near future.

• Proceedings of the KIEE Conference
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• 2005.07d
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• pp.2606-2608
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• 2005

In this paper we describe the fault detection methods in a Dual-Redundant Power Controller(DRPC) for Control Rod Control System(CRCS). The DRPC has the function of fault detection for controller itself and power modules. And in this paper we have described the some complex items out of fault detection methods for CRCS. By utilizing the suggested methods, we are convinced that these methods are applied to commercial use before long.

• Proceedings of the KIEE Conference
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• 2004.07d
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• pp.2370-2373
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• 2004

In this paper we describe the design of a Dual-Redundant Power Controller(DRPC) for Control Rod Control System(CRCS). The CRCS also provides information regarding rod motion, rod position, and status of the Rod Control System. It has Hot/Stand-by type, and also has the function of fault detection for controller itself and power modules. We have implemented the various functions with the dual-redundant Power Controller. Due to the developed DRPC, we are assured that the commmecial use by this controller be made before long.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.8
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• pp.40-51
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• 1996

This paper describes some research works of computer-aided design of blanking and piercing progressive die for stator and rotor parts. An approach to the system is based on knowledge based rules. The deveolped system is composed of six modules such as main program, input and shape treatment, production feasibility check, strip layout, die layout and drawing edit module. Using this system, design parameters ( geometric shapes, die and punch dimensions and dimensions of tool elements) are determined and output is gen- erated in graphic from. Knowledges for tool design are extracted from the plasticity theories, handbooks, relevant references and empirical know-hows of experts in blkanking companies. The developed system provides powerful capabilities for process planning and die design of stator and rotor parts.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.7
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• pp.629-634
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• 2016

This paper describes the implementation of a ZigBee sensor node that can be utilized as a multiband and machine to machine (M2M) communication gateway. The IEEE 802.15.4-2003 standard was used as the wireless network frequency band. Ember's Type EM357 SoC was used as the transmission and reception device to perform the communication function, and it was also used for both the main M2M gateway and the sensor node. For the implementation of the operating protocol, EmberZNet Stack 4.5.4 from the Ember Corporation was used. The measurement of the reception sensitivity in the receiving module and the actual output signal from the reference were obtained from the transmission of a packet, and the packet included the M2M gateway within the attached ZigBee sensor. The packet error rate was measured as 0% with a -98 dBm reception sensitivity at the ZigBee frequency. In addition, excellent current characteristics of the ZigBee modules were shown by the implementation of the low-power circuit.

• Journal of Bio-Environment Control
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• v.28 no.2
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• pp.143-149
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• 2019

This study was conducted to investigate the graft-taking and growth of grafted cucumber seedlings as affected by light quality and blink cycle of LED modules. Four light quality treatments, namely blue, red, blue+red, white LED and four blink cycle levels of 5s/5s, 7s/3s, 9s/1s and control were provided to investigate the effect of lighting quality and blink cycle on the graft-taking and growth of grafted cucumber seedlings. Photoperiod for the control was 12/12 h. Photosynthetic photon flux, air temperature, and relative humidity for healing were maintained at $100{\mu}mol{\cdot}m^{-2}{\cdot}s^{-1}$, $25^{\circ}C$, and 90%, respectively. There was no significant difference in graft-taking of grafted cucumber seedlings according to light quality except the blue LED with the blink cycle of 5s/5s. Regardless of the blink cycle, there was no significant difference in graft-taking of cucumber seedlings healed under red, blue+red, and white LED modules. These results implied that the effects of light quality and blink cycle on the graft-taking were not significant. Differences in the leaf length, leaf area, and fresh weight of cucumber seedlings healed blue or red LED with the blink cycle of 9s/1s were found to be significant. There was no significant effect of the blink cycle on the growth of cucumber seedlings healed under white LED modules. The prices of white LED are gradually falling due to increased demand. Considering the manufacturing unit price of white LED modules, the cost savings of 10-15% are expected as compared to the conventional blue/red LED modules. Therefore, it was concluded that the use of white LED modules will be economical as an artificial lighting sources for healing of grafted seedlings.

