• The Journal of the Convergence on Culture Technology
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• v.4 no.3
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• pp.209-212
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• 2018

Anisotropic conductive film(ACF) bonding is widely used for making fine interconnections between two different materials where soldering is not easily applicable. There are three constraints for the successful implementation of ACF bonding. A bonding contact should be pressed by a hot head with the right pressure and temperature for a pre-defined curing time. In this paper, a method for ACF bonding based on machine vision system is proposed and verified through some experiments. The system calculates the position and orientation of printed circuit boards(PCBs) on a bonding table and estimates the optimal hitting point where the hot head should be applied. Experimental results show that the proposed system achieves better adhesive strength by providing head flatness over contact surfaces.

• Journal of the Korean Geosynthetics Society
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• v.6 no.1
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• pp.39-43
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• 2007

Geocomposites of needle punched and spunbonded nonwovens having the reinforcement and drainage functions were manufactured by use of thermal bonding method. The physical properties (e.g. tensile, tear and bursting strength, permittivity) of these multi-layered nonwovens were dependent on the processing parameters of temperatures, pressures, bonding periods etc. - in manufacturing by use of thermal bonding method. Therefore, it is very meaningful to optimize the processing parameters and physical properties of the geocomposites by thermal bonding method. In this study, an algorithm has been developed to optimize the process of the geocomposites using an artificial neural network (ANN). Geocomposites were employed to examine the effects of manufacturing methods on the analysis results and the neural network simulations have been applied to predict the changes of the nonwovens performances by varying the processing parameters.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4756-4762
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• 2014

Damaged wind turbine blades are repaired conventionally using a hand lay-up method with epoxy, where the bonding strength is not high. Epoxy has poor curing characteristics at low temperatures. The infusion method with polyester was proposed. Infusion method is believed to distribute resin uniformly. Polyester is used because it hardens better than epoxy at low temperatures. At room temperature, the proposed method increased the bonding strength by 77.7% compared to the conventional method. Using the proposed method at 15 and $5^{\circ}C$, the bonding strength increased compared to the conventional method. This paper proposes a new method for repairing wind turbine blades, even at temperatures where the conventional method cannot be used because epoxy resin does not harden. The bonding strength of the proposed method at low temperatures is higher than that of the conventional method at room temperature.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.05a
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• pp.250-253
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• 2001

Mechanical properties of gold bonding wire for VLSI packaging have been studied. The diameters of gold wires are about 20-30 micrometer and fracture loads are 8-20 gram force. The elastic modulus, yield strength, fracture strength and elongation properties have been evaluated by micro-tensile test method. This work discusses for an appropriate selection of micro-force testing system and grip design in mim testing. The best method to determine gauge length of wire and to measure tensile properties has been proposed. The mechanical properties such as strength and elastic modulus of current gold bonding wire are higher than pure those of gold wire.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.9
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• pp.98-105
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• 1995

Recent microwave IC's reach to the extent of high operating frequencies at which bonding wires limit their performance as dominant parasitic components. Double bonding wires separated by an internal angle have been firstly characterized using the Method of Moments with the incorporation of the ohmic resistance calculated by the phenomenological loss equivalence method. For a 30$^{\circ}$ internal angle, the calculated total reactance is 45% less than that of a single bonding wire due to the negative mutual coupling effect. The radiation effect has been observed decreasing the mutual inductance, whereas for parallel bonding wires it greatly increases the mutual inductance. This calculation results can be widely used for designing and packaging of high frequency and high density MMIC's and OEIC's.

• Journal of Technologic Dentistry
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• v.33 no.1
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• pp.25-35
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• 2011

Purpose: There are some advantages of the acrylic resin denture base ; appropriate strength, volume safety, simple processing apparatus, and low cost. But, it have a weakness for fracture by intense pressure or shock. However, the repairs for resin denture base are possible using various materials and techniques. There is a few studies in repairs for resin denture base, but not clinical researches. And there is no studies in absorbed saliva into the region of fracture and bond strength. This study is to observe re-bond strength of resin denture base after repairing under saliva absorption. Methods: The samples were made of heat curing resin and the rectangular parallelepiped specimens which were 50mm long, 10mm wide and 3mm high. The four different groups immersed in the artificial saliva for 2 weeks were prepared, 1) no repaired control samples, 2) immediately repaired samples, 3) repaired samples after 1 day dry, and 4) repaired samples after 3 days dry. The prepared samples were repaired by two different curing materials, self curing resin and heat curing resin method. Each groups composed of 10 specimens were experimented with the three point bending tests for bonding strength measuring Results: There were under condition absorbed in the artificial saliva and repaired by self curing resin method, repaired specimens after 1 day and 3 days dry groups had higher values of bonding strengths than control group, and bonding strengths of immediately repaired samples were similar to those of control samples (p<0.05). There were under condition immersed in the artificial saliva and repaired by heat curing resin method, immediately repaired samples showed similar values to bonding strengths of control groups, and repaired samples after 1 day and 3 days dry groups were lower than those of control group (p>0.05). Conclusion: In this study, the repairs for resin denture base were remarkably high values of bonding strengths than those of the past, and showed that have stable bonding strengths independent of saliva absorption of denture base, so present repairs for resin denture base can be performed, regardless of saliva conditions.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• The Journal of Advanced Prosthodontics
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• v.9 no.5
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• pp.350-357
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• 2017

PURPOSE. The object of the present study was to evaluate the shear bonding strength of composite to PEKK by applying several methods of surface treatment associated with various bonding materials. MATERIALS AND METHODS. One hundred and fifty PEKK specimens were assigned randomly to fifteen groups (n = 10) with the combination of three different surface treatments (95% sulfuric acid etching, airborne abrasion with $50{\mu}m$ alumina, and airborne abrasion with $110{\mu}m$ silica-coating alumina) and five different bonding materials (Luxatemp Glaze & Bond, Visio.link, All-Bond Universal, Single Bond Universal, and Monobond Plus with Heliobond). After surface treatment, surface roughness and contact angles were examined. Topography modifications after surface treatment were assessed with scanning electron microscopy. Resin composite was mounted on each specimen and then subjected to shear bond strength (SBS) test. SBS data were analyzed statistically using two-way ANOVA, and post-hoc Tukey's test (P<.05). RESULTS. Regardless of bonding materials, mechanical surface treatment groups yielded significantly higher shear bonding strength values than chemical surface treatment groups. Unlike other adhesives, MDP and silane containing self-etching universal adhesive (Single Bond Universal) showed an effective shear bonding strength regardless of surface treatment method. CONCLUSION. Mechanical surface treatment behaves better in terms of PEKK bonding. In addition, self-etching universal adhesive (Single Bond Universal) can be an alternative bonding material to PEKK irrespective of surface treatment method.

• Transactions of the Korean Society of Automotive Engineers
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• v.10 no.3
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• pp.130-135
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• 2002

This study investigates the effect of curing method on the bonding strength of aluminum/CFRP composites. The surface of aluminum panel was treated by DC plasma. Lap shear tests and T-peel tests were performed based on the procedure of ASTM 906-94a and ASTMD1876-95, respectively. Test samples were fabricated by using the co-curing method and the secondary curing method. The results showed that the shear strength of test samples made by the co-curing method was 2.5 times greater than that of test samples made by the secondary curing method. The T-peel strength of the co-curing method case was almost 2 times greater than that of the secondary curing method case.