• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2012.11a
• /
• pp.123-123
• /
• 2012

최근 연구되고 있는 TSV(Through Silicon Via) 기술은 Si 웨이퍼 상에 직접 전기적 연결 통로인 관통홀을 형성하는 방법으로 칩간 연결거리를 최소화 할 수 있으며, 부피의 감소, 연결부 단축에 따른 빠른 신호 전달을 가능하게 한다. 이러한 TSV 기술은 최근의 초경량화와 고집적화로 대표되는 전자제품의 요구를 만족시킬 수 있는 차세대 실장법으로 기대를 모으고 있다. 한편, 납땜 재료의 주 원료인 주석은 주로 반도체 소자의 제조, 반도체 칩과 기판의 접합 및 플립 칩 (Flip Chip) 제조시의 범프 형성 등 반도체용 배선재료에 널리 사용되고 있다. 최근에는 납의 유해성 때문에 대부분의 전자제품은 무연솔더를 이용하여 제조되고 있지만, 주석을 이용한 반도체 소자가 고밀도화, 고 용량화 및 미세피치(Fine Pitch)화 되고 있기 때문에, 반도체 칩의 근방에 배치된 주석으로부터 많은 알파 방사선이 방출되어 메모리 셀의 정보를 유실시키는 소프트 에러 (Soft Error)가 발생되는 위험이 많아지고 있다. 이로 인해, 반도체 소자 및 납땜 재료의 주 원료인 주석의 고순도화가 요구되고 있으며, 특히 알파 방사선의 방출이 낮은 로우알파솔더 (Low Alpha Solder)가 요구되고 있다. 이에 따라 본 연구는 4인치 실리콘 웨이퍼상에 직경 $60{\mu}m$, 깊이 $120{\mu}m$의 비아홀을 형성하고, 비아 홀 내에 기능 박막증착 및 전해도금을 이용하여 전도성 물질인 Cu를 충전한 후 직경 $80{\mu}m$의 로우알파 Sn-1.0Ag-0.5Cu 솔더를 접합 한 후, 접합부 신뢰성 평가를 수행을 위해 고속 전단시험을 실시하였다. 비아 홀 내 미세구조와 범프의 형상 및 전단시험 후 파괴모드의 분석은 FE-SEM (Field Emission Scanning Electron Microscope)을 이용하여 관찰하였다. 연구 결과 비아의 입구 막힘이나 보이드(Void)와 같은 결함 없이 Cu를 충전하였으며, 고속전단의 경우는 전단 속도가 증가할수록 취성파괴가 증가하는 경향을 보였다. 본 연구를 통하여 전해도금을 이용한 비아 홀 내 Cu의 고속 충전 및 로우알파 솔더 볼의 범프 형성이 가능하였으며, 이로 인한 전자제품의 소프트에러의 감소가 기대된다.

• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.4
• /
• pp.77-84
• /
• 2006

Surface roughness and wafer-level thickness distribution of the non-cyanide Au bumps were characterized with variations of the electroplating current density and the bath temperature. The Au bumps, electroplated at $3mA/cm^{2}\;and\;5mA/cm^{2}$, exhibited the surface roughness of $80{\sim}100nm$ without depending on the bath temperature of $40^{\circ}C\;and\;60^{\circ}C$. The Au bumps, electroplated with $8mA/cm^{2}$ at $40^{\circ}C\;and60^{\circ}C$, exhibited the surface roughness of 800nm and $80{\sim}100nm$, respectively. Wafer-level thickness deviation of the Au bumps became larger with increasing the current density from $3mA/cm^{2}\;to\;8mA/cm^{2}$. More uniform thickness distribution of the Au bumps was obtained at a bath temperature of $60^{\circ}C$ than that of $40^{\circ}C$.

