• 한국재료학회지
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• 제24권1호
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• pp.19-24
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• 2014

We report the nitrogen monoxide (NO) gas sensing properties of p-type CuO-nanorod-based gas sensors. We synthesized the p-type CuO nanorods with breadth of about 30 nm and length of about 330 nm by a hydrothermal method using an as-deposited CuO seed layer prepared on a $Si/SiO_2$ substrate by the sputtering method. We fabricated polycrystalline CuO nanorod arrays at $80^{\circ}C$ under the hydrothermal condition of 1:1 morality ratio between copper nitrate trihydrate [$Cu(NO_2)_2{\cdot}3H_2O$] and hexamethylenetetramine ($C_6H_{12}N_4$). Structural characterizations revealed that we prepared the pure CuO nanorod array of a monoclinic crystalline structure without any obvious formation of secondary phase. It was found from the gas sensing measurements that the p-type CuO nanorod gas sensors exhibited a maximum sensitivity to NO gas in dry air at an operating temperature as low as $200^{\circ}C$. We also found that these CuO nanorod gas sensors showed reversible and reliable electrical response to NO gas at a range of operating temperatures. These results would indicate some potential applications of the p-type semiconductor CuO nanorods as promising sensing materials for gas sensors, including various types of p-n junction gas sensors.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.55-58
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• 2002

The possibility of SnCuX Solder as alternative for Pb-free Solder have been investigated in this study. SnCuX Solder balls(500${\mu}{\textrm}{m}$) were placed on Si-wafer which is Al/Ni/Cu(500nm/$4{\mu}{\textrm}{m}$/$4{\mu}{\textrm}{m}$)UBM layer. After reflow soldering at $250^{\circ}C$, shear strength and microstructure were analyzed. The results showed that the shear strength(500gf) of SnCuX was higher than that of SnCuX at $230^{\circ}C$ and $Cu_6Sn_5$ intermetallic compounds were formed between Cu and SnCuX Solder layers

• Journal of Magnetics
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• 제11권1호
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• pp.55-59
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• 2006

The effect of annealing temperature on the permeability and giant magneto-impedance (GMI) behaviors of $Fe_{68.5}Mn_{5}Si_{13.5}B_9Nb_3Cu_1$ amorphous alloy has been systematically investigated. The nanocrystalline $Fe_{68.5}Mn_{5}Si_{13.5}B_9Nb_3Cu_1$ alloys consisting of ultra-fine $(Fe,Mn)_3Si$ grains embedded in an amorphous matrix were obtained by annealing their precursor alloy at the temperature range from $500^{\circ}C\;to\;600^{\circ}C$ for 1 hour in vacuum. The permeability and GMI profiles were measured as a function of external magnetic field. It was found that the increase of both the permeability and the GMI effect with increasing annealing temperature up to $535^{\circ}C$ was observed and ascribed to the ultrasoft magnetic properties in the sample, whereas an opposite tendency was found when annealed at $600^{\circ}C$ which is due to the microstructural changes caused by high-temperature annealing. The study of temperature dependence on the permeability and GMI effect showed some insights into the nature of the magnetic exchange coupling between nanocrystallized grains through the amorphous boundaries in nanocrystalline magnetic materials.

• 융복합기술연구소 논문집
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• 제8권1호
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• pp.33-39
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• 2018

