Characterization of Interfacial Adhesion of Cu-Cu Bonding Fabricated by Thermo-Compression Bonding Process |
Kim, Kwang-Seop
(Nano Convergence and Manufacturing Systems Research Division, KIMM)
Lee, Hee-Jung (Nano Convergence and Manufacturing Systems Research Division, KIMM) Kim, Hee-Yeoun (NEMS/Bio Team, National Nanofab Center) Kim, Jae-Hyun (Nano Convergence and Manufacturing Systems Research Division, KIMM) Hyun, Seung-Min (Nano Convergence and Manufacturing Systems Research Division, KIMM) Lee, Hak-Joo (Nano Convergence and Manufacturing Systems Research Division, KIMM) |
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