• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.04a
• /
• pp.42-42
• /
• 2008

Considerable attention has been focused on the applications of flexible liquid crystal (LC)-based displays because of their many potential advantages, such as portability, durability, light weight, thin packaging, flexibility, and low power consumption. To develop flexible LCDs that are capable of delivering high-quality moving images, like conventional glass-substrate LCDs, the LC device structure must have a stable alignment layer of LC molecules, concurrently support uniform cell gaps, and tightly bind two flexible substrates under external tension. However, stable LC molecular alignment has not been achieved because of the layerless LC alignment, and consequently high-quality images cannot be guaranteed. To solve these critical problems, we have proposed a PDMS pixel-wall based bonding method via the IB irradiation was developed for fasten the two substrates together strongly and maintain uniform cell gaps. The effect of the IB irradiation on PDMS with PI surface was also evaluated by side structure configuration and a result of x-ray photoelectron spectroscopic analysis of PDMS interlayer as a function of binder with substrates. large number of PDMS pixel-walls are tightly fastened to the surface of each flexible substrate and could maintain a constant cell gap between the LC molecules without using any other epoxy or polymer. To enhance the electro-optical performance of the LC device, we applied an alignment method that creates pretilt angle on the PI surface via ion beam irradiation. Using this approach, our flexible LCDs have a contrast ratio of 132:1 and a response time of about 15 ms, resulting in highly reliable electro-optical performance in the bent state, comparable to that of glass-substrate LCDs.

• Journal of the Korean Society for Precision Engineering
• /
• v.31 no.9
• /
• pp.831-838
• /
• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Journal of the Korean Society for Nondestructive Testing
• /
• v.16 no.2
• /
• pp.79-85
• /
• 1996

Prediction of fatigue life and monitoring of fracture process for adhesively bonded CFRP composites joint have been investigated by analysis of acoustic emission signals during the fatigue and tension tests. During fatigue test, generated acoustic emission is related to stored elastic strain energy. By results of monitoring of AE event rate, fatigue process could be divided into two regions, and boundaries of two regions, fatigue cycles of the initiation of fast crack growth, were 70-80% of fatigue life even though the fatigue life were highly scattered from specimen to specimen. The result shows the possibility of predicting catastrophic failure by acoustic emission monitoring.

• Journal of Ocean Engineering and Technology
• /
• v.13 no.3 s.33
• /
• pp.77-82
• /
• 1999

The compleete joining method for dissimilar hot die punch materials and its real-time evaluation method are not available at present. Brazing method has been used for joining them, but it is known that the welded joint by the brazing has the lower bonding efficiency and reliability than the diffusion welding. The friction wleding with a diffusion mechanism in bonding was applied in this study. So, this work was carried out to determine the optimal friction welding conditions and to analyze mechanical properties of friction welded joints of hot die punch materials (STD61 for the blade part of hot die punch) to alloy steel (SCM440 for the shank park of hot die punch) such as plunger. In addition, acoustic emission test was carried out during friction welding to evaluate the weld quality.

• Steel and Composite Structures
• /
• v.37 no.4
• /
• pp.419-429
• /
• 2020

Composite structures are generally pressurized at both sides when repaired by the scarf repair method. But single-face vacuum bag curing (SVC) may be used in some practical scarf repair of penetration damage due to the low accessibility of composite structures, which can decrease bonding quality and may reduce structural mechanical properties. In this paper, experimental investigations were conducted on tensile and compressive properties of scarf-repaired composite laminates using SVC and double-face vacuum bag curing (DVC) in four hygrothermal environments. Finite element models of composite scarf joints with voids were established to further explore the failure mechanism of scarf-repaired laminates. Results show that the curing condition hardly affects tensile and compressive properties of the repaired laminates though it significantly affects the bonding quality with adhesive inner voids. Failure loads of scarf joints almost keep unchanged with adhesive voids increasing.

• Journal of Korea Foundry Society
• /
• v.22 no.4
• /
• pp.174-183
• /
• 2002

Twin-roll process is a relatively new continuous casting process which can produce high-quality strip products directly, and solidification rate can reach $10^3$ to $10^4$ K/s, leading to fine and uniform microstructures with enhanced mechanical properties. The strip casting condition for producing fine Al-Sn alloy strip was obtained experimentally, and defects appearing on the strip was examined. Crack formation and surface quality of the strip was found to depend mainly on process parameters such as melt temperature, roller gap and rolling speed. Sn structure of network type was observed in Al-20Sn and Al-40Sn alloy strips, and cell spacing of Al-40Sn alloy was smaller than that of Al-20Sn. Banding strength of the heat treated specimens increased with increasing of soaking time and temperature, and bonding strength of Al-20Sn alloy was more superior than that of Al-40Sn alloy. However wear resistance of Al-40Sn alloy contained large amount of soft Sn which possess good anti-friction characteristics was superior than that of Al-20Sn alloy.