• Journal of the Korean institute of surface engineering
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• v.49 no.2
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• pp.218-224
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• 2016

Thermal radiation pastes were prepared by dispersing carbon materials as fillers with a content of 1 weight percent in an acrylic resin. The kind of fillers was as follows; $25{\mu}m$ graphite, $45{\mu}m$ graphite, $15{\mu}m$ carbon nanotube(CNT), a 1:1 mixture of $25{\mu}m$ graphite and $15{\mu}m$ CNT, and a 1:1 mixture of $45{\mu}m$ graphite and $15{\mu}m$ CNT. Thermal emissivity was measured as 0.890 for the samples with graphite only, 0.893 for that with CNT only, and 0.892 for those containing both. After coating prepared pastes on a side of 0.4 mm thick aluminium plate and placing the plate over an opening of a box maintained at $92^{\circ}C$ with the coated side out, the temperatures on the uncoated side of the plates were measured. The samples containing graphite and CNT showed the lowest temperatures. The paste with mixed fillers was coated on the back side of the PCB of an LED module and thermal analysis was carried out using Thermal Transient Tester (T3ster) in a still air box. The thermal resistance of the module with coated PCB was measured as 14.34 K/W whereas that with uncoated PCB was 15.02 K/W. The structure function analysis of T3ster data revealed that the difference between junction and ambient temperatures was $13.8^{\circ}C$ for the coated case and $18.0^{\circ}C$ for the uncoated. From the infrared images of heated LED modules, the hottest-spot temperature of the module with coated PCB was lower than that of the uncoated one for a given period of LED operation.

• Bulletin of the Korean Mathematical Society
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• v.48 no.5
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• pp.1063-1078
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• 2011

Let M = {1, 2, ${\ldots}$, n} and let V = {$I{\subseteq}M:1{\in}I$}. Denote M\I by $I^c$ for $I{\in}V$. The goal of this paper is to investigate the solution and the stability using the alternative fixed point of generalized cubic functional equation $ \sum\limits_{I{\in}V}f(\sum\limits_{i{\in}I}a_ix_i-\sum\limits_{i{\in}I^c}a_ix_i)=2{^{n-2}{a_1}}\sum\limits_{i=2}^na_i^2[f(x_1+x_i)+f(x_1-x_i)]+2{^{n-1}{a_1}(a^2_1-\sum\limits_{i=2}^2a^2_i)f(x_1)$ in ${\beta}$-Banach modules on Banach algebras, where $a_1,{\ldots},a_n{\in}\mathbb{Z}{\backslash}\{0\}$ with $a_1{\neq}={\pm}1$ and $a_n=1$.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.12
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• pp.230-238
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• 1999

This paper describes a research work of developing computer-aided design of lead frame, semiconductor, with blanking operation which is very precise for progressive working. Approach to the system is based on the knowledge-based rules. Knowledge for the system is formulated from plasticity theories, experimental results and the empirical knowledge of field experts. This system has been written in AutoLISP on the AutoCAD using a personal computer and in I-DEAS Drafting Programming Language on the I-DEAS Master Series Drafting with Workstation, HP9000/715(64) and tool kit on the ESPRIT. Transference of data among AutoCAD, I-DEAS Master Series Drafting, and ESPRIT is accomplished by DXF(drawing exchange format) and IGES(initial graphics exchange specification) methods. This system is composed of six modules, which are input and shape treatment, production feasibility check, strip-layout, die-layout, modelling, and post-processor modules. The system can design process planning and Die design considering several factors and generate NC data automatically according to drawings of die-layout module. As forming process of high precision product and die design system using 2-D geometry recognition are integrated with technology of process planning, die design, and CAE analysis, standardization of die part in die design and process planning of high pression product for semiconductor lead frame is possible to set. Results carried out in each module will provide efficiencies to the designer and the manufacturer of lead frame, semiconductor.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.71-76
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• 2001

This paper describes a research work of developing system for conceptual die design system for Fine blanking. The method of approaching to the system is based on the knowledge-based rules. Knowledge for the system is formulated from experimental results and the empirical knowledge of field experts. This system has been written in VisualLISP on the AutoCAD using a personal computer and in Microsoft Visual Basic ver.6.0. Transference of data is accomplished by DXF (Drawing Exchange Format) method. This system consists of six modules, which are cognition of a drawing, cognition of shear length, calculation of shear force, materials properties database, determination of degree of difficulty of the product, determination of approximate life of punch and die modules. Results carried out in each module will provide efficiency to the designer and the manufacturer of die for Fine blanking. But the main focus of this system is the design of die for Fine blanking in the level of general concept. In order to use powerful tool in this field, developed system will be studied continuously.