• 한국결정성장학회지
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• 제9권2호
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• pp.212-216
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• 1999

SiC(3C) 광다이오드는 p-형 Si 위에 tetramethylsilane (TMS)를 열분해아여 화학기상증착법으로 성장된 SiC(3C) 에피층을 성장하여 제작되었다. SiC(3C)의 전기적 특성은 홀 측정(Hall measurement) 및 전류-전압(I-V) 특성으로 조사되었다. SiC(3C) 에피층의 전도형은 n-형이었다. 저항성 접촉은 마스크 (shadow-mask)를 통해서 Al을 열증착하여 형성하였다. SiC(3C)광다이오드의 광학적 이득(photovoltaic detection)를 해석하기 위하여 SiC(3C) 에피층의 Spectral response (SR)를 전기적 변수(electrical parameter) 및 광다이오드의 기하학적 구조(geometric structure)를 고려하여 계산하였다. 적절히 선정된 변수들로부터 계산된 SR의 최대값은 550 nm에서 약 0.75이었고, 파장영역 400~600 nm 사이에서 청색 및 근자외선 광검지기로서 매우 유용하다.

• 한국주조공학회지
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• 제17권2호
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• pp.180-187
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• 1997

The influence of solidification condition on the segregation of SiC particles in the $Al-xSi/6wt%SiC_p$(x: 6, 10, 14, 18${\cdot}$wt%) composites was investigated in the study. The results are as follows: 1) During the counter-gravity unidirectional solidification of $Al-Si/SiC_p$ composites melt, most of the SiC particles are pushed to the top of the casting. 2) The SiC particles pushing in the $Al-Si/SiC_p$ composite melts are not observed, when the interface velocity of melts increases more than 1.41 ${\mu}m/sec$. 3) The SiC particles are entrapped in the interdendrite regions, when the sizes of SiC particles in the $Al-Si/SiC_p$ composites are large than ${\varphi}22{\mu}m$.

• 한국결정성장학회지
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• 제9권1호
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• pp.39-42
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• 1999

N-도핑된 3C-SiC (N-SiC(3C))을 화학기상증착(CVD)으로 $1250^{\circ}C$에서 Si(111) 기판 위에 tetramethylsilane(TMS)를 열분해하여 성장하였다. 수송가스는 $H_{2}$이었고, N-SiC(3C) 에피층은 CVD로 성장되는 동안 $NH_{3}$에 의하여 n-형으로 도핑되었다. N-SiC(3C)의 물리적 특성은 적외선 분광(FTIR), X-선 회절(XRD), 라만 스펙트럼(Raman spectrum), 단면 투과전자영상(XTEM), Hall 측정 및 p/n 다이오드의 전압-진압(I-V) 특성에 의하여 조사되었다. N-도핑된 SiC(3C) 에피층의 전도형은 n-형이었고, 전도형은 $NH_{3}$를 사용한 N-dopant에 의하여 저온에서 잘 조절될 수 있다.

• 한국전기전자재료학회논문지
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• 제20권2호
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• pp.156-161
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• 2007

This paper describes the characteristics of polycrystalline ${\beta}$ or 3C (cubic)-SiC (silicon carbide) thin films heteroepitaxailly grown on Si wafers with thermal oxide. In this work, the poly 3C-SiC film was deposited by APCVD (atmospheric pressure chemical vapor deposition) method using HMDS (hexamethyildisilane: $Si_{2}(CH_{3}_{6})$ single precursor. The deposition was performed under various conditions to determine the optimized growth conditions. The crystallinity of the 3C-SiC thin film was analyzed by XPS (X-ray photoelectron spectroscopy), XRD (X-ray diffraction) and FT-IR (fourier transform-infrared spectometers), respectively. The surface morphology was also observed by AFM (atomic force microscopy) and voids or dislocations between SiC and $SiO_{2}$ were measured by SEM (scanning electron microscope). Finally, depth profiling was invesigated by GDS (glow discharge spectrometer) for component ratios analysis of Si and C according to the grown 3C-SiC film thickness. From these results, the grown poly 3C-SiC thin film is very good crystalline quality, surface like mirror and low defect. Therfore, the poly 3C-SiC thin film is suitable for extreme environment, Bio and RF MEMS applications in conjunction with Si micromaching.

• 한국재료학회지
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• 제26권6호
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• pp.337-341
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• 2016

Cu-30 vol% SiC composites with relatively densified microstructure and a sound interface between the Cu and SiC phases were obtained by pressureless sintering of PCS-coated SiC and Cu powders. The coated SiC powders were prepared by thermal curing and pyrolysis of PCS. Thermal curing at $200^{\circ}C$ was performed to fabricate infusible materials prior to pyrolysis. The cured powders were heated treated up to $1600^{\circ}C$ for the pyrolysis process and for the formation of SiC crystals on the surface of the SiC powders. XRD analysis revealed that the main peaks corresponded to the ${\alpha}$-SiC phase; peaks for ${\beta}$-SiC were newly appeared. The formation of ${\beta}$-SiC is explained by the transformation of thermally-cured PCS on the surface of the initial ${\alpha}$-SiC powders. Using powder mixtures of coated SiC powder, hydrogen-reduced Cu-nitrate, and elemental Cu powders, Cu-SiC composites were fabricated by pressureless sintering at $1000^{\circ}C$. Microstructural observation for the sintered composites showed that the powder mixture of PCS-coated SiC and Cu exhibited a relatively dense and homogeneous microstructure. Conversely, large pores and separated interfaces between Cu and SiC were observed in the sintered composite using uncoated SiC powders. These results suggest that Cu-SiC composites with sound microstructure can be prepared using a PCS coated SiC powder mixture.

