• 제목/요약/키워드: Bonding system

검색결과 874건 처리시간 0.03초

와이어 본딩용 트랜스듀서 혼의 진동 특성 (Vibration Characteristics of a Wire-Bonding Transducer Horn)

  • 임빛;한대웅;이승엽;안근식;강경완;김국환
    • 한국소음진동공학회:학술대회논문집
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    • 한국소음진동공학회 2007년도 추계학술대회논문집
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    • pp.583-588
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    • 2007
  • This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.

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화학제재를 이용한 우식상아질 제거효과 및 레진과의 결합강도에 관한 연구 (A STUDY OF THE EFFECT OF CHEMO-MECHANICAL CARIES REMOVAL SYSTEM ON THE REMOVAL OF CARIOUS DENTIN AND RESIN ADHESION TO DENTIN)

  • 강덕일;박인천;이난영;이상호;이창섭
    • 대한소아치과학회지
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    • 제30권4호
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    • pp.581-592
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    • 2003
  • 본연구는 유치와 영구치의 우식상아질을 제거하는 방법에 따른 상아질표면의 변화와 산부식양상, 혼성층의 양상, 그리고 이들이 상아질에 대한 복합레진의 전단결합강도에 미치는 영향을 평가할 목적으로 시행되었다. 92개의 유구치와 92개의 영구 구치를 준비하여 상아질 표면을 노출시키고 인공우식을 유발시켰다. 이중 32개의 유구치와 32개의 영구구치는 $Carisolv^{TM}$과 bur로 삭제후 상아질표면을 SEM관찰하였으며 나머지 치아에서는 레진-상아질간 전단결합강도를 측정하였다. 두가지 접착시스템(Single bond system, self-etching bonding system)과 한 종류의 레진(Z250, 3M)을 사용하였으며 다음과 같은 결과를 얻었다. 1. $Carisolv^{TM}$의 우식치질 제거효과는 영구치보다 유치에서 더 우수하였으며, bur로 제거한 경우보다 더 거친 상아질 표면이 관찰되었다. 2. 산부식처리한 경우 유치와 영구치 모두 우식제거방법과 관계없이 도말층이 제거된 양상을 보였다. 3. Single bond system을 이용한 경우 두터운 $2-4{\mu}m$의 혼성층과 $10-15{\mu}m$의 adhesive layer가 관찰된 반면, self-etching bonding system에서는 비교적 얇은($1-2{\mu}m$) 혼성층만이 형성되었다. 4. 전단결합강도는 유치와 영구치 모두 우식제거방법에 관계없이 Single bonding agent를 적용한 경우에 self-etching bonding agent를 적용한 군보다 유의하게 높게 나타났다(P<0.05). 5. $Carisolv^{TM}$와 self-etching bonding agent 처리군에서 bur와 self-etching system 처리군보다 다소 높은 전단결합강도를 보였으나 유의성은 없었다(P>0.05).

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자가부식 전처치제를 이용한 상아질 결합재의 미세 누출에 관한 연구 (COMPARISON OF MICROLEAKAGE OF NEW GENERATION DENTIN BONDING SYSTEM)

  • 김종수
    • 대한소아치과학회지
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    • 제26권1호
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    • pp.53-61
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    • 1999
  • Newley developed dentin bonding system which contains self-etching primer performed the removing of smear layer and etching procedure at once. So, it make possible more simple and shorter working time, the stronger bonding strength than conventional dentin bonding system. Cavities were prepared in the buccal and lingual surface of 30 extracted primary molars, and randomly assigned into three equal groups of 10 each. All cavities were filled with Z-100 composite resin following manufacturer's specifications after priming of three different dentin bonding system. Specimens stored for 7 days in 37 degree C water, thermocycled for 1000 cycles between 5 degree C and 55 degree C, immersed in 50% silvernitrate solution for 24 hours, and embedded in resin before being sectioned longitudinally. Data were analyzed by t-test and ANOVA. Mac-Bond II and Clearfil Linear-Bond II showed less microleakage at the occlusal and gingival margins compared to Scotchbond Multi Purpose. All dentin bonding systems showed significantly less microleakage at the occlusal margins compared to the gingival margins. But, there were no significantley difference between each group.

