• The Journal of Korean Academy of Prosthodontics
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• v.36 no.1
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• pp.26-49
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• 1998

The purpose of this study was to confirm the formation of hybrid layer and resin tags in dentin tissue and the possibility of bonding between luting cements used for the prosthesis and the resinous surface coated with resin bonding agents to prevent the dentin hypersensitivity after abutment preparation. Some resin bonding agents, which may have the possibility of bonding with polyacrylic acid as a liquid ingredient of polycarboxylate and glass ionomer cements, were selected. All-Blond desensitizer containing NTG-GMA and BPDM, Scotch-Bond Multipurpose plus containing HEMA, and XR-bond containing organophosphate were selected as a coating agent. Dental cements were zinc phosphate, polycarboxylate, and glass ionomer cement. After the exposed dentin surface of premolars was ethced with 10% phosphoric acid and coated with resin bonding agents, the morphology of treated surfaces and the resin tags and hybrid layers on sectioned surfaces were observed by SEM. Shear bond strength between the resin bonding agents and 3 kinds of cements was measured 24 hours after bonding. On the debonded surfaces of the shear bond strength tested specimens, the cement tags and the bonding sites between the resin materials and cements were examined by SEM. Following conclusions were drawn : 1. Coating of dentin with resin bonding agents had no effect on the shear bond strength of zinc phosphate cement. 2. Both of polycarboxylate and glass ionomer cements showed the increased shear bond strength by the dentinal coating with Scotch-Bond Multipurpose plus containing HEMA. However, in the case of dentinal coating with some agents containing NTG-GMA and BPDM or organophosphate, polycarboxylate cement exhibited the lowered shear bond strength, and glass ionomer cement showed the unchanged shear bond strength. 3. Complete obstructions of dentinal tubules were observed on the dentin coated with All-Bond desensitizer or XR-bond, but distinct shape of the orifices of dentinal tubules was observed consistently on the dentin coated with Scotch-Bond Multipurpose plus. 4. The hybrid layer was thickest on the dentin coated with All-Bond desensitizer, and the length of resin tags was longest on the dentin coated with Scotch-Bond Multipurpose plus. 3. On the debonded specimens which had been bonded with polycarboxylate cement or glass ionomer cement after coating with Scotch-Bond Multipurpose plus, the cement tags and the bonding sites between the resinous surface and the cements could be examined.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2006.04a
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• pp.836-840
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• 2006

Design optimization of layered plates bonding process is conducted to achieve high product quality by considering uncertainties in a manufacturing process. During the cooling process of the sequential sub-processes, different thermal expansion coefficients lead to residual stress and displacement. thus resulting in defects on the surface of the adherent. So robust process optimization is performed to minimize the residual stress mean and variation of the assembly while constraining the distortion as well as the instantaneous maximum stress to the allowable limits. In robust process optimization, the dimension reduction (DR) method is employed to quantify both reliability and quality of the layered plate bonding. Using this method. the average and standard deviation is estimated. Response surface is constructed using the statistical data obtained by the DRM for robust objectives and constraints. from which the optimum solution is obtained.

• Laser Solutions
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• v.8 no.3
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• pp.21-26
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• 2005

A bonding process between tape-carrier package and a glass panel with anisotropic conductive film (ACF) has been investigated by making use of high power diode laser as a heat source for cure. The results from modeling of process and from optical properties of layers showed that heat absorbed from polyimide film surface and ACF layer is dominant source of curing during laser illumination. Laser ACF bonding has better bonding quality than conventional bonding in view of peel strength, flatness, pressure unbalance and processing time. New ACF bonding processes by making use of high power diode laser are proposed.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.171-171
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• 2008

본 연구는 초음파 알루미늄 웨지 및 금 볼 본딩을 동시에 적용 가능한 본딩 Pad의 금속학적 안정성을 고려한 표층전극 형성 방법에 관한 것이다. 특히, 이동통신 및 전장용 모듈의 복합 및 융합화로 LTCC기판 패키징에 있어서 다양한 본딩 기술이 요구되고 있다. 전통적인 interconnection 기술인 Au ball 본딩 및 초음파 에너지를 이용한 Al wedge 본딩 기술이 동시에 사용되어야 하는 패키지 구조의 경우 본딩 패드의 표층전극 설계는 서로 상충되는 조건이 요구된다. 따라서, 본 연구에서는 LTCC기판의 표층전극의 Metal finish 방법으로 이용되는 ENEPIG(무전해 Ni/Pd/Au도금)공법으로 Au ball 본딩 및 초음파 Al wedge 본딩을 동시에 가능하게 하는 solution을 제시하여 패키징 자유도뿐만 아니라 Interconnection 신뢰성을 확보할 수 있었다.