• Proceedings of the KWS Conference
• /
• 2002.10a
• /
• pp.402-407
• /
• 2002

Laminate tooling process is a fast and simple method to make metal tools directly for various molding processes such as injection molding in rapid prototyping field. Metal sheets are usually cut, stacked, aligned and joined with brazing or soldering. Through the joining process, all of the metal sheet layers should be rigidly joined. When joining process parameters are not appropriate, there would be defects in the layers. Among various types of defects, non-bonded gaps of the tool surface are of great importance, because they directly affect the surface quality and dimensional accuracy of the final products. If a laminate tool with defects has to be abandoned, it could lead to great loss of time and cost. Therefore a repair method for non-bonded gaps of the surface is essential and has important meaning for rapid prototyping. In this study, a rapid laminate tooling system composed of a CO2 laser, a furnace, and a milling machine was developed. Metal sheets were joined by furnace brazing, dip soldering and adhesive bonding. Joined laminate tools were machined by a high-speed milling machine to improve surface quality. Also, repair brazing and soldering methods of the laminates using the $CO_2$ laser system have been investigated. ill laser repair process, the beam duration, beam power and beam profile were of great importance, and their effects were simulated by [mite element methods. The simulation results were compared with the experimental ones, and optimal parameters for laser repair process were investigated.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.30 no.8
• /
• pp.479-483
• /
• 2017

The effect of $NH_3$ plasma treatment on device characteristics was confirmed for an optimized thin film transistor of poly-Si formed by ELA. When C-V curve was checked for MIS (metal-insulator-silicon), Dit of $NH_3$ plasma treated and MIS was $2.7{\times}10^{10}cm^{-2}eV^{-1}$. Also in the TFT device case, it was decreased to the sub-threshold slope of 0.5 V/decade, 1.9 V of threshold voltage and improved in $26cm^2V^{-1}S^{-1}$ of mobility. Si-N and Si-H bonding reduced dangling bonding to each interface. When gate bias stress was applied, the threshold voltage's shift value of $NH_3$ plasma treated device was 0.58 V for 1,000s, 1.14 V for 3,600s, 1.12 V for 7,200s. As we observe from this quality, electrical stability was also improved and $NH_3$ plasma treatment was considered effective for passivation.

• Korean Journal of Materials Research
• /
• v.15 no.9
• /
• pp.613-619
• /
• 2005

The ever increasing popularity and acceptance in the market place of portable systems, such as cell phones, PDA, notebook PC, etc., are fueling effects in further miniaturizing and lowering power consumption in these systems. The dynamic power consumption due to the CPU activities and the static power consumption due to leakage currents are two major sources of power consumption. Smaller devices and a lower de voltage lead to reducing the power requirement, while better insulation and isolation of devices lead to reducing leakage currents. All these can be harnessed in the SOI (silicon-on-insulator) technology. In this study, the key aspects of the SOI technology, mainly device electrical properties and device processing steps, are briefly reviewed. The interesting materials issues, such as SOI structure formation and SOI wafer fabrication methods, are then surveyed. In particular, the recent technological innovations in two major SOI wafer fabrication methods, namely wafer bonding and SIMOX, are explored and compared in depth. The results of the study are nixed in that, although the quality of the SOI structures has shown great improvements, the processing steps are still found to be too complex. Between the two methods, no clear winner has yet emerged in terms of the product quality and cost considerations.

• Restorative Dentistry and Endodontics
• /
• v.32 no.5
• /
• pp.426-436
• /
• 2007

The objective of this study is to evaluate the effect of an additional application of bonding resin on the bond strength of resin luting cements in both the light-cure (LC) and self-cure (SC) modes by means of the ${\mu}TBS$ tests. Three combinations of One-Step Plus with Choice, Single Bond with Rely X ARC, and One-Up Bond F with Bistite II were used. D/E resin and Pre-Bond resin were used for the additional application. Twelve experimental groups were made. Three mandibular $3^{rd}$ molars were used in each group. Indirect composite blocks were cemented on the tooth surface. $1\;{\times}\;1\;mm^2$ dentin-composite beam for ${\mu}TBS$ testing were made and tested. When total-etching dentin adhesives were used, an additional application of the bonding resin increased the bond strength (P < 0.05). However, this additional application didn't influence the bond strength of self-etching dentin adhesives (P > 0.05). In conclusion, the results suggest that an additional application of the bonding resin increases bond strength and enhances quality of bonding when using total-etching dentin adhesives.