• Title/Summary/Keyword: Bonding layer

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Application of Single Lap-Shear Test for Extracting Adhesive Bonding Strength of Coating Layer on Galvannealed sheet (합금화용융아연코팅강판의 코팅층 접합강도 평가를 위한 단일 겹치기이음 시험의 적용)

  • Lee, Jung-Min;Lee, Cha-Joo;Lee, Sang-Gon;Ko, Dae-Cheol;Kim, Byung-Min
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.238-243
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    • 2007
  • This paper is designed to estimate the adhesion strength of coating layer on galvannealed steel sheet using lap shear test. The single lap shear test is the most commonly used standard test for determining the strength of medium-strength and high strength bonds. The bond strength of bonded single lap joints on subjecting the substrates to loads is determined by lap shear forces in the direction of the bonded joint. In this study, specimen for adhesion strength test was made to attach coated sheet to cold rolled sheet and were heated in temperature of 180 for 20minutes. After test, detached parts of coatings on coated sheet were observed using SEM and EDX to identify substrate and complete detachment. The tested results showed that adhesive strength of coating is unrelated to anisotropy of sheet and is difficult to be extracted using conventional theory because of fine cracks of coating layers which were created during annealing process.

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A STUDY OF SURFACE ROUGHNESS OF COMPOSITE RESIN (복합레진의 표면조도에 관한 연구)

  • Park, Ki-Hyun
    • The Journal of Korean Academy of Prosthodontics
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    • v.38 no.1
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    • pp.108-115
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    • 2000
  • This study was designed to compare the effect of polishing on surface roughness of composite resin. We used Z100(3M) composite resin and placed the composite resin in the hole (4mm thick and 4mm in diameter) of vinyl plate and polymerized it under manufacturer's instructions. Samples were divided into 5 groups by polishing methods. Group 1 was control: resin was polymerized under glass plate, Group 2: resin was polymerized without any polishing procedure, Group 3: resin was polymerized with a polishing procedure of abrasive disc, Group 4: bonding agent was applyed in thin layer and polymerized on the polished polymerized resin surface. Group 5: resin was polymerized under transparent celluloid strip. The surface roughness of each specimen was measured with Sufacoder SEF-30D (Kosaka lab. Ltd) under 0.08mm cut off, 0.05mm/s stylus speed, ${\times}40$ horizontal magnification, ${\times}5000$ vertical magnification. The results were as follows : 1. Group 1 showed the most smooth surface in this study. 2. Group 3 showed more rough surface than Group 2. Considering the surface roughness, it would be better to make the shape completely before polymerize the resin. To finish and polish after the polymerization of resin makes less smooth surface. 3. When we use the transparent celluloid strip, minimum finishing procedures are recommended. Any polishing procedure could not recover the smooth resin surface of celluloid strip. 4. Application and polymerization of the thin layer of bonding agent on the polished surface showed the minimum surface smoothing effect.

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Ge thin layer transfer on Si substrate for the photovoltaic applications (Si 기판에서의 광소자 응용을 위한 Ge 박막의 Transfer 기술개발)

  • 안창근;조원주;임기주;오지훈;양종헌;백인복;이성재
    • Proceedings of the IEEK Conference
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    • 2003.07b
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    • pp.743-746
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    • 2003
  • We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer splitting of Ge, to transfer 700nm think, single-crystal Ge films to Si substrates. Optical and electrical properties have been also observed on these samples. Triple-junction solar cell structures gown on these Ge/Si heterostructure templates show comparable photoluminescence intensity and minority carrier lifetime to a control structure grown on bulk Ge. When heavily doped p$^{+}$Ge/p$^{+}$Si wafer bonded heterostructures were bonded, ohmic interfacial properties with less than 0.3Ω$\textrm{cm}^2$ specific resistance were observed indicating low loss thermal emission and tunneling processes over and through the potential barrier. Current-voltage (I-V) characteristics in p$^{+}$Ge/pSi structures show rectifying properties for room temperature bonded structures. After annealing at 40$0^{\circ}C$, the potential barrier was reduced and the barrier height no longer blocks current flow under bias. From these observations, interfacial atomic bonding structures of hydrophobically wafer bonded Ge/Si heterostructures are suggested.ested.

