• Transactions of Materials Processing
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• v.18 no.1
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• pp.45-51
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• 2009

Shape memory alloy has been used to improve the tensile strength of composite by the occurrence of compressive residual stress in matrix using its shape memory effect. In order to fabricate shape memory alloy composite, TiNi alloy fiber and Al2024 sheets were used as reinforcing material and matrix, respectively. In this study, TiNi/Al2024 shape memory alloy composite was made by using hot press method. In order to investigate bonding condition between TiNi reinforcement and Al matrix, the micro-structure of interface was observed by using optical microscope and diffusion layer of interface was measured by using Electron Probe Micro Analyser. And the mechanical properties of composite with three parameters(volume fraction of fiber, cold rolling amount and test temperature) were obtained by tensile test. The most optimum bonding condition for fabrication the TiNi/Al2024 composite material was obtained as holding for 30min. under the pressure of 60MPa at 793K. The strength of composite material increased considerably with the volume fraction of fiber up to 7.0%. And the tensile strength of this composite increased with the reduction ratio and it also depends on the volume fraction of fiber.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3279-3281
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• 1999

This paper describes a method of direct wafer bonding using surfaces activated by a radio-frequency hydrogen plasma. The hydrogen plasma cleaning of silicon in the RIE mode was investigated as a pretreatment for silicon direct bonding. The cleaned silicon surface was successfully terminated by hydrogen, The hydrogen-terminated surfaces were rendered hydrophilic, which could be wetted by Dl water rinse. Two wafers of silicon and silicon dioxide were contacted to each other at room temperature and postannealed at $300{\sim}1100^{\circ}C$ in an $N_2$ atmosphere for 2 h. From the AFM results, it was revealed that the surface became rougher with the increased plasma exposure time and power. The effect of the plasma treatment on the surface chemistry was investigated by the AES analysis. It was shown that the carbon contamination at the surface could be reduced below 5 at %. The interfacial energy measured by the crack propagation method was 122 $mJ/m^2$ and 384 $mJ/m^2$ for RCA cleaning and hydrogen plasm, respectively.

• Fashion & Textile Research Journal
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• v.11 no.4
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• pp.672-677
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• 2009

To reduce the dependence of wool dyeing on the temperature several solvents with different properties and structures were added to the dye bath of C. I. Acid Yellow 42. Nearly the same total solubility parameters(${\delta}_t$) of solvents as those of wool fiber and hydrophobic part of the dyestuff were needed to increase disaggregation of dye molecules, loosening the wool fiber and wickabilty of dyeing solution; besides, the large surface tension(${\gamma}$) value of the solvents and the well balanced values of the three-component Hansen solubility parameters such as dispersion(${\delta}_d$), polar(${\delta}_p$), and hydrogen(${\delta}_h$) bonding parameters were required. Among the added solvents dimethyl phthalate(DMP) and acetophenone(AP) were satisfied with these conditions and worked the most successfully in the low temperature wool dyeing. Their effectiveness proven by the dyeing rate and the activation energy ($E_a$) of the dyeing was in the order of DMP > AP > DBE > CH > M >NONE. In conclusion the total solubility parameters(${\delta}_t$), the three-component Hansen parameters and the surface tension(${\gamma}$) of DMP and AP could be the guidelines to select suitable solvents for low temperature wool dyeing.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.249-249
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• 2012

The interaction of hydrogen with ZnO single crystal surfaces, ZnO(0001) and ZnO(000-1), has been investigated using a temperature programmed desorption (TPD) technique. Both surfaces do not interact with molecular hydrogen. When the ZnO(0001) is exposed to atomic hydrogen at 370 K, hydrogen is adsorbed in the surface and desorption takes place at around 460 K and 700 K. In ZnO(000-1), the desorption peaks are observed at around 440 K and 540 K. In both surfaces, as the atomic hydrogen exposure is further increased, the intensity of the low-temperature peak reaches maximum but the intensity of the high-temperature peak keeps increasing. In ZnO(000-1), the existence of hydrogen bonding to the surface O atoms and the bulk hydrogen has been confirmed by using X-ray photoelectron spectroscopy (XPS). When the Zn(0001) surface is exposed to atomic hydrogen at around 200 K, a new $H_2$ desorption peak has been observed at around 250 K. The intensity of the desorption feature at 250 K is much greater than that of the desorption feature at 460 K. This low-temperature desorption feature indicates hydrogen is bonded to surface Zn atoms. We will report the effect of the ZnO structure on the adsorption and bulk diffusion of hydrogen.

• Journal of Industrial Technology
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• v.23 no.A
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• pp.157-163
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• 2003

The properties of mechanics and durability of LMC have been performed actively. However, little studies on analysis and properties of thermal expansion has been on the temperature variation. Especially, the low of bonding strength and tensile cracking are caused by difference of thermal expansion between LMC and the substrate concrete. Therefore, this study focused on effect of thermal expansion behavior and properties of LMC according to temperature variation. To identify the property of thermal expansion of LMC, tests of modulus of thermal expansion were carried out at 28 days after casting specimen, subjected to temperature variation between $10^{\circ}C$ and $60^{\circ}C$. The results of this study showed the modulus of elastic of LMC was similar to that of ordinary portland concrete(OPC). It means that stresses caused by difference of modulus of elastic did not occur on interface between LMC and existing concrete. The modulus of thermal expansion of LMC had a little smaller than that of OPC. The modulus of thermal expansion of polymer modified concrete is generally larger than OPC, but the result of this test is disagree with the fact, which may be due to the humidity evaporation difference and aggregate properties.

