• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.135-142
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• 2024

Cu-Cu bonding, one of the key technologies in advanced packaging, enhances semiconductor chip performance, miniaturization, and energy efficiency by facilitating rapid data transfer and low power consumption. However, the quality of the interface bonding can significantly impact overall bond quality, necessitating strategies to quickly detect and classify in-process defects. This study presents a methodology for detecting defects in wafer junction areas from Scanning Acoustic Microscopy images using a ResNet-50 based deep learning model. Additionally, the use of the defect map is proposed to rapidly inspect and categorize defects occurring during the Cu-Cu bonding process, thereby improving yield and productivity in semiconductor manufacturing.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.1 s.256
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• pp.113-120
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• 2007

Design optimization of layered plates bonding process is conducted by considering uncertainties in a manufacturing process, in order to reduce the crack failure arising due to the residual stress at the surface of the adherent which is caused by different thermal expansion coefficients. Robust optimization is peformed to minimize the mean as well as its variance of the residual stress, while constraining the distortion as well as the instantaneous maximum stress under the allowable reliability limits. In this optimization, the dimension reduction (DR) method is employed to quantify the reliability such as mean and variance of the layered plate bonding. It is expected that the DR method benefits the optimization from the perspectives of efficiency, accuracy, and simplicity. The obtained robust optimal solution is verified by the Monte Carlo simulation.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1267-1269
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• 1997

본 논문에서는 SDB(Silicon Direct Bonding) 기술을 적용하여 빠른 스위칭 속도 및 낮은 도통 전압을 갖는 1200v 10A n-ch IGBT를 제작하였다. 기존의 epi wafer를 이용한 IGBT 제작시 스위칭 속도 개선을 위한 전자조사 방법을 사용하지 않고 buffer의 농도를 증가시켜 아노드 영역의 정공 주입 효율을 제어하여 90ns의 스위칭 속도를 가지며, 2.0V의 도통전압을 갖는 IGBT를 구현하였으며, SDB IGBT 제작시 bonding 계면의 문제 및 표면의 particle 및 결함이 소자의 전기적 특성에 미치는 영향을 고찰하였으며, 이를 실험 결과와 비교 평가하였다.

• Composites Research
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• v.24 no.6
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• pp.56-63
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• 2011

The objective of this study is to investigate appropriate bonding methods of solar cells in order to apply solar cells, which have been receiving particular attention as a renewable energy due to fossil energy depletion and environment issues, to composite structures. Back-contact solar cells with approximately 24.2% energy conversion efficiency were used in this study. Since silicon-based solar cells are mechanically fragile, the secondary-bonding methods using adhesive were examined in this study. The experiment was conducted with three kinds of bonding materials such as EVA film, Resin film and elastic adhesive. The performance of solar cells for three types of adhesives under mechanical loading on test specimens is conducted. In addition, the measuring equipment was designed to evaluate the performance of the solar cells under mechanical loading in real time and the fracture characteristics depending on bonding materials were evaluated. The reason decreasing solar cells efficiency were analyzed and considered by Fractography. The results show that the solar cell performance is largely affected by bonding techniques. Moreover, the bonding method using elastic adhesive shows best solar cell efficiency.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.152-155
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• 2003

The automotive industry is currently trying to develop light- weight vehicle for both improvement of fuel efficiency and reduction of environmental pollution. For the reduction of vehicle weight, the substitution of aluminum for steel has been increased. However, the change of material causes a significant problem with respect to the method of joining. In this paper, strength of several aluminum joining methods such as spot welding, metal insert gas(MIG) welding, adhesive bonding was evaluated by performing lap test.

