• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.625-631
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• 2009

In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.

• Journal of the Korean Society for Nondestructive Testing
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• v.26 no.5
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• pp.343-352
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• 2006

In the present paper, the nondestructive test method was suggest to establish the bonding status of a motor case assembly composed of a steel motor case, adiabatic rubber layer and an ablative composite tube with strain data, AE(acoustic emission) signals and UT(ultrasonic test) data. And, finite element analysis was conducted to verify quantitatively the bonding status of motor case assembly under inner pressure loading. The bonding status could be judged whether the bonding status is perfect or contact condition by the data correlation study with AE signals and strain data measured from air pressure test. And, to classify the bonding status of motor case and rubber layer among bonding layers, UT method was also applied. From this study, the bonding status could be classified and detected into fourth types for all bonding layers as follows: (1) initial un-bonding, (2) perfect do-bonding during an air pressure test, (3) partially de-bonding during an air pressure test, and (4) perfect bonding.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.113-119
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• 2012

Ultrasonic bonding is the novel packaging method for flip-chip with high yield and low-temperature bonding. The bonding module is a core part of the bonding machine, which can transfer the ultrasonic energy into the bonding spot. In this paper, we propose topology optimization technique which can make new design of boding modules due to the constraints on resonance frequency and mode shapes. The designed bonding module using topology optimization was fabricated in order to evaluate the bonding performance and reliable operation during the continuous bonding process. The actual production models based on the proposed design satisfied the target frequency range and ultrasonic power. The bonding test was performed using flip-chip with lead-free Sn-based bumps, the results confirmed that the bonding strength was sufficient with the designed bonding modules. Also the performance degradation of the bonding module was not observed after the 300-hour continuous process with bonding conditions.

• Journal of the Korean Wood Science and Technology
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• v.47 no.5
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• pp.655-662
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• 2019

This study evaluated the multi-bonding performances of timbers as well as those of reinforcement and timber to obtain data for preparing guidelines regarding the use of timbers as large structural members. For the multi-bonding performances of timbers, four types of bonding surfaces were prepared according to the pith position. For the bonding performances of FRP (fiber-reinforced plastic)/steel plate and timber, a total of 11 types of specimens were produced for the selection of the appropriate adhesive. The bonding performances of the produced specimens were evaluated through a water soaking delamination test, a water boiling delamination test, and a block shear strength test. The test results showed that the bonding strength of the bonding surface according to the pith position was highest in the specimen for which the two sections with the pith at the center of the cross-section on timber and between the bonding surfaces (the tangential and radial sections were mixed) were bonded. Furthermore, the specimens for which the section (radial section) with the pith on the bonding surface of the timber was bonded showed a high delamination percentage. The results of the block shear strength test showed that the bonding section did not have a significant effect on the shear strength, and that the measured wood failure percentage was higher than the KS standard value. The PVAc adhesive showed the highest bonding strength between larix timber and GFRP (glass FRP). Furthermore, the epoxy and polyurethane adhesives showed good bonding strength for CFRP (carbon FRP) and structure steel, respectively.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.05a
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• pp.353-358
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• 2001

The cement concrete pavements are designed twenty years of performance life in Korea. At the present time, some expressways have been elapsed seventy percent of performance life which are detecting local failures. The most repair methods using to repair failures are partial depth repair and full section repair. These methods are most important bonding strength between rapid curing materials and substrate concrete pavements. This study was performed to evaluate bonding strength of the composites section made of rapid curing material and substrate concrete pavements. The pull-out tester was used to test bonding strength for the composites section made of each materials. In the results of the test, the bonding strength values of the epoxy mortar and acrylic mortar are higher than those of the other materials. The performance life of repaired section is affected by various factor. The bonding strength of bonded composites section may be affect the performance life, significantly.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.191-196
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• 1995

Self-bonding strength developed at the interface of amorphous PEEK films is highly sensitive to the processing variables(time, temperature, and pressure) during the bonding process. In order to examine the effects of these processing variables, amorphous PEEK films were bonded at various bonding conditions and the resultant interfacial bond strengths were measured using a modified single lap-shear test. Experimental results showed that the developed self-bonding strength increases with increase in bonding temperature and is directly proportional to the bonding time raised to the 1/4 power. The applied pressure seems only to produce better wetting at the beginning stage of the bonding process. Conclusively, the self-bonding of amorphous PEEK films provides a great potential for developing excellent bond strength approaching the strength of the parent material without any adhesives in structural applications.