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EMTP를 이용한 지중케이블의 도체 연가 영향 분석 (EMTP-analysis of Transposition Effects on Underground Transmission Cables)

  • 하체웅;한성흠;허회덕;이인호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2006년도 제37회 하계학술대회 논문집 A
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    • pp.93-94
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    • 2006
  • The sheath of a single-conductor cable for ac service acts as a secondary of a transformer, the current in the conductor induces a voltage in the sheath. When the sheaths of single-conductor cables are bonded to each other, as is common practice for multi-conductor cables, the induced voltage causes current to flow in the completed circuit. This current causes losses in the sheath. Various methods of bonding may be used for the purpose of minimizing sheath losses. In korea, sheath cross bonding system was employed for the prevention of sheath losses, the sheaths wire subjected to at voltages, and the bonding was designed to keep the magnitude of the induced voltages within small limits so as to prevent the possibility of sheath corrosion. But, sheath cross bonding system without transposition of cable can not achieve an exact balance of induced sheath voltages unless the cables are lain in trefoil. This paper describes a transposition system with sheath cross bonding using EMTP(Electromagnetic Transient Program). The transposition system with cross bonding can be extended to longer cable circuits for laid in flat as wall as trefoil by the methods described in this paper.

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구리 질화막을 이용한 구리 접합 구조의 접합강도 연구 (Bonding Strength Evaluation of Copper Bonding Using Copper Nitride Layer)

  • 서한결;박해성;김가희;박영배;김사라은경
    • 마이크로전자및패키징학회지
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    • 제27권3호
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    • pp.55-60
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    • 2020
  • 최근 참단 반도체 패키징 기술은 고성능 SIP(system in packaging) 구조로 발전해 가고 있고, 이를 실현시키기 위해서 구리 대 구리 접합은 가장 핵심적인 기술로 대두되고 있다. 구리 대 구리 접합 기술은 아직 구리의 산화 특성과 고온 및 고압력 공정 조건, 등 해결해야 할 문제점들이 남아 있다. 본 연구에서는 아르곤과 질소를 이용한 2단계 플라즈마 공정을 이용한 저온 구리 접합 공정의 접합 계면 품질을 정량적 접합 강도 측정을 통하여 확인하였다. 2단계 플라즈마 공정은 구리 표면에 구리 질화막을 형성하여 저온 구리 접합을 가능하게 한다. 구리 접합 후 접합 강도 측정은 4점 굽힘 시험법과 전단 시험법으로 수행하였으며, 평균 접합 전단 강도는 30.40 MPa로 우수한 접합 강도를 보였다.

지중 전력 선로 편단접지 시스템에서의 병행지선 및 SVL 설치방안 (Installation Methodology of Parallel Ground Conductor and SVL for Single Point Bonding System on Underground Power Cable)

  • 하체웅
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 추계학술대회 논문집 전력기술부문
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    • pp.119-121
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    • 2008
  • In underground power cable system, the device for limiting over-voltage is needed when transient over-voltage break out between sheath and ground. For this reason, the SVL(Sheath Voltage Limiter) has been applied on weak points. But the broken SVLs which are installed on the single point bonding system on underground cable are frequently found. In this paper, EMTP(Electromagnetic Transient Program) is utilized to analyze effects on the installation methodology of the parallel ground conductor and SVL for the single point bonding system on the underground cable. The result shows that the proposed installation methodology can be applied for single point bonding system and contribute for power system stabilization.

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건축물의 등전위 본딩 및 전기적 연속성 평가 (Assessment of Equipotential Bonding and Electrical Continuity in Buildings)

  • 길형준;김동우;김동욱;이기연;문현욱;김향곤
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.385-386
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    • 2009
  • This paper deals with assessment of equipotential bonding and electrical continuity in Buinding by investigation on the spot at construction site. The assessment was carried out for continuity of steelwork in reinforced concrete structure, bonding conductor, protective conductor. A new grounding system based on international standards includes unity grounding system, structure grounding utilizing steel reinforced concrete, equipotential bonding, use of surge protective device.

