• 한국분말재료학회지
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• 제16권6호
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• pp.389-395
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• 2009

A Si-CuO-graphite composite was prepared by a mechanical alloying (MA) method. The Si-CuO composite has a mixture structure, where CuO is homogeneously dispersed in Si. Also, $Cu_2O$ and $Cu_3Si$ phases were formed during MA and heat treatment. Graphite with the Si-CuO composite was mixed in the same mill for 30 minutes with weight ratio of Si-CuO composite and graphite as 1:1. The Si-CuO composite was homogeneously covered with graphite. SiC phase was not formed. Electrochemical tests of the composite have been investigated, and the first charge and discharge capacities of the material were about 870mAh/g and 660mAh/g, respectively. Those values are about 76% of the first cycle efficiency. The cycle life of the composite showed that the initial discharge capacity of 660 mAh/g could be maintained up to 92% after 20 cycles.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.87-88
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• 2007

반도체 소자가 초고집적화 되어감에 따라 반도체 공정에서 선폭은 줄어들고 박막은 다층화 되어가고 있다. 이와 같은 제조 공정 하에서는 Si 기판과 금속 박막간의 확산이 커다란 문제로 부각되어 왔다. 특히 Cu는 높은 확산성에 의하여 Si 기판과 접합에서 많은 확산에 의한 문제가 발생하게 되며, 또한 선폭이 줄어듦에 따라 고열이 발생하여 실리콘으로 spiking이 발생하게 된다. 이러한 확산을 방지하기 위하여 이 논문에서는 Tungsten - Carbon - Nitrogen (W-C-N)에 Boron (B)을 첨가하였고, Boron 타겟 power을 조절하여 다양한 조성을 가지는 W-B-C-N 확산방지막을 제작하여 각 조성에 따른 증착률을 조서하였고 $1000^{\circ}C$까지 열처리하여 그 비저항을 측정하여 각 특성을 확인하였다.

• 한국주조공학회지
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• 제36권1호
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• pp.1-9
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• 2016

Improvement of the mechanical properties of a commercial aluminium casting alloy, A356, was achieved through an optimised combination of alloying elements, modification, and heat treatment. 0.7 wt.% Cu and an additional 0.2 wt.% Mg were added to an Al-7Si-0.35Mg alloy for strengthening at both room and elevated temperatures, whilst a subsequent decrease in the ductility was compensated for by the modification of eutectic Si by Sr addition at a level of up to 110 ppm. It was found that the dissolution of Cu-rich or Mg-rich phases could be maximised by solid-solutionising an alloy with 40 ppm Sr at $530^{\circ}C$, increasing the tensile and yield strengths to 350 MPa and 297 MPa, respectively, with a reasonably high strain of 5% after peak-aging at $210^{\circ}C$. Further addition of Sr up to 110 ppm is, however, more likely to interfere with the dissolution of the Cu-rich or Mg-rich phases during solid solution treatment, resulting in a slight decrease in both tensile and yield strengths at room temperature. Besides the Cu addition, such undissolved phases, on the other hand, may contribute to elevated temperature strength at $200^{\circ}C$.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2011년도 자성 및 자성재료 국제학술대회
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• pp.168-168
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• 2011

• 한국진공학회지
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• 제8권3A호
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• pp.249-255
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• 1999

Deposition characteristics of Cu thin films using Ar carrier gas and $H_2$ processing gas at various working pressures and substrate temperatures were investigated. Also, effects of $H_2$ pretreatment using plasma at $200^{\circ}C$ of substrate temperature and 0.6 Torr of chamber pressure were stdied. Cu thin films were deposited on TiN/Si substrate at working pressure of 0.5~1.5 Torr, substrate temperatures of 140~$240^{\circ}C$ with (hface)Cu(tmvs). Substrates were pretreated by $H_2$ plasma, and Cu films deposited in situ using twofold shower head. The purity, electrical resistivity, thickness, surface morphology, optical properties of the deposited Cu films were measured b the AES, four point probe, stylus profiler, SEM,. and the uv-visible spectrophotometer. This study suggests that $H_2$ plasma is an effective method for enhancing deposition rate and for producing high quality copper thin films.