• Journal of Sericultural and Entomological Science
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• v.41 no.3
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• pp.205-210
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• 1999

Silk nonwoven fabrics are prepared by needle punching and thermal bonding with silk waste. To enhance the carding efficiency, the degumming rate was controlled with sodium hydrogen sulfite solution. The amount of the remained sericin was 3%(S-3), and 6%(S-6). Mixing wool and LMP(Low melting polyester) with the silk, to improve carding efficiency, was also effective. Following items were tested with prepared silk nonwovon fabrics : weight, thickness, compression, tensile strength, heat insulation, water absorption, and deodorization. The results show that the silk nonwoven fabrics could be used for apparels and new biomaterials.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.24-27
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• 2009

Solid-state dye-sensitized solar cells (DSSCs) have been constructed employing supramolecular electrolytes with multiple hydrogen bonding. A supramolecule was facilely synthesized by one-pot reaction between the amines of methyl isocytosine (MIC) and the epoxy groups of poly(ethylene glycol diglycidyl ether) (PEGDGE) to produce quadruple hydrogen bonding units. Hydrogen bonding interactions and dissolution behavior of salt in supramolecular electrolytes are investigated. The ionic conductivity of the supramolecular electrolytes with ionic liquid, i.e. 1-methyl-3-propylimidazolium iodide (MPII) reaches $8.5{\times}10^{-5}$ S/cm at room temperature, which is higher than that with metal salt (KI). A worm-like morphology is observed in the FE-SEM micrographs of $TiO_2$ nanoporous layer, due to the connection of $TiO_2$ nanoparticles resulting from adequate coating by electrolytes. DSSCs employing the supramolecular electrolytes with MPII and KI exhibit an energy conversion efficiency of 2.5 % and 0.5 %, respectively, at 100 $mW/cm^2$, indicating the importance of the cation of salt. Solar cell performances were further improved up to 3.7 % upon introduction of poly(ethylene glycol dimethyl ether) (PEGDME) with 500 g/mol.

• Information and Communications Magazine
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• v.16 no.5
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• pp.114-127
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• 1999

Telecommunications provisions of the interior of a country which are established only for a voice service are inefficient in various rule of grounding and bonding that are not concerned with services. It is a essential part for planning out a efficiency when employing telecommunication, researching and writing standards bout grounding and bonding of materials that are established in telecommunication to consider reliability of telecommunication equipment for a wideband and high speed service. Therefore we investigated present conditions and problems of domestic grounding and observed foreign technical standards related to several grounding and bonding. The foreign technical standards are compared with the domestic immature parts. As a result, presenting a domestic technical standards about grounding and bonding fitted to telecommunicateion provision when building is constructed or reconstructed, all parts related to this can be given the efficiency and the generality to provide system which has reliability.

• Korean Journal of Materials Research
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• v.24 no.5
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• pp.236-242
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• 2014

Fabrication of reaction-bonded $Al_2O_3$ (RBAO) ceramics using Al-Zn-Mg alloy powder was studied in order to improve traditional RBAO ceramic processing using Al powder. The influence on reaction-bonding and microstructure, as well as on physical and mechanical properties, of the particulate characteristics of the $Al_2O_3$-Al alloy powder mixtures after milling, was revealed. Variation of the particulate characteristics of this $Al_2O_3$-Al alloy powder mixture with milling time was reported previously. To start, the $Al_2O_3$-Al alloy powder mixture was milled, reaction-bonded, post-sintered, and characterized. During reaction-bonding of the $Al_2O_3$-Al alloy powder mixture compacts, oxidation of the Al alloy took place in two stages, that is, there was solid- and liquid-state oxidation of the Al alloy. The solid-state oxidation exhibited strong dependence on the density of surface defects on the Al-alloy particles formed during milling. Higher milling efficiency resulted in less participation of the Al alloy in reaction-bonding. This was because of its consumption by chemical reactions during milling, and subsequent powder handling, and could be rather harmful in the case of over-milling. In contrast to very little dependence of oxidation of the Al alloy on its particle size after milling, the relative density, microstructure, and flexural strength were strongly dependent on particle size after milling (i.e., on milling efficiency). The relative density and 4-point flexural strength of the RBAO ceramics in this study were ~98% and ~365 MPa, respectively, after post-sintering at $1,600^{\circ}C$.