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Bonding Performance of Adhesives with Lamina in Structural Glulam Manufactured by High Frequency Heating System

  • Kim, Keon-Ho;Kim, Se-Jong;Yang, Sang-Yun;Yeo, Hwanmyeong;Eom, Chang-Deuk;Shim, Kugbo
    • Journal of the Korean Wood Science and Technology
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    • 제43권5호
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    • pp.682-690
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    • 2015
  • The bonding performance of two types of wood adhesives, namely phenol-resorcinol-formaldehyde (PRF) resin and melamine-urea-formaldehyde (MUF) resin for glued laminated timber manufactured by high frequency (HF) heating was evaluated. The HF heating system consists of HF oscillator with dielectric heating system for curing adhesives, and hydraulic press system for clamping glued laminated timber. The designed frequency and output power of the HF system was as 5 MHz and 60 kW, respectively. To verify dielectric heating mechanism under HF oscillation, the heat loss factors of laminae and adhesives were measured. The results show that it is possible to selectively heat adhesives for their curing due to the remarkably higher loss factor of the adhesives than those of wood laminae. The temperature of adhesive in the bonding line reached up to the set temperature within a few seconds by high frequency oscillating, which advanced the curing of adhesive afterwards. The bonding performance, such as shear strength of bonding line, water soaking delamination, and boiling water soaking delamination of PRF resin met the requirement of Korean Standard (KS), however the MUF resin did not meet the KS requirement of boiling water soaking delamination. These results indicate that the HF heating system is successful to manufacture glued laminated timbers with PRF resins to meet the bonding requirements.

유치 상아질에 대한 수종의 상아질 결합제의 전단결합강도에 대한 연구 (THE STUDY ON SHEAR BOND STRENGTH OF VARIOUS DENTIN BONDING SYSTEMS IN PRIMARY DENTIN)

  • 강선희;이광희;김대업
    • 대한소아치과학회지
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    • 제32권2호
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    • pp.293-299
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    • 2005
  • 소아환자의 수복치료에서 시술시간과 시술과정을 줄이는 것은 중요한 점이다. 복합레진은 물성의 증가로 영구치, 유치 전치부 심미수복재로써 뿐만 아니라 구치부 수복에도 많이 쓰이고 있다. 최근에 개발된 7세대 상아질 결합제는 기존의 복합레진을 치면에 부착하기 위해 필요했던 산부식, 프라이밍, 접착제 도포의 복잡한 과정을 한번의 처리로 단순화하였다. 본 연구에서는 유치 상아질에서 7세대 상아질 결합제의 결합력을 기존에 사용되고 있는 여러 결합제의 결합력과 비교하였다. 1, 2, 3, 4군은 각각 4, 5, 6, 7세대 상아질 결합제를 사용하였다. 유치 상아질을 노출시키고 군에 따라 상아질 면을 처리한 후에 직경 2.5mm, 높이 2.0mm의 주형을 이용하여 복합레진을 접착시키고 열순환을 시행한 다음 전단결합강도를 측정하여 다음과 같은 결론을 얻었다. 1. 5세대 상아질 결합제인 Clearfil SE Bond가 가장 높은 전단결합강도인 $27.87{\pm}5.33\;MPa$를 보였다. 이것은 4, 6, 7세대와 비교했을 때 통계학적으로 유의하였다. 2. 4세대 상아질 결합제의 전단결합강토는 $20.11{\pm}5.73\;MPa$로 6, 7세대보다는 약간 높게 나타났지만 통계적으로 유의한 차이는 보이지 않았다. 3. 6, 7세대 상아질 결합제의 전단결합강도는 유사하게 나타났다.

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지중송전 시스템의 병행지선 설치 방안 연구 (Methodology of Parallel Ground Conductor Installation on Underground Transmission System)

  • 홍동석;박성민;한광현
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 제39회 하계학술대회
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    • pp.470-471
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    • 2008
  • SVL is installed at underground transmission system to protect cables and insulation joint-box from overvoltages caused by lightning, switching, and line-to-ground fault. Domestic underground power system adopts cross bonding type to reduce the induced voltage at sheath, but single-point bonding is required depending the system installation configuration. SVL can be easily broken by overvoltages induced at joint-box because single-point bonding has uneffective system structure to extract fault current. ANSI/IEEE recommends Parallel Ground Continuity Conductor(PGCC) to prevent SVL breakdown. In this paper, EMTP simulation is performed to analyze effects on SVL under PGCC installation when single-line-to-ground fault occurs. The result shows that PGCC and short single-point bonding distance can reduce overvoltages at SVL.

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