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Performance of steel beams strengthened with pultruded CFRP plate under various exposures

  • Gholami, M.;Sam, A.R. Mohd;Marsono, A.K.;Tahir, M.M.;Faridmehr, I.
    • Steel and Composite Structures
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    • v.20 no.5
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    • pp.999-1022
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    • 2016
  • The use of Carbon Fiber Reinforced Polymer (CFRP) to strengthen steel structures has attracted the attention of researchers greatly. Previous studies demonstrated bonding of CFRP plates to the steel sections has been a successful method to increase the mechanical properties. However, the main limitation to popular use of steel/CFRP strengthening system is the concern on durability of bonding between steel and CFRP in various environmental conditions. The paper evaluates the performance of I-section steel beams strengthened with pultruded CFRP plate on the bottom flange after exposure to diverse conditions including natural tropical climate, wet/dry cycles, plain water, salt water and acidic solution. Four-point bending tests were performed at specific intervals and the mechanical properties were compared to the control beam. Besides, the ductility of the strengthened beams and distribution of shear stress in adhesive layer were investigated thoroughly. The study found the adhesive layer was the critical part and the performance of the system related directly to its behavior. The highest strength degradation was observed for the beams immersed in salt water around 18% after 8 months exposure. Besides, the ductility of all strengthened beams increased after exposure. A theoretical procedure was employed to model the degradation of epoxy adhesive.

Bond-slip constitutive model of concrete to cement-asphalt mortar interface for slab track structure

  • Su, Miao;Dai, Gonglian;Peng, Hui
    • Structural Engineering and Mechanics
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    • v.74 no.5
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    • pp.589-600
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    • 2020
  • The bonding interface of the concrete slab track and cement-asphalt mortar layer plays an important role in transferring load and restraining the track slab's deformation for slab track structures without concrete bollards in high-speed railway. However, the interfacial bond-slip behavior is seldom considered in the structural analysis; no credible constitutive model has been presented until now. Elaborating the field tests of concrete to cement-asphalt mortar interface subjected to longitudinal and transverse shear loads, this paper revealed its bond capacity and failure characteristics. Interfacial fractures all happen on the contact surface of the concrete track slab and mortar-layer in the experiments. Aiming at this failure mechanism, an interfacial mechanical model that employed the bilinear local bond-slip law was established. Then, the interfacial shear stresses of different loading stages and the load-displacement response were derived. By ensuring that the theoretical load-displacement curve is consistent with the experiment result, an interfacial bond-slip constitutive model including its the corresponding parameters was proposed in this paper. Additionally, a finite element model was used to validate this constitutive model further. The constitutive model presented in this paper can be used to describe the real interfacial bonding effect of slab track structures with similar materials under shear loads.

Technique of Direct Copper to Glass Seal in an Evacuated Tube Solar Collector (진공관형 태양열 집열기의 구리-유리 직접 접합 기술)

  • Kim, Cheol-Young;Lim, Hyong-Bong;Cho, Nam-Kwon;Kwak, Hee-Youl
    • Journal of the Korean Ceramic Society
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    • v.43 no.9 s.292
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    • pp.544-551
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    • 2006
  • The sealing technique between a glass tube and a copper heat pipe in an evacuated tube solar collector is studied. In this study two different sealing techniques, such as flame method and furnace firing, are examined. After the sealing of a copper to a glass, the oxidation state of the copper and its bonding morphology were examined by SEM and XRD. Its oxidation was retarded by coating of borate solution on the copper, and $Cu_2O(cuprite)$ turned into CuO(tenorite) with increase in a firing temperature and firing time. Porous structure was found in the oxide layer when CuO formed. The best sealing morphology was observed when the thickness of the oxidation layer was less than $20{\mu}m$. The sealing technique performed in a furnace was promising and the satisfactory result was obtained when the sample was fired at $950^{\circ}C$ for 5 min under $N_2$ atmosphere. Annealing procedure is recommended to remove the stress left at the bonding zone.