• Advances in materials Research
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• v.8 no.1
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• pp.1-10
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• 2019

Roll bonding (RB) process of bi-metal laminates as a new noble method of bonding has been widely used in the production of bimetal laminates. In the present study, asymmetric roll bonding process as a new noble method has been presented to produce Al/Cu bimetallic laminates with the thickness reduction ratios 10%, 20% and 30% together with mismatch rolling diameter ($\frac{R_2}{R_1}$) ratio 1:1, 1:1.1 and 1:1.2. ABAQUS as a finite element simulation software was used to model the deformation of samples. The main attention in this study focuses on the bonding properties of Al/Cu samples. The effect of the $\frac{R_2}{R_1}$ ratios was investigated to improve the bond strength. During the simulation, for samples produced with $\frac{R_2}{R_1}=1:1.2$, the vertical plastic strain of samples was reach the maximum value with a high quality bond. Moreover, the peeling surface of samples after the peeling test was investigated by the scanning electron microscopy (SEM).

• Restorative Dentistry and Endodontics
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• v.25 no.4
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• pp.550-560
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• 2000

In this study, shear bond strength of two bonding systems were measured and appearance of dentin surfaces were observed with SEM according to the storage time of eugenol on dentin surface, thus evaluated the effect of eugenol on bond strength of two dentin bonding systems. Control groups were directly bonded to dentin surface with One Step, Prime & Bond 2.1. Experimental groups were divided into experimental I and II according to dentin bonding agents. After eugenol application, dentin surfaces were bonded with One Step and Prime & Bond 2.1 according to the each storage time of immediately, 3min, 24hour, 48hour and 1week, and then control and experimental groups were filled with light cured composite resin(Z-100). After 24 hours water storage at $37^{\circ}C$, all samples were subjected to a shear load to fracture at a cross head 1.0mm/min with Instron universal testing machine(No. 4467). Etched dentin surface storaged for each time of immediately, 3min, 24hour, 48hour and 1 week after eugenol application were observed under Scanning Electron Microscope(Hitachi S-2300) at 20kvp. The data were evaluated statistically with two-way ANOVA and Tukey's HSD. The results were as follows; 1. Shear bond strengths were higher in control groups than in the experimental groups. 2. As storage time was increased after eugenol application, the shear bond strengths were decreased in experimental groups. 3. In experimental I, II the shear bond strengths were the lowest in which storage time was 1 week after eugenol application. 4. As storage time was increased after eugenol application, etched dentin surfaces showed obstructed dentinal tubule.

• Restorative Dentistry and Endodontics
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• v.28 no.3
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• pp.203-208
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• 2003

The purpose of this study was to evaluate the effect of salivary contamination of teeth on bonding efficacy of self-priming and self-etching DBSs. The materials used were Single Bond(SB, self-priming system, 3M), Unifil Bond(UB, self-etching system, GC), and Scotchbond Multi-Purpose Plus(SM, 3M) as control. Forty five human molars randomly allocated to three groups as dentin bonding systems tested and embedded in epoxy resin. Then the specimens were wet-ground to expose flat buccal enamel surface or flat occlusal dentin surface and cut bucco-lingually to form two halves with slow speed diamond saw. One of them was used under non-contamination, other under contamination with saliva. The bonding procedure was according to the manufacturer's directions and resin composite(Z-100, 3M Dental Products, St. Paul, MN) was built-up on the bonded surface 5mm high. The specimens were ground carefully at the enamel-composite interface with fine finishing round diamond bur to create an hour-glass shape yielding bonded surface areas of $1.5{\pm}0.1\textrm{mm}^2$. The specimens were bonded to the modified microtensile testing apparatus with cyanoacrylate, attached to the universal testing machine and stressed in tension at a CHS of 1mm/min. The tensile force at failure was recorded and converted to a tensile stress(MPa). Mean values and standard deviations of the bond strength are listed in table. One-way ANOVA was used to determine significant difference at the 95% level. The bond strength of SBMP and SB were not affected by salivary contamination, but that of UB was significantly affected by salivary contamination. These results indicate that DBSs with total etch technique seems less likely affected by salivary contamination in bonding procedure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• Restorative Dentistry and Endodontics
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• v.17 no.2
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• pp.421-430
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• 1992

The purpose of this study was to evaluate the bond strength between the composite resin and light - cured glass ionomer cement base / liners treated by the several methods. The light - cured glass ionomer cement(Vitrebond / Cavalite) were injected into cavites prepared in acrylic plates. One hundred and twenty specimens were uniformly prepared and devided into 3 groups. For the first group, primer was not applied to glass ionomer cement. For the second group, no application of primer was undertaken and light - curing procedure to uncured glass ionomer cement surface which was covered by bonding agent was undertaken. After bonding composite resin to light - cured glass ionomer surface, the specimens, were stored in $37^{\circ}C$, 100% humidity for 1 hour. The following results were obtained : 1. The omission of application of a primer did not produce a significantly poorer bond strength. 2. Light - curing technique to uncured glass ionomer cement which was covered by bonding agent did not produce a significantly poorer bonding strength. 3. The bond strength of Cavalite to composite resin was significantly higher than that of Vitrebond. 4. There was no significant difference between two different types of composite materials(Silux-Plus / Herculite XR) when it was applied to bond to glass ionomer cement.