• Journal of Photoscience
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• v.3 no.1
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• pp.43-47
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• 1996

The 77 K emission and excitation, and room-temperature UV-visible spectra of $\Lambda$-fac[Cr(L-ala)$_3$] (ala = alanine anion) have been measured. The ten electronic transitions due to spinallowed and spin-forbidden are assigned. With the observed electronic transition energies, ligand field optimizations have been performed to determine the bonding properties of L-alanine anion toward chromium(III). The angular overlap model (AOM) parameters obtained indicate that it is electron-donating ligand which has values of e$_{\sigma}O$, e$_{\pi}O$, and e$_{\sigma}N$ slightly lower than those of glycine anion (gly). It seem that the decrease of the ligand field properties is due to steric effect of extra methyl group and inductive effect of adjacent carbonyl group.

• Proceedings of the Korea Concrete Institute Conference
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• 1998.04b
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• pp.627-632
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• 1998

This study deals with the effect on adhesive strength properties of waterproofing and reinforcing layer and mortar or concrete substrate applicated by epoxy resin anticorrosive and bonding materials. Properties of adhesive strength change condition of concrete substrate, temperature, moisture, curing and cleaning and so on. The purpose of this study is that it makes the estimation value of bond strength of concrete wall and epoxy resin layer when coated epoxy resin as anticorrosive materials for durability performance estimation depend on concrete watertightness, and when penetrated epoxy resin for the reinforcement of concrete used the carbon fiber sheet.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.1
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• pp.54-58
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• 2017

The effect of low temperature ($250^{\circ}C$) heat treatment after electron irradiation (irradiation time = 30, 180, 300s) on the chemical bonding and electrical properties of ZnO thin films prepared using a sol-gel process were examined. XPS (X-ray photoelectron spectroscopy) analysis showed that the electron beam irradiation decreased the concentration of M-O bonding and increased the OH bonding. As a result of the electron beam irradiation, the carrier concentration of ZnO films increased. The on/off ratio was maintained at ${\sim}10^5$ and the $V_{TH}$ values shifted negatively from 11 to 1 V. As the irradiation time increased from 0 to 300s, the calculated S. S. (subthreshold swing) of ZnO TFTs increased from 1.03 to 3.69 V/decade. These values are superior when compared the sample heat-treated at $400^{\circ}C$ representing on/off ratio of ${\sim}10^2$ and S. S. value of 10.40 V/decade.

• Restorative Dentistry and Endodontics
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• v.20 no.1
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• pp.261-274
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• 1995

This study aimed to evaluate the marginal microleakage of Class V cavities of All-bond 2 (Wet - bonding system), Gluma (Adhesion of resin to exposed collagen fibers), and Scotchbond Multi-purpose(Mild Etching System). Hundred extracted human teeth divided into a control and three experimental groups consisting of eight teeth. The experimental group was further subdivided into All- bond2, Gluma and Scotchbond MP groups, Vitrebond served as the control. The positive control group consisted of specimens filled with resin and with no etching, primer and bonding procesure. Polished specimens underwent temperature changed from $5^{\circ}C$ to $55^{\circ}C$ a thousand times. After thermocycling, speciemens were placed in 2 % methylene blue dye solution for 24 hours in an incubator set at $37^{\circ}C$. The teeth were sectioned buccolingually and the degree of dye penetration was observed with a stereomicroscoped(*20). The following results were obtained. 1. Both the control and the experimental group showed a lower degree of dye penetration on enamel than on dentin margins(p<0.05) 2. Gluma exhibited a statistically significant lower degree of dye penetration than All-bond 2 on enamel margins(p<0.05) Scotchbond MP also exhibited a lower degree of dye penetration than All-bone 2 but was no statistically significant. Gluma and Scotchbond MP exhibited a similar degree of dye penetration. 3. The degree of dye penetration of All-bond 2, Gluma and Scotch bond MP showed no statistically singnificance on enamel margins but was significantly lower than in the control using Vitrebond. 4. All-bond 2 exhibited a statistically significant lower degree of dye penetration than Gluma on dentin margins. All- bond 2 and Scotchbond MP showed a similar degree of dye penetration. 5. The degree of dye penetration of All-bond 2, Gluma and Scotchbond MP showed no statistically significance on dentin margins. There was neither a statistical significance with the control.

• Journal of Powder Materials
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• v.20 no.2
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• pp.120-124
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• 2013

This study is carried out to develop the new process for the fabrication of ultra-fine electrodes on the flexible substrates using superhydrophobic effect. A facile method was developed to form the ultra-fine trenches on the flexible substrates treated by plasma etching and to print the fine metal electrodes using conductive nano-ink. Various plasma etching conditions were investigated for the hydrophobic surface treatment of flexible polyimide (PI) films. The micro-trench on the hydrophobic PI film fabricated under optimized conditions was obtained by mechanical scratching, which gave the hydrophilic property only to the trench area. Finally, the patterning by selective deposition of ink materials was performed using the conductive silver nano-ink. The interface between the conductive nanoparticles and the flexible substrates were characterized by scanning electron microscope. The increase of the sintering temperature and metal concentration of ink caused the reduction of electrical resistance. The sintering temperature lower than $200^{\circ}C$ resulted in good interfacial bonding between Ag electrode and PI film substrate.