Fabrication and Mechanical Characterization of the Mg-Zn-RE/Al1050 Clad Sheet (Mg-Zn-RE/Al1050 클래드재의 제조 및 기계적 특성)

  • Shin, Beomsoo;Yoon, Sockyeon;Ha, Changseong;Yun, Seungkwan;Bae, Donghyun
    • Korean Journal of Metals and Materials
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    • v.48 no.2
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    • pp.116-121
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    • 2010
  • The Mg-Zn-RE alloy cladded with the thin Al1050 sheet was fabricated by means of a roll bonding process at $280^{\circ}C$.Microstructures and mechanical properties of the clad sheets were investigated. After heat treatment at $230^{\circ}C$ for 30 min, an Mg-rich diffusion layer with about $2{\mu}m$ in thickness was developed at the Mg and Al interface. Tensile tests were carried out in a temperature range up to $300^{\circ}C$. The clad sheet exhibits superior elongation to failure not only at room temperature but also at elevated temperatures compared with those of the Mg alloy sheet. For the deformed specimens, interface debonding does not occur and the diffusion layer shows only a few cracks.

A study on the properties of SmBCO coated conductors with stabilizer tape (SmBCO 고온 초전도 선재의 안정화재 특성)

  • Kim, Tae-Hyung;Oh, Sang-Soo;Kim, Ho-Sup;Ko, Rock-Kil;Song, Kyu-Jeong;Ha, Hong-Soo;Lee, Nam-Jin;Park, Kyung-Chae;Ha, Dong-Woo
    • Progress in Superconductivity and Cryogenics
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    • v.9 no.3
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    • pp.9-12
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    • 2007
  • In this study. we searched for the mechanical and electrical properties of laminated coated conductors with stabilizer tape. Stabilizer tape plays a role for mechanical and electrical stability and environmental protection. Cu material stabilizer was laminated to Ag capping layer on SmBCO conductor layer. This architecture allows the wire to meet operational requirements including the stressless at cryogenic temperature and winding tension as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. First, we have experimentally studied mechanical bonding properties of the laminated Cu stabilizers on SmBCO coated conductors. We have laminated SmBCO coated conductors by continuous dipping soldering process, Second, we have investigated electrical properties of the SmBCO coated conductors with stabilizer lamination. We evaluated bonding properties, peeling strength and critical current for laminated SmBCO coated conductors with Cu stabilizers.

Microstructural Evolution of a Cold Roll-Bonded Multi-Layer Complex Aluminum Sheet with Annealing

  • Jo, Sang-Hyeon;Lee, Seong-Hee
    • Korean Journal of Materials Research
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    • v.32 no.2
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    • pp.72-79
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    • 2022
  • A cold roll-bonding process using AA1050, AA5052 and AA6061 alloy sheets is performed without lubrication. The roll-bonded specimen is a multi-layer complex aluminum alloy sheet in which the AA1050, AA5052 and AA6061 sheets are alternately stacked. The microstructural evolution with the increase of annealing temperature for the roll-bonded aluminum sheet is investigated in detail. The roll-bonded aluminum sheet shows a typical deformation structure in which the grains are elongated in the rolling direction over all regions. However, microstructural evolution of the annealed specimen is different depending on the type of material, resulting in a heterogeneous microstructure in the thickness direction of the layered aluminum sheet. Complete recrystallization occurs at 250 ℃ in the AA5052 region, which is lower by 100K than that of the AA1050 region. Variation of the misorientation angle distribution and texture development with increase of annealing temperature also differ depending on the type of material. Differences of microstructural evolution between aluminum alloys with increase of annealing temperature can be mainly explained in terms of amounts of impurities and initial grain size.

An Effective Approach of Equivalent Elastic Method for Three-Dimensional Finite Element Analysis of Ceramic Honeycomb Substrates (세라믹 하니컴 담체의 3차원 유한요소해석을 위한 등가탄성방법의 효과적인 접근)

  • Baek, Seok-Heum;Cho, Seok-Swoo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.3
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    • pp.223-233
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    • 2011
  • A ceramic monolithic catalyst is a honeycomb structure that consists of two layers. The honeycomb structure is regarded as a continuum in structure and heat-flow analysis. The equivalent mechanical properties of the honeycomb structure were determined by performing finite element analysis (FEA) for a test specimen. Bending strength experiments and FEA of the test specimen used in ASTM C1674-08 standard test were performed individually. The bonding coefficient between the cordierite ceramic layer and the washcoat layer was almost zero. The FEA test specimen was modeled on the basis of the bonding coefficient. The elastic modulus, Poisson's ratio, and the thermal properties of the ceramic monolithic substrate were determined by performing the FEA of the test specimen.