• 한국세라믹학회지
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• 제37권11호
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• pp.1114-1118
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• 2000

Ti 및 C 입자로 이루어진 다공질 성형체에 용융 Si의 침윤 및 반응으로 새로운 Ti$_3$SiC$_2$합성공정이 개발되었다. 용융 Si 침윤에 의한 Ti$_3$SiC$_2$합성공정에서는 이제까지 연구된 합성방법 보다 넓은 조성 범위에서 Ti$_3$SiC$_2$의 합성이 이루어졌다. 용융 Si을 활성 매질로 사용한 Ti$_3$SiC$_2$의 합성에서는 성형체 조성, 원료 입자 크기 및 침윤되는 용융 Si의 양에 따라 합성되는 상 및 각 합성상의 양이 다르게 나타났다. Ti:Si:C=3:1:6 조성을 제외한 모든 조성의 시편에서 Ti$_3$SiC$_2$상이 합성되었으며, 일부 조성을 제외한 모든 조성의 시편에서 Ti$_3$SiC$_2$, TiC 및 SiC가 함께 합성되었다. 작은 Ti 입자로 이루어진 성형체를 사용하여 합성한 시편에서 Ti$_3$SiC$_2$상의 합성이 용이하게 이루어졌으며, 성형체 조성 및 침윤되는 Si의 양이 화학양론적으로 Ti$_3$SiC$_2$에 근접한 조성을 갖는 시편에서 Ti$_3$SiC$_2$를 높은 수율로 합성할 수 있었다.

• 한국재료학회지
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• 제25권5호
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• pp.258-263
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• 2015

To fabricate porous SiC-Si composites for heating element applications, both SiC powders and Si powders were mixed and sintered together. The properties of the sintered SiC-Si body were investigated as a function of SiC particle size and/or Si particle contents from 10 wt% to 40 wt%, respectively. Porous SiC-Si composites were fabricated by Si bonded reaction at a sintering temperature of $1650^{\circ}C$ for 80 min. The microstructure and phase analysis of SiC-Si composites that depend on Si particle contents were characterized using scanning electron microscope and X-ray diffraction. The electrical resistivity of SiC-Si composites was also evaluated using a 4-point probe resistivity method. The electrical resistivity of the sintered SiC-Si body sharply decreased as the amount of Si addition increased. We found that the electrical resistivity of porous SiC-Si composites is closely related to the amount of Si added and at least 20 wt% Si are needed in order to apply the SiCSi composites to the heating element.

• 한국세라믹학회지
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• 제29권9호
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• pp.750-756
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• 1992

Reaction bonded si-SiC composites were prepared by silicon infiltration technique at temperature of 1$600^{\circ}C$ for 30 minutes in vaccum atmosphere. The microstructure and mechanical properties of Si-SiC composites were investigated and characterized. UF-15 and SE-10 as SiC powders, phenolic resin and carbon black as carbon source, and metallic silicon powder as molten Si source were used as starting materials. New SiC crystallines nucleatd and grown by reaction of Si and C were detected by TEM and SEM-EDS. The bonding between new and original SiC was found to be strong. But the wetting of SiC by unreacted metallic Si and the rapid grain growth of new SiC decreased density and fracture toughness. Fracture toughness and modulus of rupture of Si-SiC composite were about 3.2 MPa.m1/2 and 480 MPa, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.45-45
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• 2009

This paper describes the formation of porous 3C-SiC by anodization. 3C-SiC thin films were deposited on p-type Si(100) substrates by APCVD using HMDS (Hexamethyildisilane: $Si_2(CH_3)_6$). UV-LED(380 nm) was used as a light source. The surface morphology was observed by SEM and the pore size was increased with increase of current density. Pore diameter of 70 ~ 90 nm was achieved at 7.1 $mA/cm^2$ current density and 90 sec anodization time. FT-IR was conducted for chemical bonding of thin film and porous 3C-SiC. The Si-H bonding was observed in porous 3C-SiC around wavenumber 2100 $cm^{-1}$. PL shows the band gap enegry of thin film (2.5 eV) and porous 3C-SiC (2.7 eV).

• 공업화학
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• 제5권6호
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• pp.1044-1055
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• 1994

Ar 또는 $Ar/H_2$ 가스유통(100~500ml/min)하에서 $ZrSiO_4/C$계 및 $ZrSiO_4/Al/C$계로부터 ZrC/SiC 복합분체의 합성을 $1600^{\circ}C$ 온도범위 내에서 시도하고, 이의 생성기구, 생성속도 및 분체특성을 검토하였다. $ZrSiO_4/C$계에서는 $1400^{\circ}C$ 이상에서 $ZrO_2(s)$와 SiO(g)가 각각 탄소와 경쟁반응하여 ZrC 및 SiC를 생성하였다. ZrC생성을 위한 겉보기활성화에너지는 약 18.5kcal/mol($1400-1600^{\circ}C$)이었다. 한편 $ZrSiO_4/Al/C$계에서는 $1200^{\circ}C$ 이상에서 ZrO(g)가 Al(l, g) 및 탄소와 반응하여 ZrC를 생성하였으며, $1300^{\circ}C$ 이상에서는 SiO(g)가 Al(l, g) 및 탄소와 환원-탄화반응하여 SiC를 생성하였다. $1600^{\circ}C$, 5시간 반응으로 얻은 생성물은 평균입경 $21.8{\mu}m$을 갖는 분말로서 ZrC의 격자정수는 $4.679{\AA}$, 결정자크기는 $640{\AA}$이었으며 SiC의 격자정수는 $4.135{\AA}$, 결정자크기는 $540{\AA}$ 정도이었다.