The screen printing method for forming the electrode by applying the existing pressure is difficult to apply to thin wafers, and since expensive Ag paste is used, it is difficult to solve the problem of cost reduction. This can solve both of the problems by forming the front electrode using a plating method applicable to a thin wafer. In this paper, the process conditions of electrode formation are optimized by using LIEP (Light-Induced Electrode Plating). Experiments were conducted by varying the Ni plating bath temperature $40{\sim}70^{\circ}C$, the applied current 5 ~ 15 mA, and the plating process time 5 ~ 20 min. As a result of the experiment, it was confirmed that the optimal condition of the structural characteristics was obtained at the plating bath temperature of $60^{\circ}C$, 15 mA, and the process time of 20 min. The Cu LIEP process conditions, experiments were conducted with Cu plating bath temperature $40{\sim}70^{\circ}C$, applied voltage 5 ~ 15 V, plating process time 2 ~ 15 min. As a result of the experiment, it was confirmed that the optimum conditions were obtained as a result of electrical and structural characteristics at the plating bath temperature of $60^{\circ}C$ and applied current of 15 V and process time of 15 min. In order to form Ni silicide, the firing process time was fixed to 2 min and the temperature was changed to $310^{\circ}C$, $330^{\circ}C$, $350^{\circ}C$, and post contact annealing was performed. As a result, the lowest contact resistance value of $2.76{\Omega}$ was obtained at the firing temperature of $310^{\circ}C$. The contact resistivity of $1.07m{\Omega}cm^2$ can be calculated from the conditionally optimized sample. With the plating method using Ni / Cu, the efficiency of the solar cell can be expected to increase due to the increase of the electric conductivity and the decrease of the resistance component in the production of the solar cell, and the application to the thin wafer can be expected.

• Corrosion Science and Technology
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• 제14권6호
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• pp.296-300
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• 2015

ALDC8 (Al-Si-Cu) alloy has been often corroded with pattern of intergranular corrosion in corrosive environments. Thus, in order to improve its corrosion resistance, the effect of annealing heat treatment to corrosion resistance and hardness was investigated with parameters of heating temperatures such as $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$ and $500^{\circ}C$ for 1hr. The hardness was varied with annealing temperature and slightly decreased with annealing heat treatment. However, the relation between annealing temperature and hardness agreed not well each other. Corrosion potential was shifted to noble direction and corrosion current density was also decreased with increasing annealing temperature. Moreover, both AC impedance at 10 mHz and polarization resistance on the cyclic voltammogram curve were also increased with increasing annealing temperature. Furthermore, intergranular corrosion was somewhat observed in non heat treatment as well as annealing temperatures at $100^{\circ}C$, $200^{\circ}C$ and $300^{\circ}C$, while, intergranular corrosion was not nearly observed at annealing temperature of $400^{\circ}C$, $500^{\circ}C$. Consequently, it is considered that the annealing heat treatment of ALDC8 alloy may be an available method not only to inhibit its intergranular corrosion but also to improve its corrosion resistance.

• 대한기계학회논문집A
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• 제34권7호
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• pp.929-933
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• 2010

3 차원 패키징을 위해 열가압 공정으로 제조된 Cu-Cu 접합 계면의 접합 특성을 평가하기 위해 4 점 굽힘 실험을 수행하였다. Cu가 코팅된 Si 웨이퍼 2 장을 $350^{\circ}C$에서 1 시간 동안 15kN 의 하중으로 접합시킨 후, 동일한 온도에서 1 시간동안 어닐닝을 수행하였다. 접합된 웨이퍼를 $30\;mm\;{\times}\;3\;mm$ 크기로 잘라 시험편을 준비하였다. 시험편의 중심에 깊이 $400\;{\mu}m$의 노치를 가공하였다. 시험기에 광학계를 부착하여 노치에서의 크랙 발생과 계면에서의 크랙 진전을 관찰하였다. 일정한 테스트 속도로 실험을 수행하여, 이에 상응하는 하중을 측정하였다. Cu-Cu 접합 계면 에너지는 $10.36\;J/m^2$ 으로 측정되었으며, 파괴된 계면을 분석하였다. 표면 분석 결과, $SiO_2$와 Ti의 계면에서 파괴가 일어났음을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.175.2-175.2
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• 2015

