• The Journal of Korean Institute of Communications and Information Sciences
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• v.14 no.4
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• pp.307-320
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• 1989

This paper presetns new design of the Modified Chemical Vapor Deposition(MCVD) system for optical fiber preform fabrication. It contains a glass working lathe, raw material supplier and exhaust gas treatment apparatus as fundamental instruments for MCVD process, graded index fiber design, characteristic of process and the experimenta arrangement to measure the refractive index profile of MCVD preforms, respectively. From the investigation results, it is shown that an ideal graded index fiber preform does not exhibit a center dip or bump.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.853-863
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• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.43-50
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• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.04a
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• pp.113-118
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• 1997

This paper presents the dimensional synthesis and kinematic analysis of the RSCS-SSP motion generating spatial mechanism using the displacement matrix method. This type of spatial mechanisms is used for the Mcpherson suspension in small automobiles. It is modeled for the wheel bump/rebound and steering motion. First, the suspension is modeled as a multiloop spatial rigid body guidance mechanism for the two major motions. Then the design equations for SSP, RS, and SC strut links are applied to synthesize an RSCS-SSP for up to three prescribed positions for the steering motiom from the suspension design specification. Thus a RSCS-SSP mechanism which is synthesized is also analyzed for the displacement during the steering motion.

• Steel and Composite Structures
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• v.45 no.5
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• pp.697-713
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• 2022

In the context of the finite elements method, the dynamic behavior of porous functionally graded double wishbone vehicle suspension structural system incorporating joints flexibility constraints under road bump excitation is studied and analyzed. The functionally graded material properties distribution through the thickness direction is simulated by the power law including the porosity effect. To explore the porosity effects, both classical and adopted porosity models are considered based on even porosity distribution pattern. The dynamic equations of motion are derived based on the Hamiltonian principle. Closed forms of the inertia and material stiffness components are derived. Based on the plane frame isoparametric Timoshenko beam element, the dynamic finite elements equations are developed incorporating joint flexibilities constraints. The Newmark's implicit direct integration methodology is utilized to obtain the transient vibration time response under road bump excitation. The presented procedure is validated by comparing the computational model results with the available numerical solutions and an excellent agreement is observed. Obtained results show that the decrease of porosity percentage and material graduation tends to decrease the deflection as well as the resulting stresses of the control arms thus improving the dynamic performance and increasing the service lifetime of the control arms.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.21-30
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• 2002

According the difference of flex substrate, (reel tape), there are three kind assembly types of LCD driver IC is COG, TCP and COF, respectively. The TCP is the maturest in these types for stability of raw material supply and other specification. And TCP is the major assembly type of LCD driver IC and the huge demand from Taiwan's large TFT LCD panel house since this spring. But due to its package structure and the raw material applied in this package, there is some limitation in fine pitch application of this package type, (TCP). So, COF will be very potential in compact and portable application comparison with TCP in the future. There are three kinds assembly methods in COF, one is ACF by using the anisotropic conductive film to connect the copper lead of tape and gold bump of IC, another is eutectic bonding by using the thermo-pressure to joint the copper lead of tape and gold bump of IC, and last is NCP by using non-conductive paste to adhere the copper lead of tape and gold bump of IC. To have a global realization, this paper will briefly review the status of Taiwan's large TFT panel house, the internal driver IC design house, and the back-end assembly house in the beginning. The different material property of raw material, PI tape is also compared in the paper. The more detail of three kinds of COF assembly method will be described and compared in this paper.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.65-68
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• 2013

A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. It features maskless screen printing process. A selective solder bumping mechanism without the mask is based on the material design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solder-on-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The process includes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrate and the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to the pads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of 130 ${\mu}m$ is, successfully, formed.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.1
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• pp.41-48
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• 2022

Vehicle vibration was introduced in the time and frequency domains using fast Fourier transform (FFT) analysis. In particular, a vibration mode analysis and characteristics of the frequency response function (FRF) in a sport utility vehicle (SUV) passing over a bump barrier at different speeds was performed systematically. The response behavior of the theoretical acceleration was obtained using a numerical method applied to the forced vibration model. The amplitude and frequency of the external force on the vehicle cause various power spectra with individual intrinsic system frequencies. In this regard, several modes of power spectra were acquired from the spectra and are discussed in this paper. The proposed technique can be used for monitoring the acceleration in a vehicle passing over a bump barrier. To acquire acceleration signals, various experimental runs were performed using the SUV. These acceleration signals were then used to acquire the FRF and to conduct mode analysis. The vehicle characteristics according to the vehicle condition were analyzed using FRF. In addition, the vehicle structural system and bump passing frequencies were discriminated based on their power spectra and other FRF spectra.

• Journal of Welding and Joining
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• v.26 no.3
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• pp.30-36
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• 2008

A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.9
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• pp.799-805
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• 2015

The further development of information, communication and digital media technologies requires the use of advanced, miniaturized semiconductor chips that operate at a high frequency. Die bonding and wire bonding methods for semiconductor packaging have been replaced by direct attachment to the substrate after forming a bump on the chip. However, the height of the bump or ball is an important factor for defects during assembly. This paper proposes an algorithm to measure the height of the bumps or balls in semiconductor packaging with greater accuracy. The performance of the proposed algorithm is experimentally validated. Non-contact 3D measurements of a shiny round ball is quite difficult, and it is not easy to obtain accurate data. This paper thus proposes an optical method and technique to improve the measurement accuracy.