• Advances in materials Research
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• v.9 no.2
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• pp.99-107
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• 2020

Reinforced aluminum alloy base composites have become increasingly popular for engineering applications, since they usually possess several desirable properties. Recently, Warm Accumulative Roll Bonding (WARB) process has been used as a new novel process to fabricate particle reinforced metal matrix composites. In the present study, TiO₂ particles are used as reinforcement in aluminum metal matrix composites fabricated through warm accumulative roll bonding process. Firstly, the raw aluminum alloy 1060 strips with TiO₂ as reinforcement particle were roll bonded to four accumulative rolling cycles by preheating for 5 min at 300℃before each cycle. The mechanical and bonding properties of composites have been studied versus different volume contents of TiO₂ particles by tensile test, peeling test and vickers micro-hardness test. Moreover, the fracture surface and peeling surface of samples after the tensile test and peeling test have been studied versus different amount of TiO₂ volume contents by scanning electron microscopy. The results indicated that the strength and the average vickers micro-hardness of composites improved by increasing the volume content of TiO₂ particles and the amount of their elongation and bonding strength decreased significantly.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• International Journal of Highway Engineering
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• v.15 no.4
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• pp.85-94
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• 2013

PURPOSES: The performance of tack coat, commonly used for layer interface bonding, is affected by application rate and curing time. In this study, bonding strength tests were performed according to the application rate and curing time of asphalt emulsion. Based on finding from this study, optimum application rates and curing times are proposed. METHODS: In order to investigate bonding characteristic of asphalt emulsion, tests were performed on both asphalt concrete pavement and portland concrete pavement. Also, asphalt emulsions were tested at the application rate of 0, 0.2, 0.4, 0.6, and $0.8{\ell}/m^2$ and at the curing time of 0, 0.5, 1, 2, and 24 hours. Pull-off test and shear bonding strength test, which commonly used for bonding strength measurement of asphalt emulsion, were adopted for this study. To assess field performance under different testing condition, asphalt emulsions were applied to in-service pavement. Throughout coefficient of determination analysis between material index properties from asphalt emulsion and mechanical response from bonding strength tests, performance correlativity was analyzed. RESULTS: Test results show that optimum application rate for asphalt overlay on asphalt concrete pavement (AOA) and asphalt overlay on concrete pavement (AOC) was $0.4{\sim}0.5{\ell}/m^2$ and $0.3{\sim}0.5{\ell}/m^2$, respectively. According to the curing time increment, tensile strength and shear strength of AOC were increased to 22~44% and 20~39%, respectively. AOA case also show strength increment in tensile strength (42%) and shear strength (9%). We tested the applicability of tack coat materials at the field sites, and our findings demonstrated that the bonding (for D and E) and rapid curing (for B, C, and D, E) performances were superior than others. Among material index properties, there was a high correlation between penetration ratio and bonding strength test result. CONCLUSIONS : Result show that interlayer bonding strength was affected by asphalt emulsion type, application rate and curing time. AOC required slightly higher application ($0.1{\ell}/m^2$) than AOA. Both AOA and AOC cases show higher strength at longer curing time. Up to 2hours of curing, rapid strength increments were observed, but strength increment ratio was decreased after 2hours of curing. From the observed correlation between penetration ratio and bonding strength, it is expected that penetration ratio can be used as one of important factors affecting bonding strength analysis.