• Korean Journal of Materials Research
• /
• v.5 no.6
• /
• pp.673-681
• /
• 1995

Surface morphology and preferred orientation of 20${\mu}{\textrm}{m}$ gold electrodeposit formed from aqueous solution of the sodium gold sulfite were studied in terms of current density, plating temperature and Au concentration. As the current density changed from 13.0mA/$\textrm{cm}^2$ to 4.6mA/$\textrm{cm}^2$, the solution temperature from 3$0^{\circ}C$ to 6$0^{\circ}C$, pH from 12.0 to 9.0, agitation speed from 0 rpm to 3200rpm and Au concentration from 10g/1 to 14 g/1, local Au concentration near the cathodic surface increased. With increasing the Au concentration, the surface morphology chanced from porous structure to fine-grained structure. Furthermore, it was observed that the preferred orentation of the Au layer changed from (111) to (220) upon the same variation In the Au concentration. The surface morphology and the preferred orientation of the Au layer were found to be closely related to each other.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.11-17
• /
• 2009

The drop impact reliability comes to be important for evaluation of the life time of mobile electronic products such as cellular phone. The drop impact reliability of solder joint is generally affected by the kinds of pad and reflow number, therefore, the reliability evaluation is needed. Drop impact test proposed by JEDEC has been used as a standard method, however, which requires high cost and long time. The drop impact reliability can be indirectly evaluated by using high speed shear test of solder joints. Solder joints formed on 3 kinds of surface finishes OSP (Organic Solderability Preservation), ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) was investigated. The shear strength was analysed with the morphology change of intermetallic compound (IMC) layer according to reflow number. The layer thickness of IMC was increased with the increase of reflow number, which resulted in the decrease of the high speed shear strength and impact energy. The order of the high speed shear strength and impact energy was ENEPIG > ENIG > OSP after the 1st reflow, and ENEPIG > OSP > ENIG after 8th reflow.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.3
• /
• pp.39-43
• /
• 2009

In this paper, the flow characteristics of underfill material driven by capillary action between flip-chip and substrate were investigated. Also, the effects of viscosity level and dispensing point of underfill on flow characteristics were investigated. Flip chip package size was $5mm{\times}5mm{\times}0.65^tmm$, the diameter of solder bump was 100 ${\mu}m$, and the pitch was 150 ${\mu}m$. It was full grid area-array type with 1024 I/Os. The glass substrate was used and the gap between the chip and substrate was 50 ${\mu}m$. For the experimental study, three different underfills with different viscous properties($2000{\sim}3700$ cps), and two different types of dispensing methods(center dot and edge dot) were used. The flow characteristics and filling time of underfill were investigated by using CCD camera. The results show that the edge flow was faster than center flow due to the edge effect, which was caused by the resistance of solder bumps. In case of edge dot dispensing type, the filling time was faster due to the large edge effect, compared to center dot dispensing type. Also, it was found that the underfill flow was faster and the filling time decreased as the viscosity level of underfill was decreased.

• Journal of Veterinary Clinics
• /
• v.30 no.2
• /
• pp.87-94
• /
• 2013

This retrospective study reviewed the clinical and diagnostic features, therapeutic outcome and compilations of interventional ductal occlusion in 37 dogs with patent ductus arteriosus (PDA). Malteses and female dogs were over-presented. Bounding pulse and left basal continuous murmur were most common findings in physical examination, while the differential cyanosis was rarely observed. Left ventricular (LV) enlargement patterns and sinus tachycardia were common in the ECG. Typical radiographic findings included LV elongation and triple bumps indicating left atrial (LA), aortic and pulmonary dilation. Echocardiographic features were typical shunt flow at the ductus arteriosus and marked LV dilation with mild to moderate mitral regurgitation (MR). The 32 of 37 dogs were interventionally treated with either thromboemolic coils (TCE) or Amplatz canine ductal occluder (ACDO). Transient hemoglobinuria caused by incomplete closure was occurred in 2 dogs treated with TCE, although the hemoglobinuria was disappeared within a week of intervention. The dislodgement of occlusion device was occurred in 2 dogs with TCE and 1 dog with ACDO. However there were no significant complications associated with this dislodgement, since those were dislodged at the lower pulmonary vasculature. We also found that no serious complications and no further medical intervention in 29 dogs having long-term follow-ups.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.12 no.7
• /
• pp.1235-1242
• /
• 2008

In this paper, x-ray image sensor of photon counting type having a $32{\times}32$ pixel array is designed with $0.18{\mu}m$ triple-well CMOS process. Each pixel of the designed image sensor has an area of loot $100{\times}100\;{\mu}m2$ and is composed of about 400 transistors. It has an open pad of an area of $50{\times}50{\mu}m2$ of CSA(charge Sensitive Amplifier) with x-ray detector through a bump bonding. To reduce layout size, self-biased folded cascode CMOS OP amp is used instead of folded cascode OP amp with voltage bias circuit at each single-pixel CSA, and 15-bit LFSR(Linear Feedback Shift Register) counter clock generator is proposed to remove short pulse which occurs from the clock before and after it enters the counting mode. And it is designed that sensor data can be read out of the sensor column by column using a column address decoder to reduce the maximum current of the CMOS x-ray image sensor in the readout mode.