이 연구는 nano-indenter를 중심으로 박막의 nano-electrotribology 분석 연구로 Hafnium Nitride (HfN) 박막의 열처리 시 열적안정성에 대한 연구를 진행하였다. HfN 박막은 Copper (Cu)와 Silicon (Si)의 계면 확산방지막으로 사용될 수 있는 박막으로 현재 많은 연구소에서 다양한 연구가 진행되고 있다. HfN 박막은 Si (100)기판 위에 rf magnetron sputter로 증착되었다. 증착 시 Ar, $N_2$ 가스유량을 총 40 sccm 사용하였고 증착 후 HfN 박막을 질소분위기 furnace에서 500, $700^{\circ}C$로 각각 30분 동안 열처리 하였다. 열처리 전 후의 시료를 nano-indenter를 이용하여 nano-electrotribology 분석을 실시하였다. Nano-indenter 측정결과 열처리 전 HfN 박막 시료의 표면강도는 39.68 GPa였고 500oC 열처리 후 31.31 GPa로 감소하였다. 그러나 $700^{\circ}C$ 열처리 시 표면강도가 37.89 GPa로 다시 증가하였다. 탄성계수 측정결과도 이와 같은 경향을 나타내었는데, $500^{\circ}C$ 열처리 전 후 탄성계수가 258.99 GPa에서 201.88 GPa로 감소하였고 $700^{\circ}C$ 열처리 시 247.55 GPa로 다시 증가하였다. 이는 $500^{\circ}C$ 열처리하였을 때 박막 내에 흡착되었던 $N_2$ 가스가 빠져나가며 tensile stress가 발생하여 박막의 표면강도 감소를 유발했고 $700^{\circ}C$ 열처리 시 다시 박막 표면이 안정화되었기 때문으로 생각된다. 이를 통해 열처리 온도 변화에 의한 질소효과가 나타나 HfN 박막 표면의 물성이 달라지는 것을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.624-627
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• 2001

Two kinds of Nd$_{1+x}$Ba$_{2-x}$Cu$_3$O$_{7-{\delta}}$, the sintering samples and zone melting samples, were heat treated under pure Ar at 95$0^{\circ}C$. The substitution of Nd ion for Ba ion in the Nd$_{1+x}$Ba$_{2-x}$Cu$_3$O$_{7-{\delta}}$ before and after the heat treatment were investigated by XRD. In order to know the effects of the heat treatment, the T$_{c}$ and J$_{c}$ of samples with the heat treatment and those without the heat treatment by Ar were comparatively studied. The results show that the substitution of Nd for Ba decreased, T$_{c}$, and J$_{c}$ increased after the treatment under Ar at 95$0^{\circ}C$. The Nd$_{1+x}$Ba$_{2-x}$Cu$_3$O$_{7-{\delta}}$ samples were oxygenated under pure oxygen at 30$0^{\circ}C$. From the XRD pattern it was found that the sample with x< 0.4 could transfer from tetragonal phase to orthorhombic phase after the oxygenation, but the sample with x>0.4 could not make the phase transition even after a long time oxygenation.ion even after a long time oxygenation.ation.n.ation.ation.

• International Journal of Railway
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• 제3권1호
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• pp.19-27
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• 2010

In the present study, the electrical sliding wear and corrosion resistance of pure copper (Cu) and six age-hardened copper alloys (CuCr, CuZr, CuCrZr, CuNiSiCr, CuBe and CuBeNi) were investigated by a pin-on-disc tribometer and electrochemical measurement. Various copper-based alloys in the form of cylindrical pin were forced to slide against a counterface stainless steel disc in air under unlubricated condition at a sliding velocity of 31 km/h under normal load up to 20 N with and without electric current. The worn surface of and wear debris from the specimens were studied by scanning electron microscopy. Both mechanical wear and electrical arc erosion were the wear mechanisms for the alloys worn at 50 A. Owing to its good electrical conductivity, high wear and corrosion resistance, CuCrZr is a promising candidate as the overhead catenary material for electric traction systems.

• 동력기계공학회지
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• 제18권6호
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• pp.29-33
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• 2014

The electrochemical characteristics of Al-Si casting alloys (Al-10%Si, Al-9%Si, Al-7%Si) in 3.5% NaCl solution at room temperature was studied using potentiodynamic techniques. The electrochemical values of corrosion potential($E_c$), corrosion current density($I_c$) and corrosion rate(mpy) were examined. The Al-Si alloys had several compounds such as $Mg_2Si$, ${\pi}$-$Al_8Si_6Mg_2Fe$ and $Al_2CuMg$ which could affect corrosion resistance significantly. The potentiodynamic polarization curve exhibited typical active behavior in anodic polarization curve. The major corrosion mechansim for the Al-Si alloys were pitting and grain boundary corrosion. As increasing Si and Cu contents, their corrosion resistance was decreased.