• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.553-554
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• 2007

By sol-gel method, we have fabricated silica-titania hybrid film using silane treated colloidal $TiO_2$ and characterized the film through FT-IR, TGA, UV-VIS and AFM. The silica-titania hybrid film showed Ti-O-Si chemical bond at FT-IR peak of $910{\sim}940cm^{-1}$. The fabricated hybrid film showed thermal stability of around $350^{\circ}C$(5wt% loss temperature) and transparency more than 90%. In addition, the good surface smoothness was confirmed by AFM. Therefore, the silica-titania hybrid film with outstanding properties can be potential for application in electronics and displays.

• Journal of the Korean Vacuum Society
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• v.13 no.2
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• pp.72-78
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• 2004

Cu seed layers deposited by magnetron sputtering onto tantalum nitride barrier films were treated with ECR plasma and then the copper films were electroplated and rapid thermal annealed in an argon or nitrogen atmosphere at various temperatures ranging from 200 to $500^{\circ}C$. Changes in the microstructure and physical properties of the copper films electroplated on the hydrogen ECR plasma cleaned copper seed layers were investigated using X-ray diffraction (XRD), electron back-scattered diffraction (EBSD), and atomic force microscopy (AFM) analyses. It was found that the copper film undergoes complete recrystallization during annealing at a temperature higher than $400^{\circ}C$. The resistivity of the Cu film tends to decrease and the degree of (111) preferred orientation tends to increase as the annealing temperature increases. Theoptimum annealing condition for obtaining the film with the lowest resistivity, the smoothest surface and the highest degree of the (111) preferred orientation is rapid thermal annealing in a nitrogen atmosphere at $400^{\circ}C$ for 120 s. The resistivity and the surface roughness of the electroplated copper film annealed under this condition are 1.98 $\mu$O-cm and 17.77 nm, respectively.

• Journal of Sensor Science and Technology
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• v.8 no.6
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• pp.476-480
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• 1999

PbSe thin films were grown using PLD method on the p-Si(100) substrate. To determine what crystalline structure of PbSe thin films have according to the growth temperature, the films were prepared under a substrate temperature changing between a room temperature and $400^{\circ}C$. As a result of analyzing XRD patterns of PbSe thin films prepared at various substrate temperatures and FWHM of PbSe(200) rocking curve, it was found that PbSe thin film obtained at the growth temperature of $200^{\circ}C$ was best crystallized. In addition, the surface morphology of PbSe thin film observed using AFM found itself having the most regularly arranged particles in case of growing the film at $200^{\circ}C$. The measurement of Hall effect indicated that PbSe thin films were n-type semiconductors and that current-voltage characteristic curve exhibit the typical p-n junction phenomenon. In addition, electric conductivity of PbSe thin films was found somewhat higher than that of general semiconductors.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.260-260
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• 2010

OTFT소자는 각 박막계면간의 접촉성에 따라 그 성능이 좌우 된다는 것은 널리 알려진 사실이다. 즉 박막계면간의 접촉성 저하는 계면간의 결함을 형성하여 OTFT소자 성능을 저하시킨다. 이러한 결함을 고품질의 자기조립단분자막을 제작함으로써 박막계면간 결함을 최소화 할 수 있다. 이러한 고품질의 자기조립단분자막 형성은 박막계면간의 결함을 최소화 하기때문에 고성능OTFT소자 제작시 박막계면간 접촉성 향상에 효율적으로 적용할 수 있을것이다. 이 논문에서는 계면간의 접촉성 향상을 위해 실리콘 웨이퍼 위에 3-Aminoproplytriethoxtsilane과 용매인 무수톨루엔을 이용하여 고품질의 자기조립단분자막을 제작 하였으며 고품질을 자기조립단분자막 성장 조건을 찾기 위해 엄격한 수분조절 및 APS농도, 담근시간, 온도를 조절하여 각기 다른 조건의 샘플을 제작하였다. 또한 APS성장 분포를 알기위하여 접촉각 측정기를 이용하여 접촉각을 측정 하였고 AFM 이용하여 실리콘 웨이퍼에 생성된 박막의 균질도를 측정하였다. 그 결과 APS농도(33%) 24시간 $25^{\circ}C$, APS농도(33%) 24시간 $70^{\circ}C$, APS농도(33%) 72시간 $25^{\circ}C$, APS농도 (33%) 72시간 $70^{\circ}C$ 샘플이 기존에 알려진 APS 접촉각인 $19^{\circ}C{\sim}21^{\circ}C$ 접촉각이 나왔으며 AFM 이미지 또한 높은 균질도를 보였다. 이 결과 고품질의 APS단분자막은 농도와 시간 그리고 온도에 영향은 받으며 이렇게 완성된 단분자막은 높은 균질도를 가지게 된다. 현재 실험을 통해 얻어진 고품질의 자기조립단분자막 성장 조건을 이용하여 OTFT소자 제작하고 있으며 고품질의 자기조립단분자막 형성에 의해 결함을 최소화 하므로써 박막계면간 옴성결합을 형성하여 OTFT소자의 성능 향상이 기대되어 진다.