• 한국재료학회지
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• 제8권4호
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• pp.362-367
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• 1998

Mg-6Zn-2Cu 및 Mg-6Zn-1.5Si(wt%)합금의 미세조직 및 석출거동을 조사하였다. 합금은 $4 x 10^{-4}$ 의 진공분위기에서 제조하였고 용체화처리는 $435^{\circ}C$에서 8시간 행하였다. Mg-6Zn합금에 1.5wt.%Si를 첨가한 합금에서는 입계 및 입내에 $10\mu\textrm{m}$-2$\mu\textrm{m}$크기의 구형의 $MgZn_{2}$와 $Mg_{2}$Si상이 존재한다. 시효경화거동은 용체화처리된 Mg-6Zn-2Cu 및 Mg-6Zn-1.5Si합금에서 조사되었다. 결정립 미세화에 의한 경도증가효과는 Mg-6Zn-2Cu합금계에서 크게 나타났으나, 시효에 의한 경도증가효과는 Mg-Zn-Si합금계에서 크게 나타났다. 시효처리 후 생성된 석출상들은 투과전자현미경 분석결과 Mg-6Zn-2Cu합금에서는$ Mg_{2}$$Zn_{3}$이었고 Mg-6Zn-1.5Si 합금에서는 $Mg_{2}$$Zn_{11}$ /이었다.

• Journal of Welding and Joining
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• 제20권2호
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• pp.77-81
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• 2002

Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).

• 한국세라믹학회지
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• 제31권2호
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• pp.227-233
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• 1994

The Bi-Sr-Ca-Cu-O thin films were deposited by RF-magnetron sputtering method on Si(P-111) wafer without a buffer layer and annealed at various temperatures in oxygen atmosphere. The temperature dependence of electrical resistance, the microstructure of intermediate phase, and the surface morphology of films were examined by four probe method, XRD, and SEM, respectively. The chemical composition and the depth profile of the films were determined by ESCA spectra. Thin films annealed at $600^{\circ}C$ and $700^{\circ}C$ in oxygen atmosphere showed onset temperatures of 90 K and 85K, and Tc(zero) of 22K and 31K, respectively. The sample annealed at $700^{\circ}C$ had the highest volume fraction of superconducting phase and showed smooth microsturcture. In ESCA spectra, the thin films were homogeneous with depth.

• 열처리공학회지
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• 제12권3호
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• pp.231-239
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• 1999

Volume fraction and morphology of retained austenite, tensile properties of TRIP type high strength steel sheet with Fe-C-Si-Mn-Cu chemical composition have been investigated. The retained austenite of granular, bar and film type existing in specimen was obtained after intercritical annealing and austempering. The granular type retained austenite increased with increase of intercritical annealing and austempering temperature. With increase of intercritical annealing temperature, retained austenite and carbon contents increased. Maximum contents of retained austenite was obtained by austempering at $400^{\circ}C$. The maximum tensile strength was obtained by austempering at $450^{\circ}C$ and maximum elongation was obtained at $400^{\circ}C$. T.S${\times}$E.L value increased with increase of retained austenite contents due to the elongation strongly controlled by contents of retained austenite, but tensile strength was affected with various factors such as bainitic structure etc.

• 한국광물학회지
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• 제28권4호
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• pp.299-308
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• 2015

국내 경상북도 포항 지역에서 채취한 6종의 천연 제올라이트를 X-선 회절, X-선 형광분석, 열시차 분석, 열중량 분석 및 양이온교환능 분석을 통해 특성분석을 수행하였다. 이들 제올라이트의 주성분은 구룡포A (Ku-A), 구룡포B (Ku-B), 구룡포C (Ku-C), 동해A (Dh-A), 동해B (Dh-B), 동해C (Dh-C) 모두 모데나이트, 알바이트 및 석영이 함유되어 있었다. 6종의 제올라이트는 Si, Al, Na, K, Mg, Ca, Fe을 함유하고 있었으며 구룡포C (Ku-C) 제올라이트의 양이온 교환능이 다른 지역의 제올라이트 보다 높게 나타났다. 6종의 천연 제올라이트를 이용하여 $Pb^{2+}$, $Cd^{2+}$ 및 $Cu^{2+}$ 등의 중금속 이온을 제거하는데 소요되는 반응 시간의 효과를 비교하였다. 6종의 천연 제올라이트 모두 $Pb^{2+}$, $Cd^{2+}$ 및 $Cu^{2+}$ 제거율이 매우 낮게 나타났다. 이는 6종의 천연 제올라이트에 함유된 제올라이트의 함량이 매우 낮기 때문으로 판단된다. 본 연구 결과는 제올라이트 광석의 중금속 흡착능력은 제올라이트의 함량, 즉 광석의 품위에 크게 의존되는 경향을 보여주고 있다.