• Journal of Radiation Industry
• /
• v.6 no.1
• /
• pp.31-40
• /
• 2012

There are two methods to fabricate the readout electronic to a large-area CMOS image sensor (LACIS). One is to design and manufacture the sensor part and signal processing electronics in a single chip and the other is to integrate both parts with bump bonding or wire bonding after manufacturing both parts separately. The latter method has an advantage of the high yield because the optimized and specialized fabrication process can be chosen in designing and manufacturing each part. In this paper, LACIS chip, that is optimized design for the latter method of fabrication, is presented. The LACIS chip consists of a 3-TR pixel photodiode array, row driver (or called as a gate driver) circuit, and bonding pads to the external readout ICs. Among 4 types of the photodiode structure available in a standard CMOS process, $N_{photo}/P_{epi}$ type photodiode showed the highest quantum efficiency in the simulation study, though it requires one additional mask to control the doping concentration of $N_{photo}$ layer. The optimized channel widths and lengths of 3 pixel transistors are also determined by simulation. The select transistor is not significantly affected by channel length and width. But source follower transistor is strongly influenced by length and width. In row driver, to reduce signal time delay by high capacitance at output node, three stage inverter drivers are used. And channel width of the inverter driver increases gradually in each step. The sensor has very long metal wire that is about 170 mm. The repeater consisted of inverters is applied proper amount of pixel rows. It can help to reduce the long metal-line delay.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.25 no.6
• /
• pp.19-26
• /
• 2021

The seismic isolation system have been applied in order to protect the collapse of bridge by seismic load and the vertical load transmitted from the superstructure. However, the failure and damages of non-shrinkage mortar, isolator and wedge in total 12 bridge were reported by Pohang Earthquake. In this study, the damage mechanism and behavior characteristics of elastomeric bearing by an earthquake were evaluated to consider the seismic isolation system including non-shrinkage mortar and the seat concrete of pier. To discuss the effect of installed wedge and damage mode of elastomeric bearing, the compressive-shear tests were carried out. Also, the mechanical behaviors and damage mechanism for each component of elastomeric bearing were evaluated by using finite element analysis. From the test results, the cracks were created at boundary between non-shrinkage mortar and seismic isolator and the shear loads were rapidly increased after bump into wedge. The cause for damage mechanism of seismic isolation system was investigated by comparing stress distribution of anchor socket and non-shrinkage mortar depending on wedge during earthquake.

• Tribology and Lubricants
• /
• v.35 no.1
• /
• pp.44-51
• /
• 2019

The paper presents the rotordynamic performance measurements and model predictions of a fuel cell electric vehicle (FCEV) air compressor supported on gas foil bearings (GFBs). The rotor has an impeller on one end and a thrust runner on the other end. The front (impeller side) and rear (thrust side) gas foil journal bearings (GFJBs) are located between the impeller and thrust runner to support the radial loads, and a pair of gas foil thrust bearings are located on both sides of the thrust runner to support the axial loads. The test GFJBs have a partial arc shim foil installed between the top foil and bump strip layers to enhance hydrodynamic pressure generation. During the rotordynamic performance tests, two sets of orthogonally installed eddy-current displacement sensors measure the rotor radial motions at the rotor impeller and thrust ends. A series of speed-up and coast-down tests to 100k rpm demonstrates the dominant synchronous (1X) rotor responses to imbalance masses without noticeable subsynchronous motions, which indicates a rotordynamically stable rotor-GFB system. Finite element analysis of the rotor determines the rotor free-free (bending) natural modes and frequencies well beyond the maximum rotating frequency. The predicted damped natural frequencies and damping ratios of the rotor-GFB system reveal rotordynamic stability over the speeds of interest. The imbalance response predictions show that the predicted critical speeds and rotor amplitudes strongly agree with the test measurements, thus validating the developed rotordynamic model.