• Journal of the Korean Vacuum Society
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• v.17 no.3
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• pp.226-233
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• 2008

The nucleation and evolution process of Ge nano-islands on Si(001) surfaces grown by chemical vapor deposition have been explored using atomic force microscopy (AFM). The Ge nano-islands are grown by exposing the substrates to a mixture of gasses GeH4 and H2 at pressure of 0.1-0.5Torr and temperatures of $600-650^{\circ}C$. The effect of growth conditions such as temperature, Ge thickness, annealing time on the shape, size, number density, and surface distribution was investigated. For Ge deposition greater than ${\sim}5$ monolayer (ML) with a growth rate of ${\sim}0.1ML/sec$ at $600^{\circ}C$, we observed island nucleation on the surface indicating the transition from strained layer to island structure. Further deposition of Ge led to shape transition from initial pyramid and hut to dome and superdome structure. The lateral average size of the islands increased from ${\sim}20nm$ to ${\sim}310nm$ while the number density decreased from $4{\times}10^{18}$ to $5{\times}10^8cm^{-2}$ during the shape transition process. In contrast, for the samples grown at a relatively higher temperature of $650^{\circ}C$ the morphology of the islands showed that the dome shape is dominant over the pyramid shape. The further deposition of Ge led to transition from the dome to the superdome shape. The evolution of shape, size, and surface distribution is related to energy minimization of the islands and surface diffusion of Ge adatoms. In particular, we found that the initially nucleated islands did not grow through long-range interaction between whole islands on the surface but via local interaction between the neighbor islands by investigation of the inter-islands distance.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.319-323
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• 2007

This paper describes the mechanical characteristics of poly 3C-SiC thin films grown on Si wafers with thermal oxide. In this work, the poly 3C-SiC thin film was deposited by APCVD method using only Ar carrier gas and single precursor HMDS at $1100^{\circ}C$. The elastic modulus and hardness of poly 3C-SiC thin films were measured using nanoindentation. Also, the roughness of surface was investigated by AFM. The resulting values of elastic modulus E, hardness H and the roughness of the poly 3C-SiC film are 305 GPa, 26 GPa and 49.35 nm respectively. The mechanical properties of the grown poly 3C-SiC film are better than bulk Si wafers. Therefore, the poly 3C-SiC thin film is suitable for abrasion, high frequency and MEMS applications.

• Korean Journal of Materials Research
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• v.14 no.7
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• pp.505-510
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• 2004

The glass-ceramic based on LAS($Li_{2}O-Al_{2}O_3-SiO_{2}$) system was observed using SEM(Scanning Electric Microscopy) and AFM(Atomic Force Microscopy) and it was expected to get a correlation between the crystal size and the surface roughness through the result. At heat treatment conditions (the nucleation: $740\~800^{\circ}C$, the crystal growth: $900\~1150^{\circ}C$), the crystal size was increased from 72 to 450 nm so that the mean of surface roughness was also risen from 0.8 to 6.3 nm. Based on the results, the surface roughness of glass-ceramic is controlled by the factors, crystal size, crystallines, and the condition of heat treatment.

• Journal of IKEEE
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• v.14 no.3
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• pp.219-223
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• 2010

In this study, we fabricated the HgSe nanoparticle-based thin film transistors (TFTs) of back gate structure with PVA gate dielectric. The fabricated TFTs show the improved electrical characteristics in the mobility of $16\;cm^2$/Vs and the on/off ratio of $10^4$ after annealing process at $100^{\circ}C$ for 5 min. AFM images demonstrate that the decrease in surface roughness according to annealing process leads to the improvement of electrical characteristics. The change in drain current caused from the conditions of flexible substrate is investigated under 0.6% strain.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.6
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• pp.460-464
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• 2003

The barium strontium titannate ((Ba,Sr)TiO$_3$:BST) thin films were etched in an inductively coupled plasma (ICP) as a function of CF$_4$/Ar gas mixing ratio. Under CF$_4$(20%)/Ar(80%), the maximum etch rate of the BST films was 400 $\AA$/min. Etching products were redeposited on the surface of BST and then the nature of crystallinity were varied. Therefore, we investigated the etched surface of BST by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The plasma damages were evaluated in terms of leakage current density by Agilent 4145C and dielectric constant by HP 4192 impedance analyzer. After the BST thin films exposed in the plasma, the leakage current density and roughness increases. After annealing at 600 $^{\circ}C$ for 10 min in $O_2$ ambient, the leakage current density, roughness and nonvolatile etch byproducts reduced. From this results, the plasma induced damages were recovered by annealing process owing to the relaxation of lattice mismatches by Ar ions and the desorption of metal fluorides in high temperature.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.204-204
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• 2012

Peierls instability and spin ordering of zigzag graphene nanoribbons (GNR) created on a fully hydrogenated graphene (graphane) are investigated as a function of their width using first-principles density-functional calculations within the generalized-gradient approximation. For the width containing a single zigzag C chain (N=1), we find the presence of a Peierls instability with a bond alternated structure. However, for width greater than N=1, the Peierls distortion is weakened or disappears because of the incommensurate feature of Fermi surface nesting due to the interaction of C chains. Instead, there exists the antiferromagnetic (AFM) spin ordering in which the edge states are ferromagnetically ordered but the two ferromagnetic (FM) edges are antiferromagnetically coupled with each other, showing that electron-lattice coupling and spin ordering in GNR are delicately competing at an extremely thin width of N=2. It is found that, as the width of GNR increases, the energy gain arising from spin ordering is enhanced, but the energy difference between the AFM and FM (where two edge states are ferromagnetically coupled with each other) orderings decreases.